P1022NSN2LFB

The P1022NSN2LFB is a dual-core PowerPC e500v2 microprocessor operating at 1.055 GHz, delivered in a 689-TEPBGA II (31×31) exposed-pad package for surface-mount applications. It is designed for embedded communications and media processing applications that require balanced processor performance, high-speed I/O integration, and energy-efficient operation.

Targeted use cases include IP networking, advanced media processing and embedded Internet media devices. The device combines dual e500 cores with integrated connectivity, security acceleration and advanced power management to support designs that need high throughput and system-level integration.

Key Features

• Processor Core Dual PowerPC e500v2 cores at 1.055 GHz with 32-bit architecture and on-chip coherency support for symmetric or asymmetric multiprocessing.
• Cache Per-core L1 instruction and data caches (32 KB I / 32 KB D) and an L2 cache (256 KB) to improve application performance and data locality.
• Memory Integrated DDR2/DDR3 SDRAM controller for flexible system memory configurations.
• High-Speed Connectivity Two 10/100/1000 Mbps Gigabit Ethernet interfaces, virtualized enhanced three-speed Ethernet with TCP/UDP/IP offload and high-speed SerDes supporting PCI Express/SATA/SGMII topologies as described in the series documentation.
• Storage Interfaces Two SATA 3 Gbps ports for local storage and optional hardware acceleration support for RAID processing described in the product family documentation.
• USB and Peripherals Two USB 2.0 ports with PHY, DUART, SPI, I2C and other standard peripheral controllers for system connectivity.
• Security Integrated cryptography features and a hardware random number generator; optional security acceleration engines are available in the product family for encryption and protocol offload.
• Display and Audio LCD display interface controller (DIU) and TDM/I²S audio interfaces for embedded media applications.
• Power and Energy Management Advanced on-chip power and energy management features to support energy-efficient embedded designs as described in the series documentation.
• Package and Temperature 689-ball TEPBGA II (31×31) exposed-pad package, surface-mount, qualified for 0 °C to 105 °C operating temperature range.
• Compliance RoHS-compliant material status.

Typical Applications

• Network Appliances: Routing, switching and firewall platforms leveraging dual Gigabit Ethernet interfaces and TCP/UDP/IP offload for packet processing.
• Storage Systems: NAS and storage gateways using dual SATA 3 Gbps ports and optional RAID acceleration for local storage management.
• Embedded Media Gateways: Media processing and embedded Internet media devices utilizing the processor’s display interface, audio interfaces and multimedia-oriented peripherals.
• Industrial Gateways: Industrial and communications gateways that require sustained throughput, DDR2/DDR3 memory support and extended operating temperature range.

Unique Advantages

• Dual-Core Processing: Two e500v2 cores enable symmetric or asymmetric multiprocessing strategies to increase application throughput without increasing board-level complexity.
• Integrated High-Speed I/O: Built-in Gigabit Ethernet, SATA and USB interfaces reduce external interface components and simplify board design.
• Security-Ready: On-chip cryptography and a hardware RNG provide foundation security primitives for secure communications and data protection.
• Memory Flexibility: Support for DDR2 and DDR3 SDRAM allows designers to optimize system cost and performance for their memory requirements.
• Energy Management: Advanced power and energy management features support designs that must meet energy-efficiency goals.
• Compact Surface-Mount Package: 689-ball TEPBGA II with exposed pad enables high-density system layouts while supporting thermal dissipation.

Why Choose P1022NSN2LFB?

The P1022NSN2LFB combines dual PowerPC e500v2 cores, integrated high-speed connectivity and security features in a compact 689-ball BGA package to deliver a balanced solution for embedded communications and media processing designs. Its mix of processor performance, memory flexibility and peripheral integration makes it suitable for network appliances, storage gateways and embedded media devices that need reliable throughput and system-level integration.

Built with energy management features and supported by the QorIQ P1 series architecture, the device aligns with development workflows that benefit from existing operating system and tool support described in the product family documentation, helping teams scale designs with predictable integration and long-term supportability.

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