 | | MCIMX513DJM8C | NXP Semiconductors | IC MPU I.MX51 800MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 732 | |
 | | MCIMX513DJM8CR2 | NXP Semiconductors | IC MPU I.MX51 800MHZ 529BGA | Microprocessors | 529-BGA (19x19) | 1.2V, 1.875V, 2.775V, 3.0V | -20°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 775 | |
 | N/A | MCIMX514AJM6C | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 423 | |
| N/A | | MCIMX514AJM6CR2 | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 696 | |
 | | MCIMX515CJM6C | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 95°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 1,407 | |
 | | MCIMX515CJM6CR2 | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 95°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 422 | |
 | | MCIMX515DJM8C | NXP Semiconductors | IC MPU 800MHZ 529BGA | Microprocessors | 529-BGA Case 2017 (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA Case 2017 (19×19) | 589 | |
 | | MCIMX515DJM8CR2 | NXP Semiconductors | IC MPU I.MX51 800MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 350 | |
 | | MCIMX515DVK8C | NXP Semiconductors | IC MPU I.MX51 800MHZ 527BGA | Microprocessors | 527-BGA (13x13) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 527-BGA (13×13) | 650 | |
 | | MCIMX516AJM6C | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 492 | |
 | | MCIMX516AJM6CR2 | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 94 | |
 | | MCIMX534AVP8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 679 | |
 | | MCIMX534AVP8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,667 | |
 | | MCIMX534AVV8B | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C – 125°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 697 | |
 | | MCIMX534AVV8C | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 262 | |
 | | MCIMX534AVV8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 768 | |
 | | MCIMX534AVV8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 821 | |
 | | MCIMX534AVV8CR2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 242 | |
 | | MCIMX535DVP1C2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 539 | |
 | | MCIMX535DVP1C2R2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,082 | |