MCIMX6L3EVN10AB

IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1.0GHz 432-MAPBGA (13x13)

Quantity 687 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6L
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package432-MAPBGA (13x13)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case432-TFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package432-MAPBGA (13×13)USBUSB 2.0 + PHY (3)
Voltage – I/O1.2V, 1.8V, 3.0V

Overview of MCIMX6L3EVN10AB – IC MPU I.MX6SL 1.0GHZ 432MAPBGA

The MCIMX6L3EVN10AB is an NXP i.MX 6SoloLite microprocessor IC featuring a single ARM® Cortex®-A9 core running at up to 1.0 GHz. It combines a low-power application processor architecture with integrated multimedia acceleration and power management to serve a range of embedded and consumer-focused devices.

Designed for industrial qualification and a wide operating temperature range, this device targets compact systems that require display and multimedia capability, flexible memory support, and on-chip security features for robust embedded designs.

Key Features

  • Core  Single ARM® Cortex®-A9, 32-bit core running up to 1.0 GHz, delivering application processing for embedded multimedia workloads.
  • Multimedia & DSP  Integrated multimedia co-processor with NEON™ SIMD and 2D graphics acceleration to support UI rendering and media processing.
  • Memory Interfaces  On-chip memory controller support for LPDDR2, LVDDR3 and DDR3 (including DDR3-800 interface referenced in technical documentation) for flexible system memory choices.
  • Display & Input  LCD and keypad display interface controllers and graphics acceleration suitable for user interface and display-driven applications.
  • Peripheral Connectivity  10/100 Mbps Ethernet (1), USB 2.0 with PHY support (3), and an AC97 audio interface provide common connectivity for embedded designs.
  • Security & Boot  Comprehensive on-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Power & Package  Integrated power management features referenced in the technical documentation, supplied in a compact 432-MAPBGA package (13 × 13 mm, 0.5 mm pitch) for surface-mount assembly.
  • Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for regulated production environments.

Typical Applications

  • eReaders  Color and monochrome eReaders benefit from the single-core application processing, 2D graphics acceleration and low-power focused design.
  • Entry-level Tablets  Entry-level tablet devices can leverage the ARM® Cortex®-A9 core, display interfaces and multimedia acceleration for responsive user interfaces.
  • Barcode Scanners and Handhelds  Portable scanners and handheld embedded terminals that require compact packaging, industrial temperature support and robust connectivity.
  • Display and Sensor Systems  Systems integrating displays and camera sensors make use of the device’s display controllers, graphics acceleration and flexible memory interface.

Unique Advantages

  • Balanced performance and efficiency: The 1.0 GHz ARM® Cortex®-A9 core provides a practical balance of application performance and power management for embedded multimedia tasks.
  • Integrated multimedia acceleration: NEON™ SIMD and a 2D graphics processor reduce external accelerator requirements and simplify BOM for UI-centric products.
  • Flexible memory support: Controllers for LPDDR2, LVDDR3 and DDR3 (including DDR3-800 in documentation) enable designers to choose the memory topology that best fits cost and performance targets.
  • Comprehensive on-chip security: Multiple security primitives—TrustZone, boot security, cryptography and secure JTAG—help protect device integrity and sensitive data.
  • Compact, manufacturable package: The 432-MAPBGA (13 × 13 mm, 0.5 mm pitch) surface-mount package minimizes board area while supporting high-density designs.
  • Industrial-ready: Industrial qualification and −40 °C to 105 °C operating range support deployments in challenging thermal environments.

Why Choose MCIMX6L3EVN10AB?

The MCIMX6L3EVN10AB positions itself as a highly integrated, industrially qualified application processor for embedded multimedia and consumer-focused devices. With a single ARM® Cortex®-A9 core, dedicated multimedia acceleration, flexible memory interfaces and a compact 432-MAPBGA package, it addresses designs that need a balanced mix of performance, integration and thermal robustness.

Engineers specifying this part will benefit from the i.MX 6L series’ documented features—integrated power management, display and peripheral support, and comprehensive security—making it suited for products where compact footprint, multimedia capability, and industrial temperature operation are required.

Request a quote or submit a purchase inquiry to evaluate MCIMX6L3EVN10AB for your next embedded design.

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