Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPF500TS-1FCG784IMPF500TS-1FCG784IMicrochip TechnologyIC FPGA 388 I/O 784FCBGAFPGAs784-FCBGA (29x29)970 mV - 1.08 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
388
Number of LABs/CLBs:
120250
Number of Logic Elements/Cells:
481000
Qualification:
N/A
Total RAM Bits:
33792000
717
MPF500TS-FC1152MMPF500TS-FC1152MMicrochip TechnologyPOLARFIRE FPGA 1152-BGAFPGAs1152-FCBGA (35x35)970 mV - 1.08 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
584
Number of LABs/CLBs:
120250
Number of Logic Elements/Cells:
481000
Qualification:
N/A
Total RAM Bits:
34603008
378
MPF500TS-FC784MMPF500TS-FC784MMicrochip TechnologyPOLARFIRE FPGA 784-BGAFPGAs784-FCBGA (29x29)970 mV - 1.08 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
388
Number of LABs/CLBs:
120250
Number of Logic Elements/Cells:
481000
Qualification:
N/A
Total RAM Bits:
34603008
199
MPF500TS-FCG1152IMPF500TS-FCG1152IMicrochip TechnologyIC FPGA 584 I/O 1152FCBGAFPGAs1152-FCBGA (35x35)970 mV - 1.08 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
584
Number of LABs/CLBs:
120250
Number of Logic Elements/Cells:
481000
Qualification:
N/A
Total RAM Bits:
33792000
1,154
MPF500TS-FCG784IMPF500TS-FCG784IMicrochip TechnologyIC FPGA 388 I/O 784FCBGAFPGAs784-FCBGA (29x29)970 mV - 1.08 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
388
Number of LABs/CLBs:
120250
Number of Logic Elements/Cells:
481000
Qualification:
N/A
Total RAM Bits:
33792000
358
MPL485A-I/AJAMPL485A-I/AJAMicrochip TechnologyIC MPU 100MHZ 121TFBGAMicroprocessors121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES 128, 192, 256
Mounting Type:
Surface Mount
Package / Case:
121-TFBGA
Supplier Device Package:
121-TFBGA (10×10)
Grade:
Industrial
603
MPL485AT-I/AJAMPL485AT-I/AJAMicrochip TechnologyIC MPU 100MHZ 121TFBGAMicroprocessors121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES 128, 192, 256
Mounting Type:
Surface Mount
Package / Case:
121-TFBGA
Supplier Device Package:
121-TFBGA (10×10)
Grade:
Industrial
856
MPM7128QC100AAN/AMPM7128QC100AAIntelIC FPGA 100QFPFPGAs100-PQFP (20x14)3 V - 3.6 V0°C – 70°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
68
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
N/A
Qualification:
N/A
Total RAM Bits:
N/A
898
MPT612FBD48,151MPT612FBD48,151NXP SemiconductorsIC MCU 32BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,380
MPXD1005VLQ64MPXD1005VLQ64NXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
812
MPXD1010VLQ64MPXD1010VLQ64NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,427
MPXD2020VLT125MPXD2020VLT125NXP SemiconductorsIC MCU 32BIT 2MB FLASH 208TQFPMicrocontrollers208-TQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
150
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TQFP (28×28)
Package / Case:
208-LQFP
1,901
MPXD2020VLU125MPXD2020VLU125NXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
197
MPXD2020VVU125MPXD2020VVU125NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
177
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
914
MPXN2120VMG116MPXN2120VMG116NXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
455
MPXR4030VVU264MPXR4030VVU264NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
198
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,156
MPXR4040VVU264MPXR4040VVU264NXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
198
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
296
MPXS2010VLQ120MPXS2010VLQ120NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
729
MPXS2010VLQ80MPXS2010VLQ80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
633
N/AMQ801866IntelRISC MPU, 16-BITMicroprocessorsN/AN/A-55 °C – 125 °C
Core Processor:
80186
Number of Cores/Bus Width:
1 Core, 16-Bit
RAM Controllers:
DRAM
Grade:
Military
Graphics Acceleration:
No
Co-Processors/DSP:
External 80187 FPU
443

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