MCIMX6L8DVN10AA-NXP
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1GHz 432-MAPBGA (13x13) |
|---|---|
| Quantity | 727 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6L |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 432-MAPBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A992 | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 432-TFBGA | RAM Controllers | DDR3, LPDDR2 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 1GHz | Supplier Device Package | 432-MAPBGA (13×13) | USB | USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.2V, 1.8V, 3V |
Overview of MCIMX6L8DVN10AA-NXP – I.MX6SL ARM Cortex‑A9 1 GHz 1‑Core MPU
The MCIMX6L8DVN10AA-NXP is a 32‑bit microprocessor IC based on an ARM® Cortex®‑A9 core running at 1 GHz. Designed for embedded and consumer applications, it integrates a single high‑performance application core with multimedia acceleration and a range of peripheral interfaces.
With on‑chip memory controllers, display and audio interfaces, wired networking and multiple USB ports, this device targets consumer embedded designs that require balanced CPU performance, multimedia support and integrated connectivity in a compact surface‑mount package.
Key Features
- Core ARM® Cortex®‑A9 single 32‑bit core at 1 GHz for application processing.
- Multimedia Co‑processing Multimedia DSP and NEON™ SIMD support for accelerated media and signal processing tasks.
- Memory Integrated DDR3 and LPDDR2 memory controllers to support common embedded memory configurations.
- Display and Audio LCD display controller and AC97 audio interface for user interfaces and audio playback.
- Connectivity 10/100 Mbps Ethernet (1) plus USB 2.0 ports: two USB 2.0 + PHY and one USB 2.0 OTG + PHY for external device and host connectivity.
- Security Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Graphics Acceleration On‑chip graphics acceleration to support graphical user interfaces and multimedia rendering.
- Package & Mounting Supplied in a 432‑MAPBGA (13×13) package; package case specified as 432‑TFBGA. Surface mount device.
- Operating Range & Compliance Operating temperature 0 °C to 95 °C and RoHS compliant for consumer applications.
Typical Applications
- Consumer Multimedia Devices — Drive LCD displays and audio subsystems while handling media processing using the Cortex‑A9 core and multimedia accelerators.
- Embedded Human‑Machine Interfaces (HMIs) — Power graphical user interfaces with integrated display controller and graphics acceleration.
- Network‑Enabled Consumer Products — Add Ethernet and USB connectivity to consumer products that require wired networking and peripheral support.
Unique Advantages
- Single‑chip integration: Combines CPU, memory controllers, display, audio and multiple I/O interfaces to simplify system design and reduce BOM complexity.
- Multimedia acceleration: NEON™ SIMD and multimedia DSP support lower CPU load for media tasks, improving responsiveness for UI and playback.
- Comprehensive security suite: On‑chip TrustZone, boot security and cryptographic features protect boot and runtime integrity for consumer devices.
- Flexible connectivity: Built‑in Ethernet and multiple USB ports enable diverse peripheral and networking options without external controllers.
- Compact surface‑mount packaging: 432‑MAPBGA (13×13) supplier package enables high‑density PCB layouts in space‑constrained designs.
Why Choose MCIMX6L8DVN10AA-NXP?
The MCIMX6L8DVN10AA-NXP positions itself as a balanced, highly integrated solution for consumer embedded designs that require a 1 GHz Cortex‑A9 application processor with multimedia and connectivity capabilities. Its combination of memory controllers, display/audio interfaces, Ethernet and USB support helps accelerate time‑to‑market for compact consumer products.
Designed for developers seeking system integration and on‑chip security in a surface‑mount BGA package, this device offers scalability within the i.MX 6 series and practical hardware features for robust consumer applications supported by NXP’s product family.
Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6L8DVN10AA-NXP. Our team can assist with volume quoting and lead‑time details.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016