 | | BD41000AFJ-CE2 | Rohm Semiconductor | IC TRANSCEIVER 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 7V ~ 18V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Voltage – Supply: 7V ~ 18V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 607 | |
 | | BD41000FJ-CGE2 | Rohm Semiconductor | IC TRANSCEIVER 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 7V ~ 18V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Voltage – Supply: 7V ~ 18V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 1,180 | |
 | | BD41001FJ-CE2 | Rohm Semiconductor | IC TRANSCEIVER 4/4 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 7V ~ 18V | -40°C ~ 125°C | Number of Drivers/Receivers: 4/1 Voltage – Supply: 7V ~ 18V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 566 | |
 | | BD41003FJ-CE2 | Rohm Semiconductor | IC TRANSCEIVER HALF 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 7V ~ 18V | -40°C ~ 125°C (TA) | Number of Drivers/Receivers: 1/1 Voltage – Supply: 7V ~ 18V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 168 | |
 | | BD41030FJ-CGE2 | Rohm Semiconductor | IC TRANSCEIVER 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 5V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Voltage – Supply: 5V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 1,077 | |
 | | BD41030HFN-CGTR | Rohm Semiconductor | IC TRANSCEIVER 1/1 8HSON | Drivers, Receivers, Transceivers | 8-HSON | 5V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Voltage – Supply: 5V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-PowerUDFN Supplier Device Package: 8-HSON | 570 | |
 | | BD41041FJ-CE2 | Rohm Semiconductor | IC TRANSCEIVER FULL 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 4.75V ~ 5.25V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 300 mV Voltage – Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 36 | |
 | | BD41044FJ-CE2 | Rohm Semiconductor | IC TRANSCEIVER HALF 1/1 8SOPJ | Drivers, Receivers, Transceivers | 8-SOP-J | 4.75V ~ 5.25V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 300 mV Voltage – Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOP-J | 58 | |
 | | BD93E11GWL-E2 | Rohm Semiconductor | USB TYPE-C POWER DELIVERY CONTRO | Controllers | UCSP50L2C | 3.1V ~ 5.5V, 3.67V ~ 22V, 4.9V ~ 5.5V | -30°C ~ 85°C (TA) | Voltage – Supply: 3.1V ~ 5.5V, 3.67V ~ 22V, 4.9V ~ 5.5V Operating Temperature: -30°C ~ 85°C (TA) Package / Case: 36-UFBGA, CSPBGA Supplier Device Package: UCSP50L2C | 1,001 | |
 | | BD93F10MWV-E2 | Rohm Semiconductor | HIGH VOLTAGE PROTECTION OF CC PI | Controllers | UQFN040V5050 | 3.1V ~ 5.5V, 3.67V ~ 22V | -30°C ~ 85°C | Voltage – Supply: 3.1V ~ 5.5V, 3.67V ~ 22V Operating Temperature: -30°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: UQFN040V5050 | 1,182 | |
 | | BD93W21F-E2 | Rohm Semiconductor | BD93W21F IS A USB TYPE-C POWER D | Controllers | 16-SOP | 4.75V ~ 20V | -30°C ~ 105°C | Voltage – Supply: 4.75V ~ 20V Operating Temperature: -30°C ~ 105°C Package / Case: 16-SOIC (0.173″, 4.40mm Width) Supplier Device Package: 16-SOP | 1,749 | |
 | N/A | BOXDX2ODPR66 | Intel | CPU 486DX266 OVERDRIVE 168PGA | Microprocessors | N/A | N/A | N/A | N/A | 432 | |
| N/A | | BSC9131NJE7HHHB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | -40°C ~ 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C Security Features: Boot Security, Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 1,555 | |
 | | BSC9131NJN1HHHB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 186 | |
 | | BSC9131NLE1HHHB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 1,432 | |
| N/A | | BSC9131NLE7HHHB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C Security Features: Boot Security, Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 672 | |
 | | BSC9131NLN1HHHB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 1,682 | |
 | N/A | BSC9131NSE1KHKB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 53 | |
 | N/A | BSC9131NSN1KHKB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 871 | |
 | | BSC9131NXE1KHKB | NXP Semiconductors | IC MPU QORIQ 800MHZ 520FCBGA | Microprocessors | 520-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 520-FBGA, FCBGA Supplier Device Package: 520-FCBGA (21×21) Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM | 726 | |