MCIMX6L3EVN10AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1.0GHz 432-MAPBGA (13x13) |
|---|---|
| Quantity | 687 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6L |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 432-MAPBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 432-TFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 1.0GHz | Supplier Device Package | 432-MAPBGA (13×13) | USB | USB 2.0 + PHY (3) | ||
| Voltage – I/O | 1.2V, 1.8V, 3.0V |
Overview of MCIMX6L3EVN10AB – IC MPU I.MX6SL 1.0GHZ 432MAPBGA
The MCIMX6L3EVN10AB is an NXP i.MX 6SoloLite microprocessor IC featuring a single ARM® Cortex®-A9 core running at up to 1.0 GHz. It combines a low-power application processor architecture with integrated multimedia acceleration and power management to serve a range of embedded and consumer-focused devices.
Designed for industrial qualification and a wide operating temperature range, this device targets compact systems that require display and multimedia capability, flexible memory support, and on-chip security features for robust embedded designs.
Key Features
- Core Single ARM® Cortex®-A9, 32-bit core running up to 1.0 GHz, delivering application processing for embedded multimedia workloads.
- Multimedia & DSP Integrated multimedia co-processor with NEON™ SIMD and 2D graphics acceleration to support UI rendering and media processing.
- Memory Interfaces On-chip memory controller support for LPDDR2, LVDDR3 and DDR3 (including DDR3-800 interface referenced in technical documentation) for flexible system memory choices.
- Display & Input LCD and keypad display interface controllers and graphics acceleration suitable for user interface and display-driven applications.
- Peripheral Connectivity 10/100 Mbps Ethernet (1), USB 2.0 with PHY support (3), and an AC97 audio interface provide common connectivity for embedded designs.
- Security & Boot Comprehensive on-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
- Power & Package Integrated power management features referenced in the technical documentation, supplied in a compact 432-MAPBGA package (13 × 13 mm, 0.5 mm pitch) for surface-mount assembly.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for regulated production environments.
Typical Applications
- eReaders Color and monochrome eReaders benefit from the single-core application processing, 2D graphics acceleration and low-power focused design.
- Entry-level Tablets Entry-level tablet devices can leverage the ARM® Cortex®-A9 core, display interfaces and multimedia acceleration for responsive user interfaces.
- Barcode Scanners and Handhelds Portable scanners and handheld embedded terminals that require compact packaging, industrial temperature support and robust connectivity.
- Display and Sensor Systems Systems integrating displays and camera sensors make use of the device’s display controllers, graphics acceleration and flexible memory interface.
Unique Advantages
- Balanced performance and efficiency: The 1.0 GHz ARM® Cortex®-A9 core provides a practical balance of application performance and power management for embedded multimedia tasks.
- Integrated multimedia acceleration: NEON™ SIMD and a 2D graphics processor reduce external accelerator requirements and simplify BOM for UI-centric products.
- Flexible memory support: Controllers for LPDDR2, LVDDR3 and DDR3 (including DDR3-800 in documentation) enable designers to choose the memory topology that best fits cost and performance targets.
- Comprehensive on-chip security: Multiple security primitives—TrustZone, boot security, cryptography and secure JTAG—help protect device integrity and sensitive data.
- Compact, manufacturable package: The 432-MAPBGA (13 × 13 mm, 0.5 mm pitch) surface-mount package minimizes board area while supporting high-density designs.
- Industrial-ready: Industrial qualification and −40 °C to 105 °C operating range support deployments in challenging thermal environments.
Why Choose MCIMX6L3EVN10AB?
The MCIMX6L3EVN10AB positions itself as a highly integrated, industrially qualified application processor for embedded multimedia and consumer-focused devices. With a single ARM® Cortex®-A9 core, dedicated multimedia acceleration, flexible memory interfaces and a compact 432-MAPBGA package, it addresses designs that need a balanced mix of performance, integration and thermal robustness.
Engineers specifying this part will benefit from the i.MX 6L series’ documented features—integrated power management, display and peripheral support, and comprehensive security—making it suited for products where compact footprint, multimedia capability, and industrial temperature operation are required.
Request a quote or submit a purchase inquiry to evaluate MCIMX6L3EVN10AB for your next embedded design.

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