Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6G3DVK05ABMCIMX6G3DVK05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 272MAPBGAMicroprocessors272-MAPBGA (9x9)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
272-LFBGA
Supplier Device Package:
272-MAPBGA (9×9)
1,416
MCIMX6G3DVM05AAMCIMX6G3DVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
905
MCIMX6G3DVM05AA-NXPMCIMX6G3DVM05AA-NXPNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
874
MCIMX6G3DVM05ABMCIMX6G3DVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
282
MCIMX6L2DVN10AAMCIMX6L2DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
23
N/AMCIMX6L2DVN10ABNXP SemiconductorsIC MPU I.MX6 1GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
214
MCIMX6L2DVN10ACMCIMX6L2DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
464
MCIMX6L2EVN10ABMCIMX6L2EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
1,868
MCIMX6L2EVN10ABRMCIMX6L2EVN10ABRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
1,099
MCIMX6L2EVN10ACMCIMX6L2EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
1,047
MCIMX6L2EVN10ACRMCIMX6L2EVN10ACRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
1,857
MCIMX6L3DVN10AAMCIMX6L3DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
3
MCIMX6L3DVN10ABMCIMX6L3DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
782
MCIMX6L3DVN10ACMCIMX6L3DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
800
MCIMX6L3EVN10ABMCIMX6L3EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
355
MCIMX6L3EVN10ACMCIMX6L3EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
330
MCIMX6L7DVN10ABMCIMX6L7DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
205
MCIMX6L7DVN10ACMCIMX6L7DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
831
MCIMX6L8DVN10AAMCIMX6L8DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
130
MCIMX6L8DVN10AA-NXPMCIMX6L8DVN10AA-NXPNXP SemiconductorsI.MX 6 SERIES 32 BIT MPU, ARM COMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
860

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