Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AX500-2FGG484
AX500-2FGG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,913
AX500-2FGG484I
AX500-2FGG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
358
AX500-2FGG676
AX500-2FGG676Microchip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
336
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
34
AX500-2FGG676I
AX500-2FGG676IMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
336
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,306
AX500-2PQ208
AX500-2PQ208Microchip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
115
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
108
AX500-2PQ208IAX500-2PQ208IMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
30
AX500-2PQG208
AX500-2PQG208Microchip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
115
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
765
AX500-2PQG208IAX500-2PQG208IMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,524
N/AAX500-CQ208MMicrochip TechnologyIC FPGA 115 I/O 208CQFPFPGAs208-CQFP (75x75)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
558
AX500-FG484
AX500-FG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
519
AX500-FG484I
AX500-FG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
859
AX500-FG484M
AX500-FG484MMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,260
AX500-FG676
AX500-FG676Microchip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
336
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
578
AX500-FG676IAX500-FG676IMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
336
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
133
N/A
AX500-FG676MMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
336
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
618
AX500-FGG484AX500-FGG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
317
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,003
AX500-FGG484IAX500-FGG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
317
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,405
AX500-FGG484M
AX500-FGG484MMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
317
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
113
AX500-FGG676
AX500-FGG676Microchip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
8064
Total RAM Bits:
73728
Number of I/O:
336
Number of Gates:
500000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
688
AX500-FGG676IAX500-FGG676IMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
336
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
326

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up