TG80960JS25
| Part Description |
i960 Microprocessor IC - 1 Core, 32-Bit 25MHz 132-PQFP |
|---|---|
| Quantity | 201 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i960 |
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | i960 | Device Package | 132-PQFP | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Grade | Commercial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 100°C (TC) | Package / Case | 132-QFP | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 25MHz | ||
| Supplier Device Package | 132-PQFP | Voltage – I/O | 3.3V |
Overview of TG80960JS25 – IC MPU 25MHZ 132PQFP
The TG80960JS25 is an Intel i960 microprocessor IC featuring a single 32-bit core running at 25 MHz. Designed for embedded applications, the device offers on-chip DRAM controller support and standard 3.3 V I/O for system integration.
Packaged in a surface-mount 132-PQFP (132-QFP) case and rated for commercial operation, the TG80960JS25 is suited to embedded designs that require a compact, RoHS-compliant 32-bit processing solution with defined operating conditions.
Key Features
- Core — Single i960 32-bit core operating at 25 MHz, providing deterministic processing for embedded workloads.
- Memory Interface — Integrated DRAM controller to simplify external memory interfacing and system memory design.
- Power — 3.3 V I/O voltage domain for compatibility with common embedded logic levels and peripherals.
- Package & Mounting — Available in a 132-PQFP supplier device package (132-QFP package case) with surface-mount mounting type for PCB-level integration.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 100 °C.
- Compliance — RoHS compliant for environmental regulatory alignment.
- Graphics — No graphics acceleration; optimized for control and processing tasks rather than graphics workloads.
Typical Applications
- Embedded Control Systems — Used as the processing element in embedded controllers where a 32-bit i960 core and DRAM support are required.
- Industrial Instrumentation — Suitable for instrumentation that benefits from a defined commercial temperature range and surface-mount packaging.
- Communications Equipment — Employed in communications and networking modules that interface with external memory and require 3.3 V I/O compatibility.
Unique Advantages
- Well-defined 32-bit processing: A single i960 core at 25 MHz provides predictable execution characteristics for embedded control tasks.
- On-chip DRAM controller: Simplifies memory subsystem design by reducing external controller requirements.
- Standard 3.3 V I/O: Facilitates integration with a wide range of peripheral devices and logic families.
- Compact surface-mount package: 132-PQFP (132-QFP) package supports high-density PCB layouts and automated assembly.
- RoHS compliant: Meets environmental material requirements for modern electronic product lifecycles.
Why Choose TG80960JS25?
The TG80960JS25 positions itself as a practical, commercial-grade embedded microprocessor offering a 32-bit i960 core, DRAM controller, and 3.3 V I/O in a compact 132-PQFP surface-mount package. Its defined operating range of 0 °C to 100 °C and RoHS compliance make it a solid choice for embedded system designs that require predictable performance and regulatory alignment.
This part is appropriate for engineers and procurement teams specifying a reliable Intel i960-based MPU for applications such as control systems, instrumentation, and communications modules where a single 32-bit core and external DRAM support are central design requirements.
Request a quote or submit an inquiry for pricing and availability of the TG80960JS25 to evaluate fit for your next embedded design.

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