MCIMX6QP4AVT1AB

IC MPU I.MX6QP 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 120 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6QP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6QP4AVT1AB – IC MPU I.MX6QP 1.0GHZ 624FCBGA

The MCIMX6QP4AVT1AB is a 4-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors’ i.MX 6QP series, running at up to 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It integrates multimedia acceleration and a broad set of peripheral interfaces tailored for graphics- and media-focused embedded designs.

Designed for graphics-intensive and high-performance embedded applications, this device combines multi-core processing, dedicated multimedia/NEON SIMD capabilities, and comprehensive display and connectivity interfaces to simplify system design and integration.

Key Features

  • Core  Quad ARM® Cortex®-A9, 32-bit cores operating up to 1 GHz, providing multi-threaded processing for compute and multimedia workloads.
  • Multimedia and SIMD  Integrated multimedia co-processors with NEON™ SIMD support to accelerate signal processing and media tasks.
  • Memory Controllers  Supports LPDDR2, DDR3L and DDR3 memory interfaces for flexible system memory choices and performance scaling.
  • Graphics and Display  Graphics acceleration plus a range of display interfaces including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad control for advanced HMI and video applications.
  • Storage and Networking  Single Gigabit Ethernet (10/100/1000 Mbps) interface and one SATA 3 Gbps port for high-throughput networking and storage connectivity.
  • USB and Peripheral I/O  Multiple USB 2.0 ports with PHY (three host + one OTG) and additional interfaces such as CAN to support diverse peripheral ecosystems.
  • Security and System Management  Hardware security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS for system-level protection and secure boot options.
  • Package and Mounting  624-FCBGA surface-mount package in a 21 × 21 mm form factor (0.8 mm pitch noted in series datasheet) for compact board designs.
  • Operating Range  Specified operating temperature from −40 °C to 125 °C for thermally demanding embedded environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment & Multimedia: High-performance media playback and user interfaces leveraging integrated graphics acceleration and HDMI/MIPI display outputs.
  • Reconfigurable Instrumentation & Displays: Graphics-rich display systems and instrument clusters where multi-core processing and display interfaces enable responsive HMIs.
  • Embedded Vision & Camera Systems: Camera sensor integration and image processing using the processor’s multimedia and NEON SIMD capabilities.
  • Networked Embedded Systems: Devices requiring Gigabit Ethernet, SATA storage and multiple USB ports for connectivity and local data storage.

Unique Advantages

  • Multi-core compute with multimedia acceleration: Four ARM Cortex‑A9 cores plus NEON SIMD deliver concurrent processing and media acceleration for demanding embedded workloads.
  • Extensive display connectivity: Native support for HDMI, LVDS, MIPI/DSI and parallel LCD simplifies integration of advanced displays and HMIs.
  • Broad peripheral set: Gigabit Ethernet, SATA, multiple USB ports and CAN enable flexible system architectures for networking, storage and control.
  • Hardware security building blocks: On-chip security features (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide options for secure boot and runtime protection.
  • Rugged operating range: −40 °C to 125 °C temperature rating supports deployment in thermally challenging embedded environments.
  • Compact BGA package: 624-FCBGA in a 21 × 21 mm footprint allows high integration density for space-constrained boards.

Why Choose MCIMX6QP4AVT1AB?

The MCIMX6QP4AVT1AB delivers a balanced combination of multi-core processing, multimedia acceleration and wide-ranging I/O in a compact FCBGA package. It is well suited for embedded systems that demand responsive graphics, broad peripheral connectivity and on-chip security features.

As part of the i.MX 6 series family from NXP Semiconductors, this device offers designers a platform with scalable memory options, display interfaces and networking/storage capabilities that support diverse embedded designs while enabling integration and consolidation of system functions.

Request a quote or submit an inquiry for MCIMX6QP4AVT1AB to receive pricing and availability information tailored to your project needs.

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