Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
SAL-TC290TC-96F300 BCInfineon TechnologiesIC MCU 32BIT 6MB FLASH DIEMicrocontrollersDieN/A-40°C ~ 170°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, POR, WDT
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
456K x 8
Voltage – Supply (Vcc/Vdd):
1.17V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 170°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Die
Package / Case:
Die
848
N/AN/ASAL-TC290TP-128F300 BBInfineon TechnologiesIC MCU 32BIT 8MB FLASH DIEMicrocontrollersDieN/A-40°C ~ 170°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, POR, WDT
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
456K x 8
Voltage – Supply (Vcc/Vdd):
1.17V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 170°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Die
Package / Case:
Die
764
N/A
SAL-TC290TP-128F300N BCInfineon TechnologiesIC MCU 32BIT 8MB FLASH DIEMicrocontrollersDieN/A-40°C ~ 150°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
169
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
768K x 8
RAM Size:
728K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Die
Package / Case:
Die
169
SAL-TC298TP-128F300N BC
SAL-TC298TP-128F300N BCInfineon TechnologiesIC MCU 32BIT 8MB FLASH 416BGAMicrocontrollersPG-BGA-416-26N/A-40°C ~ 150°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
169
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
768K x 8
RAM Size:
728K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-BGA-416-26
Package / Case:
416-BGA
260
SAL-TC299TP-128F300N BC
SAL-TC299TP-128F300N BCInfineon TechnologiesIC MCU 32BIT 8MB FLASH 516LFBGAMicrocontrollersPG-LFBGA-516-5N/A-40°C ~ 150°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
263
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
768K x 8
RAM Size:
728K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-LFBGA-516-5
Package / Case:
516-LFBGA
1,154
N/AN/ASAL-TC299TP-128F300S BBInfineon TechnologiesIC MCU 32BIT 8MB FLASH 516LFBGAMicrocontrollersPG-LFBGA-516-5N/A-40°C ~ 150°C (TA)
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
169
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
768K x 8
RAM Size:
728K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 94x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-LFBGA-516-5
Package / Case:
516-LFBGA
687
SAL-XC886-8FFA 5V AC
SAL-XC886-8FFA 5V ACInfineon TechnologiesIC MCU 8BIT 32KB FLASH 48TQFPMicrocontrollersPG-TQFP-48N/A-40°C ~ 150°C (TA)
Core Processor:
XC800
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1.75K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-48
Package / Case:
48-LQFP
16
SAM9X60-V/DWB
SAM9X60-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
135
SAM9X60-V/DWBVAO
SAM9X60-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
793
SAM9X60D1G-I/4FB
SAM9X60D1G-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
1,488
SAM9X60D1G-I/LZB
SAM9X60D1G-I/LZBMicrochip TechnologyIC MPU SAM9X 600MHZMicroprocessors-N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
1,078
SAM9X60D1GT-I/4FB
SAM9X60D1GT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
1,359
SAM9X60D5M-I/4FB
SAM9X60D5M-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
89
SAM9X60D5MT-I/4FB
SAM9X60D5MT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
656
SAM9X60D6K-I/4GB
SAM9X60D6K-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
778
SAM9X60D6KT-I/4GB
SAM9X60D6KT-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
100
SAM9X60T-V/DWB
SAM9X60T-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
638
SAM9X60T-V/DWBVAO
SAM9X60T-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
1,400
SAM9X70-I/4PB
SAM9X70-I/4PBMicrochip TechnologyARM926 MPU,BGA,I TEMP,TRAYMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
807
N/A
SAM9X70-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMPMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,380

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