MCIMX6DP4AVT8AAR

IC MPU I.MX6DP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 565 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP4AVT8AAR – IC MPU I.MX6DP 852MHz 624FCBGA

The MCIMX6DP4AVT8AAR is an ARM® Cortex®-A9 based microprocessor IC configured as a dual-core, 32-bit device running at 852 MHz in a 624-FCBGA (21 × 21 mm) package. It combines CPU performance with multimedia-oriented accelerators and a broad mix of high-speed and display interfaces.

Designed for graphics-intensive and multimedia-rich embedded systems, the device targets applications that require integrated display connectivity, video/media processing, and flexible memory support while keeping package density and thermal range suitable for demanding environments.

Key Features

  • Core — Dual ARM® Cortex®-A9 cores at 852 MHz delivering symmetric multiprocessing capability for embedded applications.
  • Media and DSP — Multimedia DSP and NEON™ SIMD support for accelerated media processing and signal operations.
  • Memory — Memory controller support for LPDDR2, DDR3L and DDR3; datasheet notes a 64-bit memory interface for high-bandwidth system memory configurations.
  • Display and Video — Multiple display controllers including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad interfaces for rich HMI and display subsystems.
  • Connectivity — Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHY (3) plus USB 2.0 OTG with PHY (1), and CAN for robust peripheral and network connectivity.
  • Security — Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for device-level security primitives and secure boot elements.
  • Package & Mounting — 624-FCBGA (21 × 21 mm) surface-mount package, suitable for space-constrained board designs.
  • Operating Range — Rated operating temperature from −40 °C to 125 °C for deployment across a wide thermal envelope.
  • Compliance — RoHS compliant.

Typical Applications

  • High-performance infotainment and HMI — Integrated display controllers and media acceleration support complex user interfaces and multimedia playback.
  • Graphics-intensive embedded systems — Dual-core CPU and NEON™ SIMD enable responsive graphics and signal-processing tasks.
  • Connected devices and gateways — Gigabit Ethernet, SATA and multiple USB interfaces facilitate networked storage, connectivity, and peripheral integration.
  • Industrial displays and control — Wide operating temperature range and diverse display interfaces support ruggedized display and control applications.

Unique Advantages

  • Balanced compute and media capability: Dual ARM® Cortex®-A9 cores with multimedia DSP and NEON™ SIMD deliver a combination of application processing and media acceleration.
  • Extensive display connectivity: Native support for HDMI, LVDS, MIPI/DSI and parallel LCD interfaces simplifies integration of multi-display and high-resolution HMIs.
  • Flexible memory support: LPDDR2, DDR3L and DDR3 controller compatibility with a 64-bit memory interface enables scalable memory configurations for performance tuning.
  • Rich I/O and storage options: On-chip Gigabit Ethernet, SATA 3 Gbps and multiple USB ports reduce external component count for connected multimedia systems.
  • Built-in security primitives: Hardware security features (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide foundations for secure boot and trusted execution.
  • Wide thermal range and compact package: −40 °C to 125 °C rating and 624-FCBGA packaging enable dense board layouts and deployment in thermally challenging environments.

Why Choose MCIMX6DP4AVT8AAR?

The MCIMX6DP4AVT8AAR positions itself as a highly integrated embedded microprocessor for designs that require a mix of CPU performance, multimedia acceleration and broad peripheral connectivity. Its dual-core ARM® Cortex®-A9 architecture, combined with display, storage and networking interfaces, helps streamline BOM and board-level complexity for multimedia-focused applications.

Backed by NXP Semiconductors documentation and the i.MX6 series datasheet, the MCIMX6DP4AVT8AAR is suited to engineers building display-rich HMIs, connected multimedia platforms and other embedded systems that demand a compact package, wide temperature capability and a comprehensive set of on-chip peripherals.

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