MCIMX6U8DVM10AD
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 1,963 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 1.0GHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U8DVM10AD – IC MPU I.MX6DL 1.0GHZ 624MAPBGA
The MCIMX6U8DVM10AD is a dual-core ARM® Cortex®-A9 microprocessor IC from NXP Semiconductors, delivering up to 1.0 GHz performance in a 32-bit implementation. Built for embedded and consumer applications, the device integrates a broad set of memory controllers, display and peripheral interfaces, and hardware security features to support connected, graphics-capable designs.
With multiple high-speed interfaces and support for common memory types, this surface-mount 624-MAPBGA (21×21) packaged MPU is suited to designs that require CPU performance alongside multimedia and connectivity integration within a consumer-qualified footprint.
Key Features
- Processor Core – Dual ARM® Cortex®-A9 cores, 32-bit, running at 1 GHz for balanced application and multimedia processing.
- Memory Support – Integrated controllers for LPDDR2, LVDDR3 and DDR3 memories to match varied system memory requirements.
- Multimedia Acceleration – On-chip graphics acceleration and NEON™ SIMD multimedia co-processor to accelerate media and signal-processing tasks.
- Display and UI – Display interface controllers supporting LCD and keypad connectivity for human-machine interface implementations.
- Connectivity – Integrated Ethernet (10/100/1000 Mbps, single port), four USB 2.0 ports with PHYs, and additional CAN interface for robust networking and peripheral connectivity.
- Security – Hardware security suite including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection mechanisms.
- Package and Mounting – 624-MAPBGA (21×21) supplier device package in a 624-LFBGA case, designed for surface-mount assembly.
- Operating Range – Consumer-grade operating temperature range from 0°C to 95°C.
- Environmental Compliance – RoHS compliant.
Typical Applications
- Consumer Embedded Devices – Use as the application processor in consumer electronics that need multimedia processing, secure boot, and multiple peripheral interfaces.
- Human-Machine Interfaces (HMI) – Drive LCD displays and keypad inputs while providing graphics acceleration for responsive user interfaces.
- Networked Embedded Systems – Single-port gigabit Ethernet plus USB and CAN make the device suitable for connected appliances and network-capable products.
- Multimedia Gateways – Combine NEON SIMD and graphics acceleration with multiple USB and Ethernet interfaces for local media handling and peripheral connectivity.
Unique Advantages
- Dual-core CPU Performance: Dual ARM Cortex-A9 cores at 1 GHz provide multi-threaded application headroom while keeping system design straightforward.
- Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 enables designers to match memory technology to cost, power and performance targets.
- Comprehensive I/O Integration: Built-in Ethernet, multiple USB 2.0 + PHYs and CAN reduce external components and simplify board-level integration.
- Hardware Security Suite: Extensive security features, including ARM TrustZone and boot security, enable secure system architectures and protected data handling.
- Graphics and Multimedia Acceleration: On-chip graphics acceleration and NEON SIMD offload compute-intensive media tasks from the CPU.
- Compact Surface-Mount Package: 624-MAPBGA (21×21) packaging supports dense, space-constrained designs while enabling standard surface-mount assembly.
Why Choose MCIMX6U8DVM10AD?
The MCIMX6U8DVM10AD combines dual-core Cortex-A9 processing at 1.0 GHz with integrated multimedia acceleration, broad memory support, and a comprehensive set of high-speed interfaces. These attributes position the device for consumer and embedded designs that require a balance of application performance, multimedia capability, security and connectivity within a compact surface-mount package.
Manufactured by NXP Semiconductors and RoHS compliant, this MPU is appropriate for teams building consumer-qualified products that need integrated peripherals, secure boot and flexible memory options to meet diverse system requirements.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for MCIMX6U8DVM10AD. Our team can provide details to help you evaluate the part for your next embedded project.

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