 | | B3221PM3BDGUI-U | Kingston Technology | IC DRAM 32GBIT PAR 200FBGA | Memory | 200-FBGA (10x14.5) | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Clock Frequency: 1.866 GHz Memory Interface: Parallel Memory Organization: 2G x 16 Technology: SDRAM - Mobile LPDDR4 Write Cycle Time Word Page: 18 ns | 505 | |
 | | B3221PM3BDGVIW-U | Kingston Technology | 32GB 200 BALL LPDDR4 4266MH | Memory | 200-FBGA (10x14.5) | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Clock Frequency: 2.133 GHz Memory Interface: Parallel Memory Organization: 2G x 16 Technology: SDRAM - Mobile LPDDR4 Write Cycle Time Word Page: 18 ns | 2 | |
 | | B3221XM3BDGVI-U | Kingston Technology | IC DRAM 32GBIT PAR 200FBGA | Memory | 200-FBGA (10x14.5) | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Clock Frequency: 2.133 GHz Memory Interface: Parallel Memory Organization: 2G x 16 Technology: SDRAM - Mobile LPDDR4X Write Cycle Time Word Page: 18 ns | 960 | |
| N/A | | B4420NSE7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, SPI, UART | 482 | |
| N/A | | B4420NSN7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, SPI, UART | 174 | |
| N/A | | B4420NXE7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, SPI, UART | 1,061 | |
| N/A | | B4420NXN7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, SPI, UART | 403 | |
 | | B4860NSE7QUMD | NXP Semiconductors | QORIQ QONVERGE SOC, 6X1.2GHZ STA | Microprocessors | N/A | N/A | N/A | N/A | 1,651 | |
| N/A | | B4860NSN7QUMD | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 1,656 | |
| N/A | | B4860NXE7QUMD | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 881 | |
 | | B4860NXN7QUMD | NXP Semiconductors | B4860 - QORIQ QONVERGE SOC, 6X1. | Microprocessors | N/A | N/A | N/A | N/A | 724 | |
 | | B505CA4EMCAXP | Infineon Technologies | IC MCU 8BIT 32KB OTP 44MQFP | Microcontrollers | PG-MQFP-44-2 | N/A | 0°C ~ 70°C (TA) | Connectivity: CANbus, EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.25V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-MQFP-44-2 | 1,635 | |
 | | BA12003B | Rohm Semiconductor | IC DARLINGTON ARRAY 7/0 16DIP | Drivers, Receivers, Transceivers | 16-DIP | - | -25°C ~ 75°C | Number of Drivers/Receivers: 7/0 Operating Temperature: -25°C ~ 75°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300″”, 7.62mm) Supplier Device Package: 16-DIP | 1,079 | |
 | | BA12003BF-E2 | Rohm Semiconductor | IC DARLINGTON ARRAY 7/0 16SOP | Drivers, Receivers, Transceivers | 16-SOP | - | -25°C ~ 75°C | Number of Drivers/Receivers: 7/0 Operating Temperature: -25°C ~ 75°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.173″”, 4.40mm Width) Supplier Device Package: 16-SOP | 199 | |
 | | BA12003DF-ZE2 | Rohm Semiconductor | IC DARLINGTON ARRAY 7/0 16SOP | Drivers, Receivers, Transceivers | 16-SOP | 0.5V ~ 30V | -40°C ~ 85°C | Number of Drivers/Receivers: 7/0 Voltage – Supply: 0.5V ~ 30V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.173″”, 4.40mm Width) Supplier Device Package: 16-SOP | 632 | |
 | | BA12004DF-ZE2 | Rohm Semiconductor | IC DARLINGTON ARRAY 7/0 16SOP | Drivers, Receivers, Transceivers | 16-SOP | 0.5V ~ 30V | -40°C ~ 85°C | Number of Drivers/Receivers: 7/0 Voltage – Supply: 0.5V ~ 30V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.173″”, 4.40mm Width) Supplier Device Package: 16-SOP | 613 | |
 | | BA823 | Rohm Semiconductor | IC DRIVER 8/0 16DIP | Drivers, Receivers, Transceivers | 16-DIP | 4.5V ~ 5.5V | -25°C ~ 75°C | Number of Drivers/Receivers: 8/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -25°C ~ 75°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300″”, 7.62mm) Supplier Device Package: 16-DIP | 524 | |
 | | BA823F-E2 | Rohm Semiconductor | IC DRIVER 8/0 16SOP | Drivers, Receivers, Transceivers | 16-SOP | 4.5V ~ 5.5V | -25°C ~ 75°C | Number of Drivers/Receivers: 8/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -25°C ~ 75°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.173″”, 4.40mm Width) Supplier Device Package: 16-SOP | 810 | |
 | N/A | BA829 | Rohm Semiconductor | IC DRIVER 8BIT 18DIP | Drivers, Receivers, Transceivers | 18-DIP | 4.5V ~ 5.5V | -25°C ~ 70°C | Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -25°C ~ 70°C Mounting Type: Through Hole Package / Case: 18-DIP (0.300″”, 7.62mm) Supplier Device Package: 18-DIP | 476 | |
 | | BBT3420-SN | Renesas | IC TRANSCEIVER FULL 4/4 289BGA | Drivers, Receivers, Transceivers | 289-BGA (19x19) | 1.7V ~ 1.9V | 0°C ~ 70°C | Protocol: XAUI, XGMII, MDC/MDIO Number of Drivers/Receivers: 4/4 Voltage – Supply: 1.7V ~ 1.9V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 289-BGA (19×19) | 963 | |