 | | MCIMX502EVM8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | -20°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 1,694 | |
 | | MCIMX503CVM8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 115 | |
 | | MCIMX503CVM8BR2 | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 1,047 | |
 | | MCIMX507CVK8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 416MAPBGA | Microprocessors | 416-MAPBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (13×13) | 175 | |
 | | MCIMX507CVK8BR2 | NXP Semiconductors | IC MPU I.MX50 800MHZ 416MAPBGA | Microprocessors | 416-MAPBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (13×13) | 7 | |
 | | MCIMX507CVM1B | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 126 | |
 | | MCIMX507CVM1BR2 | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 710 | |
 | | MCIMX507CVM8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 30 | |
| N/A | | MCIMX508CVK1B | NXP Semiconductors | IC MPU I.MX50 1.0GHZ 416MAPBGA | Microprocessors | 416-MAPBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (13×13) | 1,460 | |
 | | MCIMX508CVK8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 416MAPBGA | Microprocessors | 416-MAPBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (13×13) | 551 | |
 | | MCIMX508CVK8BR2 | NXP Semiconductors | IC MPU I.MX50 800MHZ 416MAPBGA | Microprocessors | 416-MAPBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (13×13) | 206 | |
 | | MCIMX508CVM8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 1,633 | |
 | | MCIMX508CVM8BR2 | NXP Semiconductors | IC MPU I.MX50 800MHZ 400LFBGA | Microprocessors | 400-LFBGA (17x17) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 400-LFBGA (17×17) | 1,763 | |
| N/A | | MCIMX508CZK8B | NXP Semiconductors | IC MPU I.MX50 800MHZ 416VFBGA | Microprocessors | 416-VFBGA (13x13) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Mounting Type: Surface Mount Supplier Device Package: 416-VFBGA (13×13) | 159 | |
 | | MCIMX512CJM6C | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 95°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 886 | |
 | | MCIMX512CJM6CR2 | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 95°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 285 | |
 | | MCIMX512DJM8C | NXP Semiconductors | IC MPU I.MX51 800MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 605 | |
 | | MCIMX512DJM8CR2 | NXP Semiconductors | IC MPU I.MX51 800MHZ 529BGA | Microprocessors | 529-BGA (19x19) | 1.2V, 1.875V, 2.775V, 3.0V | -20°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 200 | |
 | | MCIMX513CJM6C | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | N/A | -40°C ~ 95°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage – I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -40°C ~ 95°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Mounting Type: Surface Mount Supplier Device Package: 529-BGA (19×19) | 137 | |
 | | MCIMX513CJM6CR2 | NXP Semiconductors | IC MPU I.MX51 600MHZ 529BGA | Microprocessors | 529-BGA (19x19) | 1.2V, 1.875V, 2.775V, 3.0V | -40°C – 95°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,185 | |