TG80960JS33

The TG80960JS33 is a microprocessor IC based on the i960 core, featuring a single 32-bit processing core running at 33 MHz. Designed for embedded applications, it combines a defined operating voltage and memory controller support to simplify system integration.

Built in a 132‑lead QFP surface‑mount package and rated for commercial temperature operation, this device is suited to embedded control and processing tasks where a compact, RoHS‑compliant 32‑bit processor is required.

Key Features

• Core and Performance — Single i960 core, 32‑bit operation at 33 MHz for deterministic embedded processing.
• Memory Support — Integrated DRAM controller support to simplify external memory interfacing.
• Power and I/O — 3.3 V I/O voltage for compatibility with common 3.3 V embedded systems.
• Package and Mounting — 132‑lead QFP package in a surface‑mount form factor for compact board-level integration.
• Operating Range — Commercial grade temperature range from 0 °C to 100 °C for standard environment deployments.
• Environmental Compliance — RoHS compliant for regulatory and environmental compatibility.
• Graphics — No graphics acceleration; optimized for general embedded processing rather than graphics workloads.

Typical Applications

• Embedded Control — Single‑core 32‑bit processing at 33 MHz for control tasks and firmware execution in embedded systems.
• Industrial Automation — Commercial temperature rating and surface‑mount packaging suitable for control and monitoring modules.
• Instrumentation — DRAM controller support and 3.3 V I/O for compact measurement and data‑logging devices.
• Legacy System Upgrades — Drop‑in processing capability for applications that require a defined 32‑bit microprocessor footprint in a 132‑QFP package.

Unique Advantages

• Single 32‑bit Core at 33 MHz: Provides predictable processing performance for deterministic embedded tasks.
• DRAM Controller Integration: Reduces external memory interface complexity and streamlines system design.
• 3.3 V I/O Compatibility: Matches common embedded voltage domains for straightforward integration with peripherals.
• Compact 132‑QFP Surface‑Mount Package: Enables high‑density PCB layout and automated assembly.
• Commercial Temperature Rating (0 °C to 100 °C): Suitable for standard commercial environment deployments.
• RoHS Compliant: Meets environmental compliance requirements for many markets and customers.

Why Choose TG80960JS33?

The TG80960JS33 positions itself as a pragmatic choice for embedded designs requiring a single 32‑bit i960 core running at 33 MHz with on‑board DRAM controller support and 3.3 V I/O. Its 132‑lead QFP surface‑mount package and commercial temperature rating make it appropriate for compact, production‑level systems where defined performance and predictable integration are priorities.

This device is ideal for engineering teams and procurement groups building control, instrumentation, or legacy upgrade projects that value straightforward memory interfacing, a standard voltage domain, and RoHS compliance for long‑term deployment and regulatory alignment.

Request a quote or submit an inquiry to receive pricing and availability information for the TG80960JS33. Our team can provide the details you need to evaluate this microprocessor for your next embedded design.