MCIMX6V2CVM08AB

IC MPU I.MX6SLL 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6SLL 1 Core, 32-Bit 800MHz 400-MAPBGA (14x14)

Quantity 1,680 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6V
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package400-MAPBGA (14x14)
Display & Interface ControllersEPDC, LCDECCN5A992CGraphics AccelerationYes
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)
Package / Case400-LFBGARAM ControllersLPDDR2, LPDDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVSSpeed800MHz
Supplier Device Package400-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of MCIMX6V2CVM08AB – IC MPU I.MX6SLL 800MHZ 400MAPBGA

The MCIMX6V2CVM08AB is an NXP i.MX 6SLL family applications microprocessor featuring a single ARM® Cortex®-A9 core running up to 800 MHz. The device is optimized for low power consumption while providing multimedia acceleration and a range of peripheral interfaces suitable for embedded and industrial applications.

Designed for compact, display-driven and connected products, this industrial-qualified MPU integrates security features and flexible memory and display support to enable robust, low-power system designs.

Key Features

  • Core & Acceleration  Single ARM® Cortex®-A9 core at up to 800 MHz with NEON™ SIMD and floating point engine for multimedia processing and signal acceleration.
  • Memory Support  32-bit DDR interface with support for LPDDR2 and LPDDR3 memory controllers for flexible system memory configurations.
  • Display  Integrated display interface controllers including EPDC and LCD support for color and monochrome display applications.
  • USB Connectivity  Dual USB 2.0 OTG controllers with integrated PHYs to support host and device connectivity.
  • Security  Hardware security features including A-HAB, ARM TrustZone (ARM TZ), CSU, SJC and SNVS for secure boot and runtime protection.
  • Peripheral Ecosystem  Multiple peripheral interfaces to connect WLAN, Bluetooth, GPS, storage, displays and camera sensors as noted in the product datasheet.
  • Package & Mounting  400-MAPBGA package (14 × 14 mm, 0.65 mm pitch) in a surface-mount plastic BGA package for compact PCB integration.
  • Operating Range & Qualification  Industrial-qualified device with an operating temperature range of −40 °C to 105 °C for use in demanding environments.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Color and Monochrome eReaders  Display controllers and low-power operation make the MCU suitable for eReader applications requiring efficient image and display processing.
  • Barcode Scanners  On-chip multimedia acceleration and peripheral connectivity support fast image processing and sensor interfaces for barcode capture systems.
  • Connectivity Devices  USB OTG, peripheral interfaces and security features enable connected gateways, wireless modules and communication endpoints.
  • IoT Devices  Low-power optimized architecture with secure boot capabilities supports a range of IoT edge devices that require reliable field operation.

Unique Advantages

  • Highly integrated multimedia processing: Single Cortex‑A9 with NEON SIMD and floating point engine consolidates compute and media tasks, reducing external accelerator needs.
  • Flexible memory and display options: LPDDR2/LPDDR3 support plus EPDC/LCD controllers simplify designs targeting varied display types and memory footprints.
  • Industrial temperature range: −40 °C to 105 °C qualification supports deployment in harsh or temperature-variable environments.
  • Built-in security primitives: A-HAB, ARM TrustZone, CSU, SJC and SNVS provide layered security for secure boot and runtime protection.
  • Compact, manufacturable package: 400‑MAPBGA (14 × 14 mm) with 0.65 mm pitch enables high-density, surface-mount PCB layouts for space-constrained products.
  • Ready for connected peripherals: On-chip USB OTG PHYs and a broad set of peripheral interfaces speed integration with wireless modules, sensors and cameras.

Why Choose MCIMX6V2CVM08AB?

The MCIMX6V2CVM08AB brings a balance of efficient single-core performance, multimedia acceleration and industrial-grade robustness in a compact BGA package. Its combination of LPDDR memory support, display controllers, USB OTG interfaces and hardware security features makes it well suited for embedded designs that require reliable operation, secure boot and flexible peripheral integration.

This part is positioned for engineers building integrated, low-power systems such as eReaders, barcode scanners, IoT devices and connectivity endpoints who need an industrial-qualified processor with a readily accessible feature set and NXP’s documented technical resources.

Request a quote or submit an inquiry for MCIMX6V2CVM08AB to our sales team to discuss availability, pricing and integration support.

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