P1024NXE5DFB

IC MPU QORIQ P1 667MHZ 561TEPBGA
Part Description

PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 667MHz 561-TEPBGA I (23x23)

Quantity 239 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP1024
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 3.3Core ProcessorPowerPC e500v2Device Package561-TEPBGA I (23x23)
ECCN5A002A1 FREEthernet10/100/1000Mbps (3)GradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TA)Package / Case561-FBGARAM ControllersDDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator
Speed667MHzSupplier Device Package561-TEPBGA I (23×23)USBUSB 2.0 + PHY (2)

Overview of P1024NXE5DFB – IC MPU QORIQ P1 667MHZ 561TEPBGA

The P1024NXE5DFB is a dual-core PowerPC e500v2 microprocessor from NXP's QorIQ P1 family, delivering 667 MHz per core in a 32-bit architecture. Designed for communications and industrial applications, it combines multicore processing, integrated memory and high-speed interfaces with on-chip security acceleration for robust embedded networking and control solutions.

Built on 45 nm technology, the device targets markets such as networking, telecom, defense and industrial equipment where integration, deterministic performance and extended temperature operation matter.

Key Features

  • Core — Dual PowerPC e500v2 cores at 667 MHz, supporting symmetric and asymmetric processing models.
  • Cache and Memory — 32 KB L1 instruction and 32 KB L1 data per core with a 256 KB L2 cache that can be partitioned between cores or configured as SRAM; integrated DDR3 SDRAM controller.
  • Security Acceleration — On-chip security acceleration (SEC 3.3) with cryptography and a hardware random number generator to support secure communications and data protection.
  • High‑Speed Networking — Three 10/100/1000 Mbps Ethernet ports for multi‑port networking applications.
  • USB and Peripherals — Two USB 2.0 controllers with PHY, DUART, SPI, SD/MMC, 2× I2C and timers as noted in the processor feature set.
  • System Integration — On-chip DMA controllers, coherency module and on-chip interconnect (CoreNet) to streamline system-level data flow and peripheral integration.
  • Packaging and Mounting — 561-TEPBGA I (23×23) / 561-FBGA package in a surface-mount form factor suitable for compact board designs.
  • Industrial Grade Operation — Qualified for industrial temperature operation from −40 °C to 125 °C.
  • RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

  • Multi‑service Gateways — Use the dual cores, integrated Ethernet and security acceleration to handle routing, firewalling and VPN tasks in compact gateway designs.
  • Ethernet Switch Controllers — Leverage the three Gigabit Ethernet ports and DMA controllers for switch control, packet handling and management plane processing.
  • Wireless LAN Access Points — Combine multicore processing and peripheral interfaces to run control-plane functions and manage network services.
  • Industrial Control and Defense Systems — Industrial temperature rating, integrated memory controllers and security features support rugged embedded control and secure communications.

Unique Advantages

  • Dual‑core flexibility: Two PowerPC e500v2 cores enable symmetric or asymmetric processing models to match application partitioning and throughput needs.
  • Integrated memory and cache: On-chip DDR3 controller and configurable 256 KB L2 cache simplify board design and improve deterministic data access.
  • Built‑in security acceleration: SEC 3.3 engine, cryptographic capabilities and an RNG reduce CPU load for secure tunnels and cryptographic services.
  • Rich I/O mix: Multiple Gigabit Ethernet ports, USB 2.0, DUART, SPI and SD/MMC support a wide range of networking and peripheral connectivity without external controllers.
  • Industrial temperature range: −40 °C to 125 °C qualification supports deployment in harsh or temperature‑sensitive environments.
  • Compact BGA package: 561-TEPBGA (23×23) enables high-density board integration while maintaining surface-mount assembly compatibility.

Why Choose P1024NXE5DFB?

The P1024NXE5DFB positions itself as a compact, integrated communications processor delivering dual-core PowerPC performance with extensive on-chip peripherals and security acceleration. It is suited for designs that require reliable networking throughput, secure data handling and operation across extended temperature ranges.

For engineers and procurement teams building gateways, switch controllers, access points or industrial control platforms, this device offers a balance of processing capability, peripheral integration and environmental qualification that supports scalable, robust product development and long-term deployment.

Request a quote or submit an inquiry to start procurement and evaluate the P1024NXE5DFB for your next embedded networking or industrial design.

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