Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX513DJM8CMCIMX513DJM8CNXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
732
MCIMX513DJM8CR2MCIMX513DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
775
MCIMX514AJM6CN/AMCIMX514AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
423
N/AMCIMX514AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
696
MCIMX515CJM6CMCIMX515CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
1,407
MCIMX515CJM6CR2MCIMX515CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
422
MCIMX515DJM8CMCIMX515DJM8CNXP SemiconductorsIC MPU 800MHZ 529BGAMicroprocessors529-BGA Case 2017 (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR2, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA Case 2017 (19×19)
589
MCIMX515DJM8CR2MCIMX515DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
350
MCIMX515DVK8CMCIMX515DVK8CNXP SemiconductorsIC MPU I.MX51 800MHZ 527BGAMicroprocessors527-BGA (13x13)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
527-LFBGA
Supplier Device Package:
527-BGA (13×13)
650
MCIMX516AJM6CMCIMX516AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
492
MCIMX516AJM6CR2MCIMX516AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
94
MCIMX534AVP8C2MCIMX534AVP8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
679
MCIMX534AVP8C2R2MCIMX534AVP8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,667
MCIMX534AVV8BMCIMX534AVV8BNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-40°C – 125°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
697
MCIMX534AVV8CMCIMX534AVV8CNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
262
MCIMX534AVV8C2MCIMX534AVV8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
768
MCIMX534AVV8C2R2MCIMX534AVV8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
821
MCIMX534AVV8CR2MCIMX534AVV8CR2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
242
MCIMX535DVP1C2MCIMX535DVP1C2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
539
MCIMX535DVP1C2R2MCIMX535DVP1C2R2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,082

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