AM2732ADRFGAZCER

The AM2732ADRFGAZCER is a Sitara AM2732 series microprocessor IC featuring a dual‑core Arm Cortex‑R5F MCU subsystem operating up to 400 MHz and an integrated C66x DSP core. Designed for industrial and automotive‑grade embedded systems (AEC‑Q100 qualified), it combines real‑time MCU performance, DSP acceleration, and extensive connectivity for robotics, factory automation, machine vision, and related applications.

Key Features

• Core and Processing Dual‑core Arm Cortex‑R5F MCU subsystem up to 400 MHz with per‑core 32 KB I‑Cache and 32 KB D‑Cache plus SECDED ECC; C66x DSP single 32‑bit floating‑point core operating up to 550 MHz (17.6 GMAC) for heavy signal processing workloads.
• Memory Subsystem Up to 5.0 MB on‑chip RAM (OCSRAM) with shared L3 and dedicated main/DSP regions; TCM configurations for single‑ or dual‑core MCU clusters to optimize deterministic real‑time code and data placement.
• External Memory and Storage External memory interfaces (EMIF) and QSPI support (QSPI up to 67 MHz) for external flash and high‑speed memory expansion.
• Connectivity and Peripherals Integrated 10/100 Mbps Ethernet (one port), SPI, I2C, UART, McASP, and CANbus support; high‑speed serial I/O includes 2× 4‑lane MIPI D‑PHY CSI 2.0 inputs and 4‑lane Aurora/LVDS outputs for camera and display interfaces.
• Analog and Control General purpose ADC (1× 9‑channel, up to 625 ksps), multiple ePWM modules, eCAP, and multi‑channel audio serial ports for control and mixed‑signal interfacing.
• Security and Safety Embedded Hardware Security Module (HSM) with secure authenticated/encrypted boot support and crypto accelerators (PKA with ECC, AES up to 256‑bit, TRNG/DRBG); Functional Safety quality managed and AEC‑Q100 qualified.
• Power and System Services Simplified power sequencing with recommended PMICs, dual‑voltage digital I/O supporting 3.3 V and 1.8 V operation, EDMA, RTI modules, IPC mailbox, and JTAG/trace for system integration and debug.
• Package and Temperature 285‑pin nFBGA surface‑mount package (13 mm × 13 mm, 0.65 mm pitch); operating temperature range −40 °C to 105 °C; supplier device package listed as 285‑NFBGA (13×13).
• Graphics and Acceleration Graphics acceleration capability plus high‑speed serial interfaces to support camera input and display output workflows.

Typical Applications

• Robotics Deterministic dual‑core MCU plus DSP acceleration enable real‑time control, sensor fusion, and motion planning in robotic systems.
• Factory Automation and Safety Industrial I/O, ePWM, ADC, and functional‑safety management support safety guards, motor control, and PLC‑style automation tasks.
• Machine Vision MIPI CSI inputs, DSP acceleration, and high memory bandwidth provide a platform for camera capture, image processing, and vision analytics.
• Automotive Audio AEC‑Q100 qualification, McASP audio interfaces, and secure boot support make the device suitable for automotive audio processing and infotainment subsystems.
• Traffic Monitoring & Industrial Transport Ethernet connectivity, CAN‑FD capable MCAN modules, and extended temperature operation support sensing, networking, and control in transportation environments.

Unique Advantages

• Integrated MCU + DSP: Combines deterministic Arm Cortex‑R5F real‑time cores with a high‑performance C66x DSP to consolidate control and signal processing on a single SoC, reducing BOM and system complexity.
• Generous On‑Chip Memory: Up to 5.0 MB OCSRAM and layered L3/dedicated memory regions simplify data sharing between MCU, DSP, and accelerators for higher throughput and lower latency.
• Robust Connectivity Suite: Multiple high‑speed serial interfaces, Ethernet, CAN, and camera/display I/O enable versatile integration into industrial, automotive, and vision systems without extensive external logic.
• Security and Functional Safety Ready: Built‑in HSM, secure boot, crypto accelerators, and Functional Safety quality management with AEC‑Q100 support help address safety and security requirements in regulated markets.
• Design and Power Flexibility: Dual‑voltage I/O (3.3 V / 1.8 V), recommended PMIC support, and simplified power sequencing streamline power design and board integration.
• Automotive/Industrial Grade: AEC‑Q100 qualification and an extended operating temperature range (−40 °C to 105 °C) provide robustness for harsh environments.

Why Choose AM2732ADRFGAZCER?

The AM2732ADRFGAZCER positions itself as a highly integrated solution for embedded designs that require a mix of deterministic real‑time control and heavy signal processing. With dual Arm Cortex‑R5F cores, an integrated C66x DSP, ample on‑chip RAM, and a broad set of I/O and serial interfaces, it reduces external component count while addressing compute and connectivity needs.

This device is well suited for engineers building industrial, automotive‑grade, and vision‑centric systems who need a single‑chip platform offering security features, functional safety support, and package options that meet surface‑mount assembly requirements. The combination of performance, integration, and AEC‑Q100 qualification supports long‑term designs requiring robustness and vendor ecosystem support.

Request a quote or submit an RFQ to obtain pricing and availability for the AM2732ADRFGAZCER and evaluate it for your next embedded design.