Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
BD41000AFJ-CE2
BD41000AFJ-CE2Rohm SemiconductorIC TRANSCEIVER 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J7V ~ 18V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CXPI
Number of Drivers/Receivers:
1/1
Data Rate:
20kbps
Voltage – Supply:
7V ~ 18V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
607
BD41000FJ-CGE2
BD41000FJ-CGE2Rohm SemiconductorIC TRANSCEIVER 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J7V ~ 18V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CXPI
Number of Drivers/Receivers:
1/1
Data Rate:
20kbps
Voltage – Supply:
7V ~ 18V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
1,180
BD41001FJ-CE2
BD41001FJ-CE2Rohm SemiconductorIC TRANSCEIVER 4/4 8SOPJDrivers, Receivers, Transceivers8-SOP-J7V ~ 18V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CXPI
Number of Drivers/Receivers:
4/1
Data Rate:
20kbps
Voltage – Supply:
7V ~ 18V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
566
BD41003FJ-CE2
BD41003FJ-CE2Rohm SemiconductorIC TRANSCEIVER HALF 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J7V ~ 18V-40°C ~ 125°C (TA)
Type:
Transceiver
Protocol:
CXPI
Number of Drivers/Receivers:
1/1
Duplex:
Half
Data Rate:
20kbps
Voltage – Supply:
7V ~ 18V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
168
BD41030FJ-CGE2
BD41030FJ-CGE2Rohm SemiconductorIC TRANSCEIVER 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J5V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Data Rate:
20kbps
Voltage – Supply:
5V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
1,077
BD41030HFN-CGTR
BD41030HFN-CGTRRohm SemiconductorIC TRANSCEIVER 1/1 8HSONDrivers, Receivers, Transceivers8-HSON5V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Data Rate:
20kbps
Voltage – Supply:
5V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-PowerUDFN
Supplier Device Package:
8-HSON
570
BD41041FJ-CE2
BD41041FJ-CE2Rohm SemiconductorIC TRANSCEIVER FULL 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J4.75V ~ 5.25V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
300 mV
Data Rate:
1Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
36
BD41044FJ-CE2
BD41044FJ-CE2Rohm SemiconductorIC TRANSCEIVER HALF 1/1 8SOPJDrivers, Receivers, Transceivers8-SOP-J4.75V ~ 5.25V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
300 mV
Data Rate:
5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP-J
58
BD93E11GWL-E2
BD93E11GWL-E2Rohm SemiconductorUSB TYPE-C POWER DELIVERY CONTROControllersUCSP50L2C3.1V ~ 5.5V, 3.67V ~ 22V, 4.9V ~ 5.5V-30°C ~ 85°C (TA)
Protocol:
USB
Function:
Controller
Interface:
I2C
Voltage – Supply:
3.1V ~ 5.5V, 3.67V ~ 22V, 4.9V ~ 5.5V
Current – Supply:
190µA
Operating Temperature:
-30°C ~ 85°C (TA)
Package / Case:
36-UFBGA, CSPBGA
Supplier Device Package:
UCSP50L2C
1,001
BD93F10MWV-E2
BD93F10MWV-E2Rohm SemiconductorHIGH VOLTAGE PROTECTION OF CC PIControllersUQFN040V50503.1V ~ 5.5V, 3.67V ~ 22V-30°C ~ 85°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 3.0
Voltage – Supply:
3.1V ~ 5.5V, 3.67V ~ 22V
Current – Supply:
70µA
Operating Temperature:
-30°C ~ 85°C
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
UQFN040V5050
1,182
BD93W21F-E2
BD93W21F-E2Rohm SemiconductorBD93W21F IS A USB TYPE-C POWER DControllers16-SOP4.75V ~ 20V-30°C ~ 105°C
Protocol:
USB
Function:
Controller
Standards:
USB 3.0
Voltage – Supply:
4.75V ~ 20V
Current – Supply:
3.2mA
Operating Temperature:
-30°C ~ 105°C
Package / Case:
16-SOIC (0.173″, 4.40mm Width)
Supplier Device Package:
16-SOP
1,749
BOXDX2ODPR66N/ABOXDX2ODPR66IntelCPU 486DX266 OVERDRIVE 168PGAMicroprocessorsN/AN/AN/A

N/A

432
N/A
BSC9131NJE7HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
1,555
BSC9131NJN1HHHB
BSC9131NJN1HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
186
BSC9131NLE1HHHB
BSC9131NLE1HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
1,432
N/A
BSC9131NLE7HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
672
BSC9131NLN1HHHB
BSC9131NLN1HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
1,682
BSC9131NSE1KHKBN/ABSC9131NSE1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
53
BSC9131NSN1KHKBN/ABSC9131NSN1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
871
BSC9131NXE1KHKB
BSC9131NXE1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
726

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