MCIMX6QP4AVT1AA
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 382 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6QP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6QP4AVT1AA – IC MPU I.MX6QP 1.0GHZ 624FCBGA
The MCIMX6QP4AVT1AA is a quad-core ARM® Cortex®-A9 microprocessor running at 1.0 GHz in a 624-FCBGA (21×21) package, manufactured by NXP Semiconductors. It targets high-performance embedded multimedia and general-purpose applications that require multicore processing, hardware graphics acceleration and broad peripheral integration.
Built for processor-intensive embedded designs, the device combines four 32‑bit Cortex‑A9 cores with NEON SIMD acceleration, multiple memory controller options and a wide range of display and I/O interfaces to support rich user interfaces, connectivity and storage functions.
Key Features
- Core Quad ARM® Cortex®-A9 cores, 32‑bit architecture, operating at 1 GHz to handle parallel processing and multimedia workloads.
- SIMD/DSP Acceleration NEON™ SIMD and multimedia co-processor support for optimized signal and media processing.
- Memory Support Integrated controllers for LPDDR2, DDR3L and DDR3 providing flexible memory options for performance and power tradeoffs.
- Graphics and Display Graphics acceleration supported; display interfaces include HDMI, LVDS, MIPI/DSI and parallel LCD plus keypad support for rich user interfaces.
- High-Speed Connectivity Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps and multiple USB 2.0 ports (three USB 2.0 + PHY and one USB 2.0 OTG + PHY) for networking, storage and peripheral connectivity.
- Peripheral Interfaces Additional interfaces include CAN and other serial/peripheral connectivity to integrate with sensors, controllers and vehicle networks.
- Security Features On-chip security blocks including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot, crypto and system isolation.
- Package and Mounting 624‑FCBGA supplier device package (21×21 mm), surface-mount package suitable for compact embedded assemblies.
- Operating Range Rated for operation from −40 °C to 125 °C for designs requiring wide temperature tolerance.
Typical Applications
- Digital Signage and Kiosks Drives high-resolution displays and multimedia playback with integrated graphics acceleration and HDMI output.
- Human‑Machine Interfaces (HMI) Supports rich touch or LCD interfaces using MIPI/DSI, LVDS or parallel LCD with responsive multicore processing.
- IoT Gateways and Industrial Controllers Provides networking (Gigabit Ethernet, CAN), storage (SATA) and processing for edge compute, protocol bridging and local analytics.
- Portable and Fixed Consumer Devices Suitable for tablets, e‑readers and point‑of‑sale systems that require multimedia, USB connectivity and flexible memory support.
Unique Advantages
- Multicore Processing for Parallel Workloads: Four Cortex‑A9 cores enable separation of UI, networking, media and control tasks for smoother system performance.
- Flexible Memory Interfaces: Support for LPDDR2, DDR3L and DDR3 lets designers choose the optimal memory technology for cost, power and performance.
- Broad Display and I/O Integration: Multiple display outputs plus abundant USB, Ethernet, SATA and CAN interfaces reduce external component count and simplify system design.
- On‑Chip Security Primitives: Integrated TrustZone, CAAM and related blocks help implement secure boot and cryptographic services without additional security ICs.
- Wide Operating Temperature: −40 °C to 125 °C rating supports deployments in demanding thermal environments.
- Compact BGA Package: The 624‑FCBGA (21×21) package enables dense PCB layouts for space‑constrained embedded platforms.
Why Choose MCIMX6QP4AVT1AA?
The MCIMX6QP4AVT1AA delivers a balanced combination of multicore compute, multimedia acceleration and extensive peripheral integration in a compact surface‑mount package. Its design addresses demanding embedded applications where parallel processing, display capability and secure operation are required.
With flexible memory support and comprehensive connectivity (Ethernet, SATA, USB, CAN), this device is suitable for developers building consumer, industrial and IoT systems that need sustained performance, integrated features and long‑term platform support.
Request a quote or submit an inquiry to receive pricing and availability information for MCIMX6QP4AVT1AA and to discuss how it fits your embedded design requirements.

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