AM2731CNSFHQNZNRQ1

The AM2731CNSFHQNZNRQ1 is a highly integrated Sitara™ microprocessor featuring a dual-core ARM® Cortex®-R5F MCU subsystem running up to 400 MHz and an integrated C66x DSP core for compute-intensive signal processing. It combines real-time MCU performance, DSP acceleration, extensive on-chip memory, and hardware security to address demanding embedded and automotive applications.

Targeted at industrial and automotive markets, the device offers broad connectivity (Ethernet, CANbus, MIPI CSI, SPI, I2C, UART), robust security engines (AES, PKA, TRNG/DRBG), AEC‑Q100 qualification, and an extended operating range of −40 °C to 140 °C, all in a 255‑pin nFBGA 13×13 mm package.

Key Features

• Core and Performance Dual ARM® Cortex®‑R5F cores up to 400 MHz with 32 KB I‑Cache and 32 KB D‑Cache per core; cluster supports single‑core or dual‑core operation for flexible real‑time control.
• DSP Acceleration Integrated C66x DSP core (single core, 32‑bit, floating point) for high‑performance signal processing tasks.
• On‑Chip Memory Up to 5.0 MB of on‑chip RAM with shared L3 and dedicated main and DSP regions, providing low‑latency memory for MCU and DSP workloads.
• Connectivity 10/100 Mbps Ethernet, CANbus, 2× MIPI D‑PHY CSI 2.0 inputs, Aurora/LVDS outputs, SPI, I2C, UART and McASP audio interfaces enable broad system integration.
• Security Hardware security accelerators including AES, PKA (ECC/RSA), and TRNG/DRBG plus a programmable HSM and secure boot capabilities.
• System Services and Debug EDMA controllers, RTI modules, mailbox IPC, and JTAG/trace support for deterministic real‑time scheduling and system debug.
• Power and Clocking Supports dual voltage digital I/O (3.3 V / 1.8 V) and simplified power sequencing; recommended PMIC support referenced for system power management.
• Package & Temperature 255‑pin nFBGA package (13×13 mm) with surface‑mount mounting and an extended operating temperature range of −40 °C to 140 °C; AEC‑Q100 qualified for automotive applications.

Typical Applications

• Robotics Real‑time motion control, sensor fusion and on‑board signal processing using combined R5F and C66x resources.
• Factory Automation Deterministic control, safety‑oriented I/O and fieldbus/CAN integration for automated equipment and safety guards.
• Automotive Audio Audio processing and system control leveraging McASP, DSP acceleration and integrated security for authenticated boot.
• Machine Vision Camera input via MIPI CSI and high‑speed processing for image pre‑processing and analytics on the DSP/MCU subsystems.
• Industrial Transport Vehicle subsystems and telematics with automotive qualification, extended temperature range, CANbus and Ethernet connectivity.

Unique Advantages

• Highly integrated heterogeneous compute: Dual R5F real‑time cores plus a C66x DSP provide a single‑chip platform for control and signal processing, reducing system BOM and board complexity.
• On‑chip memory density: Up to 5.0 MB of on‑chip RAM with shared and dedicated regions minimizes external memory needs and improves deterministic latency.
• Built‑in hardware security: AES, PKA and TRNG/DRBG accelerators with HSM and secure boot support enable secure authenticated systems and protected keys.
• Automotive‑grade reliability: AEC‑Q100 qualification and an extended −40 °C to 140 °C operating range support deployment in harsh automotive and industrial environments.
• Broad connectivity ecosystem: Multiple serial interfaces, Ethernet and CANbus plus MIPI CSI and Aurora/LVDS outputs simplify integration with sensors, networks and audio/video subsystems.

Why Choose AM2731CNSFHQNZNRQ1?

The AM2731CNSFHQNZNRQ1 positions itself as a versatile SoC for designs that require deterministic real‑time control, significant DSP horsepower, on‑chip memory, and strong hardware security within an automotive‑qualified footprint. Its combination of dual Cortex‑R5F cores, a C66x DSP, and extensive peripheral and interface support makes it suitable for complex embedded systems that must balance control, connectivity, and data processing on a single device.

This device is appropriate for engineering teams developing automotive and industrial applications that require long‑term robustness, streamlined BOM, and a secure architecture backed by available system‑level services and debug features.

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