MCIMX6DP5EYM1AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21) |
|---|---|
| Quantity | 706 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6DP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 624-LFBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 1.0GHz | Supplier Device Package | 624-FCPBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6DP5EYM1AB – IC MPU I.MX6DP 1.0GHZ 624FCPBGA
The MCIMX6DP5EYM1AB is an i.MX 6DualPlus series application processor from NXP Semiconductors featuring dual ARM® Cortex®‑A9 cores running at 1.0 GHz. It targets graphics‑intensive embedded designs, offering integrated multimedia capabilities and on‑chip system features for compact, high‑function applications.
Designed for Human Machine Interface (HMI) and video processing use cases, the device combines dual‑core processing, graphics acceleration and a broad set of peripheral interfaces to simplify system integration and accelerate time to market.
Key Features
- Core & Performance Dual ARM® Cortex®‑A9 32‑bit cores at 1 GHz provide balanced multicore processing for application and multimedia workloads.
- Multimedia Acceleration Integrated graphics acceleration and NEON™ SIMD support for multimedia and signal processing tasks.
- Memory Interfaces Supports LPDDR2, DDR3L and DDR3 memory controllers to match target memory performance and cost points.
- Display Connectivity Multiple display interface controllers including HDMI, LCD parallel, LVDS and MIPI/DSI for flexible display subsystem designs.
- High‑Speed I/O Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, three USB 2.0 + PHY ports and one USB 2.0 OTG + PHY port enable robust connectivity and storage options.
- Additional Interfaces On‑chip CAN interface for fieldbus or vehicle/industrial networking integration.
- Security & System Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for secure boot and system integrity functions.
- Package & Mounting Supplied in a 624‑FCPBGA package (21 × 21 mm) with surface mount construction for space‑efficient PCB designs.
- Operating Range Specified operating temperature range of −20 °C to 105 °C for demanding embedded environments.
- Compliance RoHS compliant.
Typical Applications
- Human Machine Interfaces (HMI) Drives rich graphical user interfaces and display systems using its display controllers and graphics acceleration.
- Video Processing & Multimedia Devices Suitable for applications requiring video rendering and multimedia handling thanks to NEON SIMD and integrated graphics.
- Embedded Consumer Products Fits consumer electronics designs that need dual‑core processing, broad display options and multimedia features.
- Networking & Storage Gateways Gigabit Ethernet and SATA connectivity enable networked appliances and local storage applications.
Unique Advantages
- Highly integrated multimedia platform: Combines dual Cortex‑A9 cores with graphics acceleration and NEON SIMD to reduce external processing requirements.
- Flexible memory support: LPDDR2, DDR3L and DDR3 controller support lets designers select memory technology that best matches performance and cost targets.
- Extensive display interfaces: HDMI, LVDS, MIPI/DSI and parallel LCD controllers provide options for a wide range of display types and resolutions.
- Comprehensive connectivity: Integrated Gigabit Ethernet, SATA, multiple USB ports and CAN simplify system BOM for connected embedded devices.
- Security building blocks: On‑chip security modules (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) support secure boot and trusted execution mechanisms.
- Compact package with industrial range: 624‑FCPBGA (21 × 21 mm) packaging and −20 °C to 105 °C operating range support compact, rugged designs.
Why Choose MCIMX6DP5EYM1AB?
The MCIMX6DP5EYM1AB positions itself as a capable dual‑core embedded application processor that balances processing performance, multimedia integration and broad peripheral support. Its combination of ARM® Cortex®‑A9 cores, graphics acceleration, and extensive I/O makes it suitable for engineers building HMIs, multimedia products, and networked embedded systems.
Backed by the i.MX 6DualPlus/6QuadPlus documentation, this device provides the technical detail needed for system design and integration while delivering the integration needed to reduce system complexity and accelerate development.
Request a quote or submit an inquiry today to evaluate the MCIMX6DP5EYM1AB for your next embedded design.

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