 | | MCIMX6X1CVK08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 270 | |
 | | MCIMX6X1CVO08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 844 | |
| N/A | | MCIMX6X1CVO08ABR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,016 | |
| N/A | | MCIMX6X1CVO08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 317 | |
| N/A | | MCIMX6X1CVO08ACR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 496 | |
 | | MCIMX6X1EVK10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 1,632 | |
 | | MCIMX6X1EVK10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 132 | |
 | | MCIMX6X1EVO10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,961 | |
| N/A | | MCIMX6X1EVO10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,677 | |
 | | MCIMX6X2AVN08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,294 | |
| N/A | | MCIMX6X2AVN08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 612 | |
 | | MCIMX6X2CVN08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,201 | |
| N/A | | MCIMX6X2CVN08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 360 | |
 | | MCIMX6X2EVN10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 864 | |
 | | MCIMX6X2EVN10ABR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 687 | |
| N/A | | MCIMX6X2EVN10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,113 | |
| N/A | | MCIMX6X3CVK08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, LPDDR2, LVDDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 678 | |
| N/A | | MCIMX6X3CVK08ACR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, LPDDR2, LVDDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 1,511 | |
 | | MCIMX6X3CVN08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,897 | |
| N/A | | MCIMX6X3CVN08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,422 | |