MCIMX6QP5EYM1AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21) |
|---|---|
| Quantity | 174 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6QP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 624-LFBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 1.0GHz | Supplier Device Package | 624-FCPBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6QP5EYM1AB – IC MPU I.MX6QP 1.0GHz 624-FCPBGA
The MCIMX6QP5EYM1AB is a multicore application processor built around four ARM® Cortex®‑A9 cores running at 1.0 GHz. Designed for graphics‑intensive and multimedia embedded designs, the device integrates a range of display, memory and peripheral interfaces to support Human Machine Interfaces (HMI), video processing and connected consumer applications.
With integrated multimedia acceleration, flexible memory controller support, and on‑chip security features, this i.MX 6QP processor delivers a balanced combination of compute, graphics and I/O integration for embedded systems requiring rich user interfaces and broad peripheral connectivity.
Key Features
- Core and Performance — Quad ARM® Cortex®‑A9 cores (32‑bit) running at 1 GHz for multicore application processing.
- Multimedia and Graphics — Multimedia/DSP support and NEON™ SIMD acceleration plus updated 2D/3D graphics processors and 1080p video processing as described in the series datasheet.
- Memory Support — Memory controller compatibility with LPDDR2, DDR3L and DDR3 to match system performance and power targets.
- Display Interfaces — Multiple display outputs including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad interface for flexible UI designs.
- Connectivity and Storage — Integrated Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, multiple USB 2.0 ports with PHY and USB OTG for peripherals and storage connectivity.
- Additional Interfaces — CAN and other general peripheral interfaces enable vehicle or industrial communications and control.
- Security and System Management — Hardware security features including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS for system-level secure boot and trusted execution.
- Power and Integration — Integrated power management features in the series help simplify system power design and reduce external component count.
- Package and Mounting — 624‑FCPBGA package (21 × 21 mm, 0.8 mm pitch) suitable for surface mount assembly.
- Operating Range and Compliance — Operating temperature range −20 °C to 105 °C and RoHS‑compliant device status.
Typical Applications
- Human Machine Interfaces (HMI) — High‑resolution display and graphics acceleration support interactive HMIs and touchscreen interfaces.
- Video Processing and Display — 1080p video processing capabilities and multiple display interfaces enable multimedia playback and multi‑screen systems.
- Consumer and Embedded Devices — Integrated peripheral interfaces (USB, SATA, Ethernet) support connected consumer products and embedded devices requiring rich media and storage options.
- Industrial Gateways and Controllers — Gigabit Ethernet, CAN and robust temperature range make the device suitable for industrial communication and control platforms.
Unique Advantages
- Highly integrated multimedia platform: Quad Cortex‑A9 cores plus NEON and updated 2D/3D graphics provide a consolidated engine for compute and visual workloads.
- Flexible memory and display options: Support for LPDDR2, DDR3L and DDR3 alongside HDMI, MIPI/DSI and LVDS enables a wide range of system architectures and display topologies.
- Broad connectivity and storage: On‑chip Gigabit Ethernet, SATA 3 Gbps and multiple USB ports reduce the need for discrete controllers and simplify board design.
- Built‑in security features: TrustZone, A‑HAB, CAAM and related subsystems help implement secure boot and runtime protection for connected products.
- Commercial temperature coverage: −20 °C to 105 °C operating range supports many embedded and industrial deployment environments.
- Compact BGA package: 21 × 21 mm FCPBGA package provides high I/O density in a compact footprint for space‑constrained designs.
Why Choose MCIMX6QP5EYM1AB?
The MCIMX6QP5EYM1AB delivers a balanced combination of multicore processing, multimedia acceleration and broad peripheral integration in a single 624‑FCPBGA device. Its ARM® Cortex®‑A9 quad‑core architecture, extensive display and connectivity options, and on‑chip security make it well suited for embedded systems that require rich user interfaces, video processing and reliable networked I/O.
This part is targeted at designers building HMIs, multimedia consumer devices and industrial controllers who need a compact, RoHS‑compliant processor offering flexible memory support, integrated power management features in the series, and a commercial temperature range for deployment across a variety of embedded applications.
Request a quote or submit a purchase inquiry to evaluate MCIMX6QP5EYM1AB for your next embedded design project.

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