BSC9131NLE1HHHB

IC MPU QORIQ 800MHZ 520FCBGA
Part Description

PowerPC e500 Microprocessor IC QorIQ Qonverge BSC 1 Core, 32-Bit 800MHz 520-FCBGA (21x21)

Quantity 1,259 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesBSC9131
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SC3850, Security; SEC 4.4Core ProcessorPowerPC e500Device Package520-FCBGA (21x21)
ECCN5A002A1Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case520-FBGA, FCBGARAM ControllersDDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Random Number GeneratorSpeed800MHz
Supplier Device Package520-FCBGA (21×21)USBUSB 2.0 (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of BSC9131NLE1HHHB – IC MPU QORIQ 800MHZ 520FCBGA

The BSC9131NLE1HHHB is a highly integrated QorIQ Qonverge microprocessor combining a Power Architecture e500 core with StarCore DSP and MAPLE-B2F baseband acceleration to address digital baseband processing requirements. It features a single 32‑bit PowerPC e500 core running at 800 MHz and is targeted at femtocell and small-cell wireless infrastructure applications.

With integrated DSP, baseband accelerators, multi‑standard air‑interface support, and on‑chip security, the device provides a compact platform for LTE, WCDMA (HSPA+), CDMA2K and related wireless designs where integration and performance are critical.

Key Features

  • CPU Core  Power Architecture e500 single 32‑bit core operating at 800 MHz for control and management tasks.
  • DSP and Baseband Acceleration  StarCore SC3850 DSP subsystem and MAPLE‑B2F multi‑accelerator platform for signal processing and baseband functions supporting LTE‑FDD/TDD, WCDMA (HSPA+), CDMA2K and TD‑SCDMA.
  • Memory  Integrated DDR3/DDR3L memory controller with 32‑bit data width (40 bits including ECC) supporting up to 800 MHz data rate and on‑chip flash controller for NOR/NAND/FPGA support.
  • Connectivity  Two triple‑speed Gigabit Ethernet controllers (10/100/1000 Mbps) with IEEE 1588 support and one USB 2.0 host/device controller.
  • Security  Dedicated security engine (SEC 4.4) providing boot security, cryptography and a hardware random number generator.
  • RF and Peripheral Interfaces  Antenna interface controller (AIC) and RF interfaces compliant with JESD207/ADI conventions, plus peripherals including eSPI, DUART, I²C, GPIO, eSDHC and PWM.
  • Package & Temperature  520‑FCBGA package (21×21 mm) for surface‑mount applications; operating temperature range 0 °C to 105 °C.
  • Compliance  RoHS‑compliant manufacturing and materials.

Typical Applications

  • Femtocell Base Stations  Home and enterprise femtocell designs leveraging integrated baseband acceleration and DSP for LTE, WCDMA and CDMA2K air interfaces.
  • Small‑Cell Wireless Infrastructure  Compact small‑cell platforms that require combined control processing, DSP and packet connectivity in a single device.
  • Multi‑Standard Access Nodes  Access node designs that need programmable support for multiple concurrent air interface standards and protocol stacks.

Unique Advantages

  • Highly integrated processing stack: Combines Power e500 core, SC3850 DSP and MAPLE‑B2F accelerators to reduce BOM and board space for baseband and control functions.
  • Multi‑standard baseband support: MAPLE‑B2F and DSP subsystems enable handling of LTE, WCDMA (HSPA+), CDMA2K and TD‑SCDMA standards from a single device.
  • On‑chip security capabilities: SEC 4.4 engine with boot security, cryptography and RNG protects boot and runtime operations without external crypto engines.
  • Broad connectivity set: Dual Gigabit Ethernet and USB 2.0 provide versatile networking and peripheral options for gateway and edge applications.
  • Memory flexibility: DDR3/DDR3L controller with ECC support and integrated flash controller allow reliable, high‑performance memory configurations.
  • Compact BGA package: 520‑FCBGA (21×21 mm) surface‑mount package enables dense system integration for space‑constrained designs.

Why Choose BSC9131NLE1HHHB?

The BSC9131NLE1HHHB positions itself as a compact, integrated platform for femtocell and small‑cell wireless systems that need combined control processing, DSP and hardware acceleration for multiple air interfaces. Its mix of an 800 MHz e500 core, StarCore DSP, MAPLE‑B2F accelerators, on‑chip security and dual Gigabit Ethernet support provides a balanced solution for developers focused on integration, determinism and network connectivity.

This device is suited to OEMs and system designers building multi‑standard access nodes and compact base station solutions where board space and integration reduce complexity. Support for DDR3/DDR3L memory, integrated flash controllers and ecosystem software options help accelerate development and deployment.

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