 | | MCIMX7D5EVM10SC | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 471 | |
 | | MCIMX7D5EVM10SD | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 918 | |
 | | MCIMX7D7DVK10SC | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,131 | |
 | | MCIMX7D7DVK10SD | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,049 | |
 | | MCIMX7D7DVM10SC | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 227 | |
 | | MCIMX7D7DVM10SD | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 539 | |
 | | MCIMX7S3DVK08SC | NXP Semiconductors | IC MPU I.MX7S 800MHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 686 | |
 | | MCIMX7S3DVK08SD | NXP Semiconductors | IC MPU I.MX7S 800MHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 253 | |
| N/A | | MCIMX7S3EVK08SC | NXP Semiconductors | IC MPU 800MHZ 488MAPBGA | Microprocessors | 488-MAPBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-MAPBGA (12×12) | 787 | |
 | | MCIMX7S3EVK08SD | NXP Semiconductors | IC MPU I.MX7S 800MHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 356 | |
 | | MCIMX7S5EVK08SC | NXP Semiconductors | IC MPU I.MX7S 800MHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 412 | |
 | | MCIMX7S5EVK08SD | NXP Semiconductors | IC MPU I.MX7S 800MHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,188 | |
 | | MCIMX7S5EVM08SC | NXP Semiconductors | IC MPU I.MX7S 800MHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 1,597 | |
 | | MCIMX7S5EVM08SD | NXP Semiconductors | IC MPU I.MX7S 800MHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 1,198 | |
 | | MCIMX7U3CVP06SC | NXP Semiconductors | IC MPU I.MX7ULP 650MHZ | Microprocessors | N/A | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: -40°C ~ 105°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | 301 | |
 | | MCIMX7U3CVP06SD | NXP Semiconductors | IC I.MX 7ULP MAPBGA 393 | Microprocessors | N/A | N/A | N/A | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A7 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-M4 Display & Interface Controllers: MIPI-DSI | 99 | |
 | | MCIMX7U3DVK07SC | NXP Semiconductors | IC MPU I.MX7ULP 720MHZ | Microprocessors | N/A | N/A | 0°C ~ 95°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: 0°C ~ 95°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | 665 | |
| N/A | | MCIMX7U3DVK07SD | NXP Semiconductors | IC MPU I.MX7ULP 720MHZ 361VFBGA | Microprocessors | 361-VFBGA (10x10) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: 0°C ~ 95°C (TJ) Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot Mounting Type: Surface Mount Supplier Device Package: 361-VFBGA (10×10) | 10 | |
 | | MCIMX7U5CVP06SC | NXP Semiconductors | IC MPU I.MX7ULP 650MHZ | Microprocessors | N/A | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: -40°C ~ 105°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | 654 | |
 | | MCIMX7U5DVK07SC | NXP Semiconductors | IC MPU I.MX7ULP 720MHZ | Microprocessors | N/A | N/A | 0°C ~ 95°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Operating Temperature: 0°C ~ 95°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | 205 | |