Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6D5EYM10CEMCIMX6D5EYM10CENXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
1,178
MCIMX6D5EYM12ACMCIMX6D5EYM12ACNXP SemiconductorsIC MPU I.MX6D 1.2GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
909
MCIMX6D5EYM12ADMCIMX6D5EYM12ADNXP SemiconductorsIC MPU I.MX6D 1.2GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
997
MCIMX6D5EYM12AEMCIMX6D5EYM12AENXP SemiconductorsIC MPU I.MX6D 1.2GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
230
MCIMX6D5EYM12CEMCIMX6D5EYM12CENXP SemiconductorsIC MPU I.MX6D 1.2GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
936
N/AMCIMX6D5EZK08ADNXP SemiconductorsIC MPU I.MX6D 800MHZ 569MAPBGAMicroprocessors569-MAPBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
569-LFBGA
Supplier Device Package:
569-MAPBGA (12×12)
151
N/AMCIMX6D5EZK08AENXP SemiconductorsIC MPU I.MX6D 800MHZ 569MAPBGAMicroprocessors569-MAPBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
569-LFBGA
Supplier Device Package:
569-MAPBGA (12×12)
709
MCIMX6D6AVT08ACMCIMX6D6AVT08ACNXP SemiconductorsIC MPU I.MX6D 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,152
MCIMX6D6AVT08ACRMCIMX6D6AVT08ACRNXP SemiconductorsIC MPU I.MX6D 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,795
N/AMCIMX6D6AVT08ADNXP SemiconductorsIC MPU I.MX6 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
104
MCIMX6D6AVT08ADRMCIMX6D6AVT08ADRNXP SemiconductorsIC MPU I.MX6D 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
607
N/AMCIMX6D6AVT08AENXP SemiconductorsIC MPU I.MX6D 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,263
N/AMCIMX6D6AVT08AERNXP SemiconductorsIC MPU I.MX6D 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
832
MCIMX6D6AVT10ACMCIMX6D6AVT10ACNXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,769
MCIMX6D6AVT10ACRMCIMX6D6AVT10ACRNXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,030
MCIMX6D6AVT10ADMCIMX6D6AVT10ADNXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,043
MCIMX6D6AVT10ADRMCIMX6D6AVT10ADRNXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,212
MCIMX6D6AVT10AEMCIMX6D6AVT10AENXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
347
MCIMX6D6AVT10AERMCIMX6D6AVT10AERNXP SemiconductorsIC MPU I.MX6D 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
561
MCIMX6D7CVT08ACMCIMX6D7CVT08ACNXP SemiconductorsIC MPU I.MX6D 800MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
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