 | | MCIMX537CVV8CR2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 706 | |
 | | MCIMX6D4AVT08AC | NXP Semiconductors | IC MPU I.MX6D 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 820 | |
| N/A | | MCIMX6D4AVT08AC-NXP | NXP Semiconductors | I.MX 6 SERIES 32 BIT MPU, DUAL A | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,090 | |
 | | MCIMX6D4AVT08ACR | NXP Semiconductors | IC MPU I.MX6D 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,095 | |
 | | MCIMX6D4AVT08AD | NXP Semiconductors | IC MPU I.MX6D 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 58 | |
| N/A | | MCIMX6D4AVT08ADR | NXP Semiconductors | IC MPU I.MX6 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 139 | |
 | | MCIMX6D4AVT08AE | NXP Semiconductors | IC MPU I.MX6D 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,545 | |
 | | MCIMX6D4AVT08AER | NXP Semiconductors | IC MPU I.MX6D 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 856 | |
 | | MCIMX6D4AVT10AC | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,009 | |
 | | MCIMX6D4AVT10ACR | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,438 | |
 | | MCIMX6D4AVT10AD | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 86 | |
 | | MCIMX6D4AVT10ADR | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,040 | |
| N/A | | MCIMX6D4AVT10AE | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,283 | |
| N/A | | MCIMX6D4AVT10AER | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,988 | |
 | | MCIMX6D5EYM10AC | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 57 | |
 | | MCIMX6D5EYM10ACR | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 1,207 | |
 | | MCIMX6D5EYM10AD | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 261 | |
 | | MCIMX6D5EYM10ADR | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 67 | |
 | | MCIMX6D5EYM10AE | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 371 | |
 | | MCIMX6D5EYM10AER | NXP Semiconductors | IC MPU I.MX6D 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 121 | |