Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AM26LV32INSG4
AM26LV32INSG4Texas InstrumentsIC RECEIVER 0/4 16SODrivers, Receivers, Transceivers16-SO3V ~ 3.6V-40°C ~ 85°C
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
50 mV
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.209″”, 5.30mm Width)
Supplier Device Package:
16-SO
143
AM26LV32INSR
AM26LV32INSRTexas InstrumentsIC RECEIVER 0/4 16SODrivers, Receivers, Transceivers16-SO3V ~ 3.6V-40°C ~ 85°C
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
50 mV
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.209″”, 5.30mm Width)
Supplier Device Package:
16-SO
173
AM26S10CD
AM26S10CDTexas InstrumentsIC TRANSCEIVER FULL 4/4 16SOICDrivers, Receivers, Transceivers16-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Number of Drivers/Receivers:
4/4
Duplex:
Full
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,907
AM26S10CDR
AM26S10CDRTexas InstrumentsIC TRANSCEIVER FULL 4/4 16SOICDrivers, Receivers, Transceivers16-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Number of Drivers/Receivers:
4/4
Duplex:
Full
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,524
AM26S10CDRG4
AM26S10CDRG4Texas InstrumentsIC TRANSCEIVER FULL 4/4 16SOICDrivers, Receivers, Transceivers16-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Number of Drivers/Receivers:
4/4
Duplex:
Full
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,073
AM26S10CN
AM26S10CNTexas InstrumentsIC TRANSCEIVER FULL 4/4 16DIPDrivers, Receivers, Transceivers16-PDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Number of Drivers/Receivers:
4/4
Duplex:
Full
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
444
AM26S10CNE4
AM26S10CNE4Texas InstrumentsIC TRANSCEIVER HALF 4/4 16DIPDrivers, Receivers, Transceivers16-PDIP4.75V ~ 5.25V0°C ~ 70°C (TA)
Type:
Transceiver
Number of Drivers/Receivers:
4/4
Duplex:
Half
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
547
AM26S11CD
AM26S11CDTexas InstrumentsIC LINE TRANSCEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

509
AM2731CASFHQNZNRQ1
AM2731CASFHQNZNRQ1Texas InstrumentsICMicroprocessors255-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 140°C (TJ)
Security Features:
AES, DRBG TRNG, PKA
Mounting Type:
Surface Mount
Package / Case:
255-LFBGA
Supplier Device Package:
255-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
330
AM2731CLSFHQNZNRQ1
AM2731CLSFHQNZNRQ1Texas InstrumentsAUTOMOTIVE DUAL-CORE ARM CORTEX-Microprocessors255-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 140°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
255-LFBGA
Supplier Device Package:
255-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
1,155
AM2731CNSFHQNZNRQ1
AM2731CNSFHQNZNRQ1Texas InstrumentsICMicroprocessors255-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 140°C (TJ)
Security Features:
AES, DRBG TRNG, PKA
Mounting Type:
Surface Mount
Package / Case:
255-LFBGA
Supplier Device Package:
255-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
1,119
AM2732ADRFGAZCER
AM2732ADRFGAZCERTexas InstrumentsIC MPU SITARA 400MHZ 285NFBGAMicroprocessors285-NFBGA (13x13)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
285-LFBGA
Supplier Device Package:
285-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
111
AM2732ADRFGQZCERQ1
AM2732ADRFGQZCERQ1Texas InstrumentsIC MPU 400MHZ 285NFBGAMicroprocessors285-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 140°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
285-LFBGA
Supplier Device Package:
285-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
753
AM2732CDRFHAZCER
AM2732CDRFHAZCERTexas InstrumentsDUAL-CORE ARM CORTEX-R5F BASED MMicrocontrollers285-NFBGA (13x13)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
3.6M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 9x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
285-NFBGA (13×13)
Package / Case:
285-LFBGA
862
AM2732CDRFHQZCERQ1
AM2732CDRFHQZCERQ1Texas InstrumentsAUTOMOTIVE DUAL-CORE ARM CORTEX-Microcontrollers285-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
3.6M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 9x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 140°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
285-NFBGA (13×13)
Package / Case:
285-LFBGA
1,073
AM2732CMSFHQNZNRQ1
AM2732CMSFHQNZNRQ1Texas InstrumentsICMicroprocessors255-NFBGA (13x13)N/A-40°C ~ 140°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
C66x
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 140°C (TJ)
Security Features:
AES, DRBG TRNG, PKA
Mounting Type:
Surface Mount
Package / Case:
255-LFBGA
Supplier Device Package:
255-NFBGA (13×13)
Additional Interfaces:
CANbus, EMIF, I2C, QSPI, SPI, UART/USART
56
N/A
AM29000-16GCAdvanced Micro DevicesIC MPU 16MHZ 169PGAMicroprocessors169-PGA (44.7x44.7)N/A0°C ~ 85°C (TC)
Core Processor:
AM29000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
169-BPGA
Supplier Device Package:
169-PGA (44.7×44.7)
280
N/A
AM29000-16KC/WAdvanced Micro DevicesIC MPU 16MHZ 168QFPMicroprocessors168-PQFP (28x28)N/A0°C ~ 85°C (TC)
Core Processor:
AM29000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
168-BQFP
Supplier Device Package:
168-PQFP (28×28)
117
N/A
AM29000-20KC/WAdvanced Micro DevicesIC MPU 20MHZ 168QFPMicroprocessors168-PQFP (28x28)N/A0°C ~ 85°C (TC)
Core Processor:
AM29000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
168-BQFP
Supplier Device Package:
168-PQFP (28×28)
1,234
N/A
AM29000-25GCAdvanced Micro DevicesIC MPU 25MHZ 169PGAMicroprocessors169-PGA (44.7x44.7)N/A0°C ~ 85°C (TC)
Core Processor:
AM29000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
169-BPGA
Supplier Device Package:
169-PGA (44.7×44.7)
912

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