MCIMX6U8DVM10AD

IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 1,963 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U8DVM10AD – IC MPU I.MX6DL 1.0GHZ 624MAPBGA

The MCIMX6U8DVM10AD is a dual-core ARM® Cortex®-A9 microprocessor IC from NXP Semiconductors, delivering up to 1.0 GHz performance in a 32-bit implementation. Built for embedded and consumer applications, the device integrates a broad set of memory controllers, display and peripheral interfaces, and hardware security features to support connected, graphics-capable designs.

With multiple high-speed interfaces and support for common memory types, this surface-mount 624-MAPBGA (21×21) packaged MPU is suited to designs that require CPU performance alongside multimedia and connectivity integration within a consumer-qualified footprint.

Key Features

  • Processor Core – Dual ARM® Cortex®-A9 cores, 32-bit, running at 1 GHz for balanced application and multimedia processing.
  • Memory Support – Integrated controllers for LPDDR2, LVDDR3 and DDR3 memories to match varied system memory requirements.
  • Multimedia Acceleration – On-chip graphics acceleration and NEON™ SIMD multimedia co-processor to accelerate media and signal-processing tasks.
  • Display and UI – Display interface controllers supporting LCD and keypad connectivity for human-machine interface implementations.
  • Connectivity – Integrated Ethernet (10/100/1000 Mbps, single port), four USB 2.0 ports with PHYs, and additional CAN interface for robust networking and peripheral connectivity.
  • Security – Hardware security suite including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection mechanisms.
  • Package and Mounting – 624-MAPBGA (21×21) supplier device package in a 624-LFBGA case, designed for surface-mount assembly.
  • Operating Range – Consumer-grade operating temperature range from 0°C to 95°C.
  • Environmental Compliance – RoHS compliant.

Typical Applications

  • Consumer Embedded Devices – Use as the application processor in consumer electronics that need multimedia processing, secure boot, and multiple peripheral interfaces.
  • Human-Machine Interfaces (HMI) – Drive LCD displays and keypad inputs while providing graphics acceleration for responsive user interfaces.
  • Networked Embedded Systems – Single-port gigabit Ethernet plus USB and CAN make the device suitable for connected appliances and network-capable products.
  • Multimedia Gateways – Combine NEON SIMD and graphics acceleration with multiple USB and Ethernet interfaces for local media handling and peripheral connectivity.

Unique Advantages

  • Dual-core CPU Performance: Dual ARM Cortex-A9 cores at 1 GHz provide multi-threaded application headroom while keeping system design straightforward.
  • Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 enables designers to match memory technology to cost, power and performance targets.
  • Comprehensive I/O Integration: Built-in Ethernet, multiple USB 2.0 + PHYs and CAN reduce external components and simplify board-level integration.
  • Hardware Security Suite: Extensive security features, including ARM TrustZone and boot security, enable secure system architectures and protected data handling.
  • Graphics and Multimedia Acceleration: On-chip graphics acceleration and NEON SIMD offload compute-intensive media tasks from the CPU.
  • Compact Surface-Mount Package: 624-MAPBGA (21×21) packaging supports dense, space-constrained designs while enabling standard surface-mount assembly.

Why Choose MCIMX6U8DVM10AD?

The MCIMX6U8DVM10AD combines dual-core Cortex-A9 processing at 1.0 GHz with integrated multimedia acceleration, broad memory support, and a comprehensive set of high-speed interfaces. These attributes position the device for consumer and embedded designs that require a balance of application performance, multimedia capability, security and connectivity within a compact surface-mount package.

Manufactured by NXP Semiconductors and RoHS compliant, this MPU is appropriate for teams building consumer-qualified products that need integrated peripherals, secure boot and flexible memory options to meet diverse system requirements.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for MCIMX6U8DVM10AD. Our team can provide details to help you evaluate the part for your next embedded project.

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