Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX7D5EVM10SCMCIMX7D5EVM10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
471
MCIMX7D5EVM10SDMCIMX7D5EVM10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
918
MCIMX7D7DVK10SCMCIMX7D7DVK10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
1,131
MCIMX7D7DVK10SDMCIMX7D7DVK10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
1,049
MCIMX7D7DVM10SCMCIMX7D7DVM10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
227
MCIMX7D7DVM10SDMCIMX7D7DVM10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
539
MCIMX7S3DVK08SCMCIMX7S3DVK08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
686
MCIMX7S3DVK08SDMCIMX7S3DVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
253
N/AMCIMX7S3EVK08SCNXP SemiconductorsIC MPU 800MHZ 488MAPBGAMicroprocessors488-MAPBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-MAPBGA (12×12)
787
MCIMX7S3EVK08SDMCIMX7S3EVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
356
MCIMX7S5EVK08SCMCIMX7S5EVK08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
412
MCIMX7S5EVK08SDMCIMX7S5EVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
1,188
MCIMX7S5EVM08SCMCIMX7S5EVM08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
1,597
MCIMX7S5EVM08SDMCIMX7S5EVM08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
1,198
MCIMX7U3CVP06SCMCIMX7U3CVP06SCNXP SemiconductorsIC MPU I.MX7ULP 650MHZMicroprocessorsN/AN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 105°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
301
MCIMX7U3CVP06SDMCIMX7U3CVP06SDNXP SemiconductorsIC I.MX 7ULP MAPBGA 393MicroprocessorsN/AN/AN/A
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
RAM Controllers:
LPDDR2, LPDDR3
USB:
USB 2.0 (2)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-M4
Display & Interface Controllers:
MIPI-DSI
Qualification:
Industrial
99
MCIMX7U3DVK07SCMCIMX7U3DVK07SCNXP SemiconductorsIC MPU I.MX7ULP 720MHZMicroprocessorsN/AN/A0°C ~ 95°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
665
N/AMCIMX7U3DVK07SDNXP SemiconductorsIC MPU I.MX7ULP 720MHZ 361VFBGAMicroprocessors361-VFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Mounting Type:
Surface Mount
Package / Case:
361-VFBGA
Supplier Device Package:
361-VFBGA (10×10)
10
MCIMX7U5CVP06SCMCIMX7U5CVP06SCNXP SemiconductorsIC MPU I.MX7ULP 650MHZMicroprocessorsN/AN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 105°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
654
MCIMX7U5DVK07SCMCIMX7U5DVK07SCNXP SemiconductorsIC MPU I.MX7ULP 720MHZMicroprocessorsN/AN/A0°C ~ 95°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
205

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