Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TFP401APZPTFP401APZPTexas InstrumentsIC RECEIVER DVI 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
752
TFP401APZPG4TFP401APZPG4Texas InstrumentsIC RECEIVER 0/3 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C
Type:
Receiver
Number of Drivers/Receivers:
0/3
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
339
TFP401APZPRTFP401APZPRTexas InstrumentsIC RECEIVER 0/3 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C (TA)
Type:
Receiver
Protocol:
PanelBus™
Number of Drivers/Receivers:
0/3
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
1,491
TFP401PZPTFP401PZPTexas InstrumentsIC RECEIVER DVI 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
1,544
TFP403PZPTFP403PZPTexas InstrumentsIC RECEIVER 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
1,265
TFP403PZPG4TFP403PZPG4Texas InstrumentsIC RECEIVER 100HTQFPDrivers, Receivers, Transceivers100-HTQFP (14x14)3V ~ 3.6V0°C ~ 70°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
100-TQFP Exposed Pad
Supplier Device Package:
100-HTQFP (14×14)
233
TFP410MPAPREPTFP410MPAPREPTexas InstrumentsIC DRIVER 3/0 64HTQFPDrivers, Receivers, Transceivers64-HTQFP (10x10)3V ~ 3.6V-55°C ~ 125°C
Type:
Driver
Number of Drivers/Receivers:
3/0
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
64-PowerTQFP
Supplier Device Package:
64-HTQFP (10×10)
1,507
TFP410MPAPREPG4TFP410MPAPREPG4Texas InstrumentsIC DRIVER 3/0 64HTQFPDrivers, Receivers, Transceivers64-HTQFP (10x10)3V ~ 3.6V-55°C ~ 125°C
Type:
Driver
Number of Drivers/Receivers:
3/0
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
64-PowerTQFP
Supplier Device Package:
64-HTQFP (10×10)
375
TFP410PAPTFP410PAPTexas InstrumentsIC DRIVER 3/0 64HTQFPDrivers, Receivers, Transceivers64-HTQFP (10x10)3V ~ 3.6V0°C ~ 70°C
Type:
Driver
Number of Drivers/Receivers:
3/0
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
64-PowerTQFP
Supplier Device Package:
64-HTQFP (10×10)
347
TFP410PAPG4TFP410PAPG4Texas InstrumentsIC DRIVER 3/0 64HTQFPDrivers, Receivers, Transceivers64-HTQFP (10x10)3V ~ 3.6V0°C ~ 70°C
Type:
Driver
Protocol:
PanelBus™
Number of Drivers/Receivers:
3/0
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
64-PowerTQFP
Supplier Device Package:
64-HTQFP (10×10)
313
TFP410PAPRTFP410PAPRTexas InstrumentsIC DRIVER 3/0 64HTQFPDrivers, Receivers, Transceivers64-HTQFP (10x10)3V ~ 3.6V0°C ~ 70°C (TA)
Type:
Driver
Number of Drivers/Receivers:
3/0
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-PowerTQFP
Supplier Device Package:
64-HTQFP (10×10)
292
TG80960JA3V25TG80960JA3V25IntelIC MPU I960 25MHZ 132QFPMicroprocessors132-QFPN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-QFP
Supplier Device Package:
132-QFP
Grade:
Commercial
97
TG80960JC66TG80960JC66IntelIC MPU I960 66MHZ 132PQFPMicroprocessors132-PQFP (24.13x24.13)N/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (24.13×24.13)
Grade:
Commercial
461
TG80960JS25TG80960JS25IntelIC MPU 25MHZ 132PQFPMicroprocessors132-PQFPN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-QFP
Supplier Device Package:
132-PQFP
Grade:
Commercial
1,181
TG80960JS33TG80960JS33IntelIC MPU I960 33MHZ 132QFPMicroprocessors132-QFPN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-QFP
Supplier Device Package:
132-QFP
Grade:
Commercial
280
TG88CO196EC40TG88CO196EC40IntelIC MCU 16BIT 256KB FLASH 132QFPMicrocontrollers132-QFPN/A-40°C ~ 85°C (TA)
Core Processor:
MCS 96
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, SIO, SSIO
Peripherals:
WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-QFP
Package / Case:
132-QFP
344
TH58NVG5S0FTA20TH58NVG5S0FTA20Kioxia America, Inc.IC FLASH 32GBIT PAR 48TSOP IFlash Memory48-TSOP I2.7V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
25 ns
Clock Frequency:
N/A
Grade:
Commercial
Memory Format:
FLASH
Memory Interface:
Parallel
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
48-TFSOP (0.724", 18.40mm Width)
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
25 ns
1,266
N/AN/ATH58NVG5S0FTAK0Kioxia America, Inc.IC FLASH 32GBIT PAR 48TSOP IFlash Memory48-TSOP I2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
Parallel
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
48-TFSOP (0.724", 18.40mm Width)
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
25 ns
1,002
N/ATH58NVG6H2HTA20Kioxia America, Inc.64GB SLC NANDFlash Memory48-TSOPN/A0°C ~ 70°C
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Commercial
Memory Format:
FLASH
Memory Interface:
N/A
Memory Organization:
8G x 8
Memory Size:
64 bit
Memory Type:
Non-Volatile
Packaging:
48-TFSOP (0.724", 18.40mm Width)
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
N/A
45
N/ATH58NVG6H2HTAK0Kioxia America, Inc.64GB SLC NANDFlash Memory48-TSOP I2.7V ~ 3.6V-40°C ~ 85°C
Access Time:
N/A
Clock Frequency:
N/A
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
N/A
Memory Organization:
8G x 8
Memory Size:
64 bit
Memory Type:
Non-Volatile
Packaging:
48-TFSOP (0.724", 18.40mm Width)
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
N/A
757

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