Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
P1022NSN2MHBP1022NSN2MHBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,071
P1022NXE2EFBP1022NXE2EFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
736
P1022NXE2HFBP1022NXE2HFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,037
P1022NXE2LFBP1022NXE2LFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,301
P1022NXN2EFBP1022NXN2EFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
210
P1022NXN2HFBP1022NXN2HFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,953
P1022NXN2LFBP1022NXN2LFBNXP SemiconductorsIC MPU QORIQ P1 1.067GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
665
N/AP1023NSN5CFBNXP SemiconductorsIC MPU QORIQ P1 500MHZ 457TEPBGAMicroprocessors457-TEPBGA-1 (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
457-FBGA
Supplier Device Package:
457-TEPBGA-1 (19×19)
196
N/AP1023NXE5CFBNXP SemiconductorsIC MPU 500MHZ 457TEPBGAMicroprocessors457-TEPBGA I (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
Security; SEC 4.2
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
3DES, AES, DES, RNG
Mounting Type:
Surface Mount
Package / Case:
457-FBGA
Supplier Device Package:
457-TEPBGA I (19×19)
1,055
P1024NSE5DFBP1024NSE5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)-0°C – 125°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
271
P1024NSN5DFBP1024NSN5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)-0°C – 125°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
1,729
P1024NXE5BFBP1024NXE5BFBNXP SemiconductorsIC MPU 400MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40 °C – 125 °C
Speed:
400 MHz
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 3.3
Qualification:
Industrial
880
P1024NXE5DFBP1024NXE5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
561-FBGA
Supplier Device Package:
561-TEPBGA I (23×23)
Grade:
Industrial
239
P1025NXE5DFBP1025NXE5DFBNXP SemiconductorsIC MPU 533MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40 °C – 125 °C
Speed:
533 MHz
Core Processor:
e500
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR2
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (1)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
Qualification:
Industrial
340
P2010NSE2HFCP2010NSE2HFCNXP SemiconductorsIC MPU QORIQ P2 1.2GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,263
P2010NSE2HHCP2010NSE2HHCNXP SemiconductorsIC MPU QORIQ P2 1.2GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,699
P2010NSN2HFCP2010NSN2HFCNXP SemiconductorsIC MPU 800MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TJ)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
466
P2010NSN2HHCP2010NSN2HHCNXP SemiconductorsIC MPU QORIQ P2 1.2GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
649
P2010NSN2KFCP2010NSN2KFCNXP SemiconductorsQORIQ, 32-BIT POWER ARCH SOC, 10MicroprocessorsN/AN/AN/A
Voltage – I/O:
1.5 V – 3.3 V
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR2, DDR3
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 3.3
1,630
P2010NSN2KHCP2010NSN2KHCNXP SemiconductorsIC MPU QORIQ P2 1.2GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
724

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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