Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SAM9X70T-I/4PB
SAM9X70T-I/4PBMicrochip TechnologyARM926 MPU,BGA,I TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,140
N/A
SAM9X70T-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
891
SAM9X72-I/4PB
SAM9X72-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
245
N/A
SAM9X72-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,720
SAM9X72T-I/4PB
SAM9X72T-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
812
N/A
SAM9X72T-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,006
SAM9X75-I/4PB
SAM9X75-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
834
N/A
SAM9X75-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,745
SAM9X75D1G-I/4TB
SAM9X75D1G-I/4TBMicrochip TechnologyARM926 MPU, 1GBIT DDR3L,MIPI,LVDMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
435
SAM9X75D1GT-I/4TB
SAM9X75D1GT-I/4TBMicrochip TechnologyARM926 MPU,1GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
105
SAM9X75D2G-I/4TB
SAM9X75D2G-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
128
SAM9X75D2GT-I/4TB
SAM9X75D2GT-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,539
SAM9X75T-I/4PB
SAM9X75T-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,877
N/A
SAM9X75T-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
974
N/A
SAMA7G54-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
1,706
SAMA7G54-V/4HB
SAMA7G54-V/4HBMicrochip TechnologyIC MPU SAMA7G5 1GHZ 343TFBGAMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB 2.0 PHY (3), USB Type-C (2)
Voltage – I/O:
3.3V, 5V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
1,611
SAMA7G54D1G-I/4UB
SAMA7G54D1G-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,348
SAMA7G54D1GT-I/4UB
SAMA7G54D1GT-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,589
SAMA7G54D2G-I/4UB
SAMA7G54D2G-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
345
SAMA7G54D2GT-I/4UB
SAMA7G54D2GT-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,388

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