 | | MCIMX6G3DVK05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 1,416 | |
 | | MCIMX6G3DVM05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 905 | |
 | | MCIMX6G3DVM05AA-NXP | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 874 | |
 | | MCIMX6G3DVM05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 282 | |
 | | MCIMX6L2DVN10AA | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 23 | |
| N/A | | MCIMX6L2DVN10AB | NXP Semiconductors | IC MPU I.MX6 1GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.2V, 1.8V, 3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 214 | |
 | | MCIMX6L2DVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 464 | |
 | | MCIMX6L2EVN10AB | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,868 | |
 | | MCIMX6L2EVN10ABR | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,099 | |
 | | MCIMX6L2EVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,047 | |
 | | MCIMX6L2EVN10ACR | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,857 | |
 | | MCIMX6L3DVN10AA | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 3 | |
 | | MCIMX6L3DVN10AB | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 782 | |
 | | MCIMX6L3DVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 800 | |
 | | MCIMX6L3EVN10AB | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 355 | |
 | | MCIMX6L3EVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 330 | |
 | | MCIMX6L7DVN10AB | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 205 | |
 | | MCIMX6L7DVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 831 | |
 | | MCIMX6L8DVN10AA | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 130 | |
 | | MCIMX6L8DVN10AA-NXP | NXP Semiconductors | I.MX 6 SERIES 32 BIT MPU, ARM CO | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.2V, 1.8V, 3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 860 | |