MCIMX6DP6AVT1AB

IC MPU I.MX6DP 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 214 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT1AB – IC MPU I.MX6DP 1.0GHZ 624FCBGA

The MCIMX6DP6AVT1AB is an NXP i.MX 6DP series microprocessor featuring dual ARM® Cortex®-A9 cores running at 1.0 GHz. It targets graphics- and multimedia-focused embedded designs that require balanced CPU performance, multimedia acceleration, and a broad set of peripheral interfaces.

Built for high-performance multimedia platforms, the device integrates NEON™ SIMD support, display and video processing capabilities, multiple high-speed interfaces, and a 624-FCBGA (21 × 21 mm) package for compact system integration.

Key Features

  • Core  Dual ARM® Cortex®-A9 32-bit cores at 1.0 GHz provide deterministic application processing for embedded workloads.
  • Multimedia & SIMD  Includes multimedia DSP capabilities and NEON™ SIMD acceleration to offload and accelerate signal and media processing tasks.
  • Memory Interfaces  Integrated memory controllers support LPDDR2, DDR3L and DDR3, enabling flexible system memory choices and performance scaling.
  • Display & Video  Multiple display controllers including HDMI, LVDS, parallel LCD and MIPI/DSI along with 1080p video processing capability for demanding graphical user interfaces and video playback.
  • High-speed Connectivity  Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, multiple USB 2.0 ports (including OTG with PHY), and CAN support a wide range of wired connectivity and storage options.
  • Security & System Management  On-chip security features such as ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS provide hardware-rooted security primitives and system control functions.
  • Package & Thermal  624‑FCBGA package (21 × 21 mm) with an operating temperature range of −40 °C to 125 °C for deployment in thermally demanding embedded environments.
  • Power & Integration  Integrated power management and LDO options are documented in the device datasheet to support optimized power sequencing and system-level power design.
  • Standards & Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • High‑performance multimedia platforms  Drives advanced media playback and user interfaces using integrated video processing and display controllers.
  • Graphical human‑machine interfaces (HMIs)  Supports rich GUIs and touchscreen displays via HDMI, LVDS, parallel LCD and MIPI/DSI interfaces.
  • Networked embedded systems  Enables gateway and appliance designs with Gigabit Ethernet, multiple USB ports and SATA for local storage.
  • Industrial and commercial control  Provides deterministic application processing and CAN connectivity for integrated control and communication tasks.

Unique Advantages

  • Balanced dual-core performance: Delivers multitasking CPU throughput at 1.0 GHz across two Cortex‑A9 cores for responsive embedded applications.
  • Comprehensive multimedia support: NEON SIMD plus video processing and multiple display controller options reduce the need for external accelerators.
  • Broad I/O integration: Gigabit Ethernet, SATA, USB, CAN and multiple display interfaces simplify bill of materials and accelerate system integration.
  • Security building blocks included: Hardware security features (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) enable robust platform security without additional external components.
  • Compact system footprint: 624‑FCBGA (21 × 21 mm) packaging allows high integration density for space-constrained embedded designs.
  • Wide operating temperature: Rated from −40 °C to 125 °C to support deployment in thermally challenging environments.

Why Choose MCIMX6DP6AVT1AB?

The MCIMX6DP6AVT1AB positions itself as a versatile platform processor that combines dual Cortex‑A9 CPU performance with dedicated multimedia acceleration and extensive peripheral support. Its memory flexibility, integrated security features, and rich display connectivity make it well suited for embedded designs that require responsive multimedia, robust connectivity, and compact packaging.

Engineers and procurement teams seeking a scalable, well-documented microprocessor with on-chip multimedia and system management features will find this NXP i.MX 6DP device appropriate for mid- to high-performance embedded applications where integration and interface breadth matter.

Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6DP6AVT1AB. Our team can provide technical documentation and lead-time information to support your design and sourcing needs.

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