P1022NXE2HFB

IC MPU QORIQ P1 1.055GHZ PBGA689
Part Description

PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 1.055GHz 689-TEPBGA II (31x31)

Quantity 1,037 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP1022
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SECCore ProcessorPowerPC e500v2Device Package689-TEPBGA II (31x31)
Display & Interface ControllersLCDECCN5A002A1 FREEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TA)Package / Case689-BBGA Exposed PadRAM ControllersDDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (2)
Security FeaturesCryptography, Random Number GeneratorSpeed1.055GHzSupplier Device Package689-TEPBGA II (31×31)
USBUSB 2.0 + PHY (2)

Overview of P1022NXE2HFB – QorIQ P1 Dual‑Core 1.055GHz Microprocessor

The P1022NXE2HFB is an NXP QorIQ P1 series microprocessor featuring dual PowerPC e500v2 cores running at 1.055 GHz. It targets embedded communications and media processing applications that require balanced compute and I/O throughput with integrated security and storage capabilities.

Designed for energy-efficient embedded systems, the device combines dual-core processing, a next‑generation memory controller, and a rich set of high‑speed interfaces to support IP networking, storage and advanced media tasks in industrial environments.

Key Features

  • Core Dual PowerPC e500v2 processor cores, 32‑bit, running at 1.055 GHz for symmetric or asymmetric multiprocessing strategies.
  • Memory On‑chip memory architecture with L1 and L2 caches and support for DDR2 and DDR3 SDRAM via a next‑generation memory controller.
  • Storage & Acceleration Two SATA 3 Gbps ports and an optional hardware acceleration engine for encryption protocols and RAID processing to support local storage and secure data handling.
  • Networking & Connectivity Two 10/100/1000 Mbps Ethernet interfaces and virtualized enhanced three‑speed Ethernet with TCP/UDP/IP offload; three PCI Express interface options and 4‑lane SerDes for flexible high‑speed I/O integration.
  • USB & Peripherals Two USB 2.0 controllers with PHY, LCD display interface controller (DIU), DUART and a range of peripheral controllers including I2C, SPI and timers.
  • Security On‑chip security acceleration, cryptography support and a hardware random number generator for secure communications and data protection.
  • Power & Energy Management Advanced power and energy management features to support energy‑efficient embedded designs and to help meet regulatory energy targets.
  • Package & Temperature 689‑ball TEPBGA II exposed‑pad package (31×31 mm), surface mount, qualified for industrial temperature operation from –40°C to 125°C.

Typical Applications

  • Network Appliances — Routers, gateways and network edge devices leveraging dual Gigabit Ethernet and offload capabilities for packet processing.
  • Storage Systems — NAS and embedded storage appliances using dual SATA ports and optional RAID/encryption acceleration for local data storage.
  • Embedded Communications Equipment — Telecom and industrial communications devices requiring real‑time I/O, PCIe connectivity and robust peripheral support.
  • Media Processing Platforms — Embedded Internet media and processing appliances that benefit from dual‑core processing and integrated display and interface controllers.

Unique Advantages

  • Highly integrated I/O: Multiple Gigabit Ethernet ports, SATA, USB and PCIe reduce external components and simplify system design.
  • Dual‑core flexibility: Symmetric and asymmetric multiprocessing support enables scalable performance strategies for multicore software stacks.
  • Security acceleration: Built‑in cryptography and RNG plus optional encryption/RAID acceleration streamline secure data handling without heavy CPU load.
  • Energy management: Advanced power features help optimize power consumption for energy‑sensitive embedded applications.
  • Industrial readiness: Industrial temperature qualification (–40°C to 125°C) and a compact 689‑ball TEPBGA package support demanding environments and robust mounting.
  • Software and ecosystem support: The P1022 family benefits from established operating system and tool support to ease adoption of dual‑core designs.

Why Choose P1022NXE2HFB?

The P1022NXE2HFB positions dual PowerPC e500v2 cores together with a comprehensive set of high‑speed interfaces and security features to deliver a balanced solution for embedded networking, storage and media processing designs. Its combination of integration, energy management and industrial temperature capability makes it suitable for systems that require reliable performance and extensive I/O in compact, surface‑mount form factors.

This device is well suited for engineering teams building IP networking appliances, storage subsystems or communications equipment that demand integrated connectivity, secure data handling and proven toolchain support for multicore development.

Request a quote or submit an inquiry for pricing and availability of P1022NXE2HFB to evaluate it for your next embedded system design.

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