MCIMX6U8DVM10AB

IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 1,175 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U8DVM10AB – IC MPU I.MX6DL 1.0GHZ 624MAPBGA

The MCIMX6U8DVM10AB is a dual‑core ARM® Cortex®‑A9 microprocessor running at 1.0 GHz, offered in a 624‑MAPBGA (21×21 mm) package. It delivers multimedia‑focused processing with integrated graphics acceleration and broad peripheral support for embedded consumer applications.

Built for connected multimedia and HMI designs, this i.MX 6U series device combines dual‑core compute, NEON™ SIMD acceleration and a flexible memory interface to enable responsive user interfaces, multimedia playback and networked device functions while maintaining board‑level integration and RoHS compliance.

Key Features

  • Processor Core — Dual ARM® Cortex®‑A9 cores at 1 GHz providing 32‑bit processing across two cores for parallel application and OS tasks.
  • Multimedia & Acceleration — Graphics acceleration and NEON™ SIMD co‑processor support multimedia workloads and optimized data processing.
  • Memory Interfaces — On‑chip controllers supporting LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory design.
  • Display & UI — Integrated display interface controllers for LCD and keypad integration to support graphical user interfaces.
  • Connectivity — Integrated 10/100/1000 Mbps Ethernet (1) plus four USB 2.0 ports with PHY and additional CAN interface for wired connectivity options.
  • Security Features — Hardware security provisions including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection.
  • Package & Mounting — 624‑MAPBGA (21×21 mm) surface‑mount package suitable for compact embedded boards.
  • Operating Range & Compliance — Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Multimedia Tablets and Portable Devices — Dual‑core Cortex‑A9 performance with graphics acceleration supports responsive UIs and multimedia playback.
  • Human‑Machine Interfaces (HMIs) — Integrated display controllers and keypad interfaces enable responsive control panels and interactive displays.
  • Connected Embedded Gateways — Built‑in Gigabit Ethernet, multiple USB ports and CAN support networked device connectivity and peripheral integration.
  • Consumer Electronics — Security features and integrated power management capabilities support secure boot and protected storage for consumer products.

Unique Advantages

  • Highly integrated multimedia platform: Dual‑core CPU, graphics acceleration and NEON SIMD reduce external co‑processor requirements and simplify BOM.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller options give designers freedom to optimize cost and performance tradeoffs.
  • Comprehensive I/O set: Gigabit Ethernet, multiple USB 2.0 ports with PHY and CAN provide broad connectivity without extensive external logic.
  • Hardware security stack: Multiple security mechanisms including TrustZone, cryptography and secure fusebox enable hardware‑anchored protection models.
  • Compact surface‑mount package: 624‑MAPBGA (21×21 mm) footprint supports space‑constrained designs while enabling high pin‑count integration.
  • RoHS compliant and consumer qualified: Meets lead‑free manufacturing requirements and targets consumer applications within the specified temperature range.

Why Choose MCIMX6U8DVM10AB?

MCIMX6U8DVM10AB positions itself as a balanced embedded MPU for consumer multimedia and HMI applications, combining dual ARM® Cortex®‑A9 cores, multimedia acceleration and extensive peripheral connectivity in a compact BGA package. Its flexible memory support and hardware security features make it suitable for designs that require responsive user interfaces, multimedia handling and protected boot/storage.

This device is suitable for engineers building consumer‑grade embedded systems that need integrated connectivity, display capability and hardware security, while maintaining RoHS compliance and compact board footprint. The combination of performance, integration and peripheral density supports streamlined system design and scalable product development.

Request a quote or submit a purchase inquiry to begin specifying the MCIMX6U8DVM10AB for your next embedded design.

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