P1022NXN2EFB

IC MPU QORIQ P1 1.055GHZ PBGA689
Part Description

PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 1.055GHz 689-TEPBGA II (31x31)

Quantity 210 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesP1022
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e500v2Device Package689-TEPBGA II (31x31)Display & Interface ControllersLCD
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)
Package / Case689-BBGA Exposed PadRAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (2)Speed1.055GHz
Supplier Device Package689-TEPBGA II (31×31)USBUSB 2.0 + PHY (2)

Overview of P1022NXN2EFB – IC MPU QORIQ P1 1.055GHZ PBGA689

The P1022NXN2EFB is a dual-core PowerPC e500v2 microprocessor from the QorIQ P1 family, delivering 1.055 GHz performance in a 689-TEPBGA II (31×31) package. It is designed for embedded communications and media processing applications that require integrated connectivity, security features, and energy-efficient operation.

Built for IP networking, embedded Internet media processing and advanced connectivity appliances, the device combines dual e500 processor cores with on-chip peripherals and enhanced power and energy management to balance processing throughput with I/O system performance.

Key Features

  • Core Architecture: Dual PowerPC e500v2 cores at 1.055 GHz providing symmetric and asymmetric multiprocessing options for embedded application workloads.
  • Memory & Storage: Integrated DDR2/DDR3 memory controller and support for SATA 3Gbps (2) for local storage and data handling.
  • High-Speed Connectivity: Two 10/100/1000 Mbps Ethernet ports, three PCI Express interface options, and 4-lane SerDes for PCIe/SGMII connectivity to support demanding I/O topologies.
  • USB & Peripheral Interfaces: Two USB 2.0 ports with PHY (2) plus DUART, I²C, SPI and SD/MMC interfaces for system expansion and peripheral control.
  • Security & Acceleration: On-chip security features including cryptography and a random number generator; optional hardware acceleration engine for encryption protocols and RAID processing.
  • On-Chip Peripherals: Integrated controllers including LCD (DIU), TDM/I²S, SD/MMC, timers and MPIC for real-time and multimedia functions.
  • Power & Energy Management: Advanced power and energy management features aimed at energy-efficient operation to meet environmental and governmental energy regulatory requirements.
  • Package & Mounting: 689-BBGA exposed pad, supplier device package 689-TEPBGA II (31×31), surface mount for compact PCB integration.
  • Operating Range & Qualification: Industrial qualification with operating temperature range of −40 °C to 125 °C.

Typical Applications

  • IP Networking Appliances: Dual Gigabit Ethernet and PCIe connectivity enable routing, switching and network appliances handling multiple interfaces and packet processing.
  • Embedded Media Processing: Dual cores, DDR2/DDR3 support and multimedia interfaces support embedded Internet media processing and streaming applications.
  • Storage and RAID Systems: SATA 3Gbps ports and optional hardware RAID/encryption acceleration support local storage subsystems and secure data handling.
  • Industrial Embedded Systems: Industrial temperature rating and integrated I/O make the device suitable for rugged embedded equipment and communications endpoints.

Unique Advantages

  • Dual-Core Flexibility: Provides symmetric and asymmetric multiprocessing strategies to scale performance across concurrent tasks without changing core architecture.
  • Integrated High-Speed I/O: Multiple Gigabit Ethernet ports, PCIe options, SATA and USB reduce external components and simplify board design for connectivity-focused products.
  • Built-In Security: Hardware cryptography and a random number generator, plus optional acceleration for encryption and RAID, help secure data and offload compute from the cores.
  • Energy-Aware Design: Advanced power and energy management features support energy-efficient operation to address regulatory and system-level power targets.
  • Industrial Temperature Qualification: Rated from −40 °C to 125 °C for deployment in temperature-challenging embedded environments.
  • Compact, Mountable Package: 689-TEPBGA II (31×31) surface-mount package with exposed pad for dense system integration and thermal management.

Why Choose P1022NXN2EFB?

The P1022NXN2EFB combines dual PowerPC e500v2 cores with a rich set of integrated peripherals and high-speed I/O to deliver balanced processing and connectivity for embedded networking and media designs. Its advanced power management and optional hardware acceleration for security and RAID make it suitable for designs that require both performance and energy efficiency.

This device is well suited for engineers developing IP networking appliances, embedded media platforms and industrial communications equipment who need a scalable, connectivity-focused processor with industrial qualification and established tool and operating-system support from the QorIQ ecosystem.

Request a quote or contact sales to discuss availability, pricing and how P1022NXN2EFB can meet your embedded processing and connectivity requirements.

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