AM2732CMSFHQNZNRQ1

The AM2732CMSFHQNZNRQ1 is a Sitara™ microprocessor IC featuring a dual‑core ARM® Cortex®‑R5F MCU subsystem running up to 400 MHz, integrated with a C66x DSP core and a broad set of on‑chip resources for real‑time and signal processing tasks. Designed for embedded and automotive applications, this device offers a combination of real‑time performance, on‑chip memory, hardware security engines, and multiple industrial interfaces.

With automotive AEC‑Q100 qualification and an extended operating temperature range of ‑40 °C to 140 °C, the AM2732CMSFHQNZNRQ1 targets safety‑oriented and harsh‑environment systems that require deterministic control, secure boot and cryptographic acceleration, and comprehensive connectivity.

Key Features

• Processor Subsystem – Dual‑core ARM® Cortex®‑R5F cluster supporting single‑core or dual‑core operation at up to 400 MHz, with 32 KB I‑Cache and 32 KB D‑Cache per core and SECDED ECC on memories.
• DSP Acceleration – Integrated C66x single‑core, 32‑bit floating point DSP operating up to 550 MHz for high‑throughput signal processing and control algorithms.
• On‑Chip Memory – Up to 5.0 MB of on‑chip RAM (OCSRAM) with dedicated/shared partitions (3.5625 MB shared L3, 960 KB main subsystem, 384 KB DSP subsystem) to minimize external memory dependence.
• External Memory Interfaces – DDR memory controller support and a QSPI interface operating up to 67 MHz for external code and data storage.
• Security and Cryptography – Embedded Hardware Security Module (HSM), hardware accelerators including AES (up to 256‑bit), PKA with ECC/RSA capability, and TRNG/DRBG for secure boot and cryptographic operations.
• Industrial Connectivity – 10/100 Mbps Ethernet (RGMII/RMII/MII), 2× Modular CAN (MCAN) modules with CAN‑FD support, and general serial peripherals (SPI, I2C, UART, McASP).
• Imaging and High‑Speed IO – 2× 4‑lane MIPI D‑PHY CSI 2.0 inputs and 4‑lane Aurora/LVDS outputs for camera and high‑speed serial data paths.
• Safety, Debug and System Services – Functional safety quality managed with documentation to aid ISO 26262 design; 12× EDMA, 5× RTI modules, mailbox IPC, JTAG/Trace debugging support and recommended PMICs for simplified power sequencing.
• Package and Environmental – 255‑pin nFBGA package in a 13 mm × 13 mm footprint, surface‑mount; RoHS compliant and AEC‑Q100 qualified for automotive deployment.

Typical Applications

• Robotics – Real‑time control and sensor fusion using the dual Cortex‑R5F cores combined with the C66x DSP for motion control and path planning.
• Factory Automation & Safety – Deterministic processing and functional safety support for safety guards, motor control and deterministic I/O handling.
• Automotive Audio – High‑performance DSP and audio interfaces to implement in‑vehicle audio processing and streaming with robust connectivity.
• Machine Vision & Traffic Monitoring – MIPI CSI inputs and DSP acceleration for camera capture, preprocessing and vision algorithms in monitoring and inspection systems.

Unique Advantages

• Real‑time dual‑core processing: The dual ARM® Cortex®‑R5F cluster delivers deterministic MCU performance while supporting single‑ or dual‑core modes to match real‑time requirements.
• Integrated DSP horsepower: A C66x DSP running up to 550 MHz provides dedicated floating‑point performance for signal processing without offloading to external devices.
• Substantial on‑chip RAM: Up to 5.0 MB OCSRAM with shared L3 reduces external memory needs and improves latency for critical routines.
• Hardware security primitives: HSM, AES, PKA and TRNG/DRBG enable secure boot, authenticated firmware and accelerated cryptographic operations on‑chip.
• Automotive‑grade qualification: AEC‑Q100 qualification and a −40 °C to 140 °C operating range support deployment in automotive and harsh environments.
• Comprehensive connectivity: Ethernet, CAN‑FD, multiple serial buses and high‑speed camera interfaces provide flexible I/O for industrial and automotive systems.

Why Choose AM2732CMSFHQNZNRQ1?

The AM2732CMSFHQNZNRQ1 combines deterministic dual‑core Cortex‑R5F processing with a high‑performance C66x DSP and extensive on‑chip memory to address embedded designs that demand both real‑time control and signal processing. Its hardware security features and functional safety documentation make it appropriate for systems requiring secure boot and safety‑oriented design practices.

This part is positioned for engineers developing automotive and industrial applications that need integrated connectivity, robust thermal and qualification characteristics (AEC‑Q100), and a compact 13 mm × 13 mm nFBGA package to simplify board‑level integration and BOM complexity.

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