MCIMX6DP4AVT8AAR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 565 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6DP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6DP4AVT8AAR – IC MPU I.MX6DP 852MHz 624FCBGA
The MCIMX6DP4AVT8AAR is an ARM® Cortex®-A9 based microprocessor IC configured as a dual-core, 32-bit device running at 852 MHz in a 624-FCBGA (21 × 21 mm) package. It combines CPU performance with multimedia-oriented accelerators and a broad mix of high-speed and display interfaces.
Designed for graphics-intensive and multimedia-rich embedded systems, the device targets applications that require integrated display connectivity, video/media processing, and flexible memory support while keeping package density and thermal range suitable for demanding environments.
Key Features
- Core — Dual ARM® Cortex®-A9 cores at 852 MHz delivering symmetric multiprocessing capability for embedded applications.
- Media and DSP — Multimedia DSP and NEON™ SIMD support for accelerated media processing and signal operations.
- Memory — Memory controller support for LPDDR2, DDR3L and DDR3; datasheet notes a 64-bit memory interface for high-bandwidth system memory configurations.
- Display and Video — Multiple display controllers including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad interfaces for rich HMI and display subsystems.
- Connectivity — Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHY (3) plus USB 2.0 OTG with PHY (1), and CAN for robust peripheral and network connectivity.
- Security — Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for device-level security primitives and secure boot elements.
- Package & Mounting — 624-FCBGA (21 × 21 mm) surface-mount package, suitable for space-constrained board designs.
- Operating Range — Rated operating temperature from −40 °C to 125 °C for deployment across a wide thermal envelope.
- Compliance — RoHS compliant.
Typical Applications
- High-performance infotainment and HMI — Integrated display controllers and media acceleration support complex user interfaces and multimedia playback.
- Graphics-intensive embedded systems — Dual-core CPU and NEON™ SIMD enable responsive graphics and signal-processing tasks.
- Connected devices and gateways — Gigabit Ethernet, SATA and multiple USB interfaces facilitate networked storage, connectivity, and peripheral integration.
- Industrial displays and control — Wide operating temperature range and diverse display interfaces support ruggedized display and control applications.
Unique Advantages
- Balanced compute and media capability: Dual ARM® Cortex®-A9 cores with multimedia DSP and NEON™ SIMD deliver a combination of application processing and media acceleration.
- Extensive display connectivity: Native support for HDMI, LVDS, MIPI/DSI and parallel LCD interfaces simplifies integration of multi-display and high-resolution HMIs.
- Flexible memory support: LPDDR2, DDR3L and DDR3 controller compatibility with a 64-bit memory interface enables scalable memory configurations for performance tuning.
- Rich I/O and storage options: On-chip Gigabit Ethernet, SATA 3 Gbps and multiple USB ports reduce external component count for connected multimedia systems.
- Built-in security primitives: Hardware security features (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide foundations for secure boot and trusted execution.
- Wide thermal range and compact package: −40 °C to 125 °C rating and 624-FCBGA packaging enable dense board layouts and deployment in thermally challenging environments.
Why Choose MCIMX6DP4AVT8AAR?
The MCIMX6DP4AVT8AAR positions itself as a highly integrated embedded microprocessor for designs that require a mix of CPU performance, multimedia acceleration and broad peripheral connectivity. Its dual-core ARM® Cortex®-A9 architecture, combined with display, storage and networking interfaces, helps streamline BOM and board-level complexity for multimedia-focused applications.
Backed by NXP Semiconductors documentation and the i.MX6 series datasheet, the MCIMX6DP4AVT8AAR is suited to engineers building display-rich HMIs, connected multimedia platforms and other embedded systems that demand a compact package, wide temperature capability and a comprehensive set of on-chip peripherals.
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