MCIMX6DP6AVT1AAR

IC MPU I.MX6DP 1GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1GHz 624-FCBGA (21x21)

Quantity 365 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT1AAR – IC MPU I.MX6DP 1GHZ 624FCBGA

The MCIMX6DP6AVT1AAR is a dual-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors' i.MX 6DP series, running at 1 GHz in a 624-FCBGA (21 × 21 mm) package. It targets embedded designs requiring integrated multimedia processing, graphics acceleration, and a wide set of peripheral interfaces.

With dual 32-bit cores, NEON™ SIMD multimedia support, multiple display controllers, and a broad set of connectivity options, this device is suited for graphics-intensive and connected embedded systems that need consolidated processing, memory and I/O capability in a surface-mount BGA package.

Key Features

  • Core — ARM® Cortex®-A9 architecture, dual-core, 32-bit, operating at 1 GHz for balanced compute and multimedia workloads.
  • Multimedia Acceleration — Integrated multimedia/DSP support with NEON™ SIMD and graphics acceleration suitable for display and video processing tasks.
  • Memory Interfaces — Supports DDR3, DDR3L and LPDDR2 through integrated memory controllers for flexible memory subsystem design.
  • Display Controllers — Multiple display interface options including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad support to drive diverse HMI and display configurations.
  • Connectivity & Storage — Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, three USB 2.0 ports with PHY and one USB 2.0 OTG with PHY, plus CAN interface for networked and storage-capable designs.
  • Security & System — On-chip security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for hardware-assisted security functions.
  • Package & Mounting — 624-FCBGA package (21 × 21 mm), surface mount, suitable for compact embedded board layouts.
  • Operating Range — Rated for operation from −40 °C to 125 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High‑performance infotainment and multimedia systems — Integrated graphics acceleration, video processing and multiple display interfaces enable advanced UI and media playback functionality.
  • Graphics‑intensive display systems — Support for HDMI, LVDS and MIPI/DSI makes the device suitable for complex display and HMI implementations.
  • Embedded networking and storage gateways — Gigabit Ethernet and SATA 3 Gbps provide options for networked devices with local storage or media servers.
  • Industrial and control HMI — Dual cores, broad I/O and wide operating temperature accommodate embedded human‑machine interfaces and control panels.

Unique Advantages

  • Dual‑core Cortex‑A9 processing: Delivers multi-threaded application capability and balanced performance for embedded multimedia tasks.
  • Flexible memory support: DDR3, DDR3L and LPDDR2 controller options simplify BOM choices and memory design trade-offs.
  • Comprehensive display support: Multiple display controllers (HDMI, LVDS, MIPI/DSI, parallel) allow designers to target a wide range of screen technologies and resolutions.
  • Rich peripheral set: Integrated Gigabit Ethernet, SATA, multiple USB ports with PHY, and CAN reduce external component count and simplify system integration.
  • Integrated hardware security: ARM TrustZone, CAAM and related security blocks provide hardware-level security building blocks for protected boot and cryptographic operations.
  • Board‑level convenience: Standard 624‑FCBGA (21 × 21 mm) package and surface‑mount mounting streamline PCB layout for compact embedded products.

Why Choose MCIMX6DP6AVT1AAR?

The MCIMX6DP6AVT1AAR positions itself as a balanced, highly integrated microprocessor for embedded designs that require multimedia processing, multiple display options and broad I/O support. Its dual ARM Cortex‑A9 cores, NEON SIMD support and dedicated memory controllers enable responsive user interfaces and handling of multimedia workloads while consolidating peripherals on-chip.

This device is appropriate for developers building connected, display‑centric embedded systems that need a compact BGA footprint, robust peripheral set and hardware security primitives. RoHS compliance and a wide operating temperature range support deployment in a variety of embedded environments.

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