 | | MPF500TS-1FCG784I | Microchip Technology | IC FPGA 388 I/O 784FCBGA | FPGAs | 784-FCBGA (29x29) | 970 mV - 1.08 V | -40°C – 100°C | Number of LABs/CLBs: 120250 Number of Logic Elements/Cells: 481000 | 717 | |
 | | MPF500TS-FC1152M | Microchip Technology | POLARFIRE FPGA 1152-BGA | FPGAs | 1152-FCBGA (35x35) | 970 mV - 1.08 V | -55°C – 125°C | Number of LABs/CLBs: 120250 Number of Logic Elements/Cells: 481000 | 378 | |
 | | MPF500TS-FC784M | Microchip Technology | POLARFIRE FPGA 784-BGA | FPGAs | 784-FCBGA (29x29) | 970 mV - 1.08 V | -55°C – 125°C | Number of LABs/CLBs: 120250 Number of Logic Elements/Cells: 481000 | 199 | |
 | | MPF500TS-FCG1152I | Microchip Technology | IC FPGA 584 I/O 1152FCBGA | FPGAs | 1152-FCBGA (35x35) | 970 mV - 1.08 V | -40°C – 100°C | Number of LABs/CLBs: 120250 Number of Logic Elements/Cells: 481000 | 1,154 | |
 | | MPF500TS-FCG784I | Microchip Technology | IC FPGA 388 I/O 784FCBGA | FPGAs | 784-FCBGA (29x29) | 970 mV - 1.08 V | -40°C – 100°C | Number of LABs/CLBs: 120250 Number of Logic Elements/Cells: 481000 | 358 | |
 | | MPL485A-I/AJA | Microchip Technology | IC MPU 100MHZ 121TFBGA | Microprocessors | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES 128, 192, 256 Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) | 603 | |
 | | MPL485AT-I/AJA | Microchip Technology | IC MPU 100MHZ 121TFBGA | Microprocessors | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES 128, 192, 256 Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) | 856 | |
 | N/A | MPM7128QC100AA | Intel | IC FPGA 100QFP | FPGAs | 100-PQFP (20x14) | 3 V - 3.6 V | 0°C – 70°C | Number of Logic Elements/Cells: N/A | 898 | |
 | | MPT612FBD48,151 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,380 | |
 | | MPXD1005VLQ64 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 812 | |
 | | MPXD1010VLQ64 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,427 | |
 | | MPXD2020VLT125 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 20x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 1,901 | |
 | | MPXD2020VLU125 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 197 | |
 | | MPXD2020VVU125 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 20x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 914 | |
 | | MPXN2120VMG116 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 64x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 455 | |
 | | MPXR4030VVU264 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,156 | |
 | | MPXR4040VVU264 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 296 | |
 | | MPXS2010VLQ120 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 729 | |
 | | MPXS2010VLQ80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 633 | |
| N/A | | MQ801866 | Intel | RISC MPU, 16-BIT | Microprocessors | N/A | N/A | -55 °C – 125 °C | Number of Cores/Bus Width: 1 Core, 16-Bit Co-Processors/DSP: External 80187 FPU | 443 | |