 | | MCIMX535DVP2C2 | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 775 | |
 | | MCIMX535DVV1B | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -20°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 645 | |
 | | MCIMX535DVV1C | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 599 | |
 | | MCIMX535DVV1C2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 943 | |
 | | MCIMX535DVV1C2R2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,535 | |
 | | MCIMX535DVV1CR2 | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 449 | |
 | | MCIMX535DVV2C | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 692 | |
 | | MCIMX535DVV2C2 | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 475 | |
 | | MCIMX536AVP8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,959 | |
 | | MCIMX536AVP8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,447 | |
 | | MCIMX536AVV8B | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C – 125°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,362 | |
 | | MCIMX536AVV8C | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 530 | |
 | | MCIMX536AVV8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 468 | |
 | | MCIMX536AVV8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 102 | |
 | | MCIMX537CVP8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 911 | |
 | | MCIMX537CVP8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 715 | |
 | | MCIMX537CVV8B | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 884 | |
 | | MCIMX537CVV8C | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 1,011 | |
 | | MCIMX537CVV8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 399 | |
 | | MCIMX537CVV8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19×19) | 836 | |