| N/A | | SAL-TC290TC-96F300 BC | Infineon Technologies | IC MCU 32BIT 6MB FLASH DIE | Microcontrollers | Die | N/A | -40°C ~ 170°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 170°C (TA) Mounting Type: Surface Mount Supplier Device Package: Die | 848 | |
| N/A | N/A | SAL-TC290TP-128F300 BB | Infineon Technologies | IC MCU 32BIT 8MB FLASH DIE | Microcontrollers | Die | N/A | -40°C ~ 170°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, POR, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 170°C (TA) Mounting Type: Surface Mount Supplier Device Package: Die | 764 | |
| N/A | | SAL-TC290TP-128F300N BC | Infineon Technologies | IC MCU 32BIT 8MB FLASH DIE | Microcontrollers | Die | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: Die | 169 | |
 | | SAL-TC298TP-128F300N BC | Infineon Technologies | IC MCU 32BIT 8MB FLASH 416BGA | Microcontrollers | PG-BGA-416-26 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416-26 | 260 | |
 | | SAL-TC299TP-128F300N BC | Infineon Technologies | IC MCU 32BIT 8MB FLASH 516LFBGA | Microcontrollers | PG-LFBGA-516-5 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-516-5 | 1,154 | |
| N/A | N/A | SAL-TC299TP-128F300S BB | Infineon Technologies | IC MCU 32BIT 8MB FLASH 516LFBGA | Microcontrollers | PG-LFBGA-516-5 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 94x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-516-5 | 687 | |
 | | SAL-XC886-8FFA 5V AC | Infineon Technologies | IC MCU 8BIT 32KB FLASH 48TQFP | Microcontrollers | PG-TQFP-48 | N/A | -40°C ~ 150°C (TA) | Connectivity: SSI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-48 | 16 | |
 | | SAM9X60-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) | 135 | |
 | | SAM9X60-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 793 | |
 | | SAM9X60D1G-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 1,488 | |
 | | SAM9X60D1G-I/LZB | Microchip Technology | IC MPU SAM9X 600MHZ | Microprocessors | - | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,078 | |
 | | SAM9X60D1GT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 1,359 | |
 | | SAM9X60D5M-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 89 | |
 | | SAM9X60D5MT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 233-TFBGA (14×14) | 656 | |
 | | SAM9X60D6K-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 778 | |
 | | SAM9X60D6KT-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 100 | |
 | | SAM9X60T-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) | 638 | |
 | | SAM9X60T-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,400 | |
 | | SAM9X70-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,TRAY | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 807 | |
| N/A | | SAM9X70-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,380 | |