MCIMX6QP4AVT1AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 120 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6QP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6QP4AVT1AB – IC MPU I.MX6QP 1.0GHZ 624FCBGA
The MCIMX6QP4AVT1AB is a 4-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors’ i.MX 6QP series, running at up to 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It integrates multimedia acceleration and a broad set of peripheral interfaces tailored for graphics- and media-focused embedded designs.
Designed for graphics-intensive and high-performance embedded applications, this device combines multi-core processing, dedicated multimedia/NEON SIMD capabilities, and comprehensive display and connectivity interfaces to simplify system design and integration.
Key Features
- Core Quad ARM® Cortex®-A9, 32-bit cores operating up to 1 GHz, providing multi-threaded processing for compute and multimedia workloads.
- Multimedia and SIMD Integrated multimedia co-processors with NEON™ SIMD support to accelerate signal processing and media tasks.
- Memory Controllers Supports LPDDR2, DDR3L and DDR3 memory interfaces for flexible system memory choices and performance scaling.
- Graphics and Display Graphics acceleration plus a range of display interfaces including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad control for advanced HMI and video applications.
- Storage and Networking Single Gigabit Ethernet (10/100/1000 Mbps) interface and one SATA 3 Gbps port for high-throughput networking and storage connectivity.
- USB and Peripheral I/O Multiple USB 2.0 ports with PHY (three host + one OTG) and additional interfaces such as CAN to support diverse peripheral ecosystems.
- Security and System Management Hardware security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS for system-level protection and secure boot options.
- Package and Mounting 624-FCBGA surface-mount package in a 21 × 21 mm form factor (0.8 mm pitch noted in series datasheet) for compact board designs.
- Operating Range Specified operating temperature from −40 °C to 125 °C for thermally demanding embedded environments.
- Compliance RoHS compliant.
Typical Applications
- Infotainment & Multimedia: High-performance media playback and user interfaces leveraging integrated graphics acceleration and HDMI/MIPI display outputs.
- Reconfigurable Instrumentation & Displays: Graphics-rich display systems and instrument clusters where multi-core processing and display interfaces enable responsive HMIs.
- Embedded Vision & Camera Systems: Camera sensor integration and image processing using the processor’s multimedia and NEON SIMD capabilities.
- Networked Embedded Systems: Devices requiring Gigabit Ethernet, SATA storage and multiple USB ports for connectivity and local data storage.
Unique Advantages
- Multi-core compute with multimedia acceleration: Four ARM Cortex‑A9 cores plus NEON SIMD deliver concurrent processing and media acceleration for demanding embedded workloads.
- Extensive display connectivity: Native support for HDMI, LVDS, MIPI/DSI and parallel LCD simplifies integration of advanced displays and HMIs.
- Broad peripheral set: Gigabit Ethernet, SATA, multiple USB ports and CAN enable flexible system architectures for networking, storage and control.
- Hardware security building blocks: On-chip security features (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide options for secure boot and runtime protection.
- Rugged operating range: −40 °C to 125 °C temperature rating supports deployment in thermally challenging embedded environments.
- Compact BGA package: 624-FCBGA in a 21 × 21 mm footprint allows high integration density for space-constrained boards.
Why Choose MCIMX6QP4AVT1AB?
The MCIMX6QP4AVT1AB delivers a balanced combination of multi-core processing, multimedia acceleration and wide-ranging I/O in a compact FCBGA package. It is well suited for embedded systems that demand responsive graphics, broad peripheral connectivity and on-chip security features.
As part of the i.MX 6 series family from NXP Semiconductors, this device offers designers a platform with scalable memory options, display interfaces and networking/storage capabilities that support diverse embedded designs while enabling integration and consolidation of system functions.
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