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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | SAM9X70-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 679 | ||
 | SAM9X70T-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 532 | ||
| N/A | SAM9X70T-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 292 | ||
 | SAM9X72-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 747 | ||
| N/A | SAM9X72-V/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,EXT T | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 598 | ||
 | SAM9X72T-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,247 | ||
| N/A | SAM9X72T-V/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,EXT T | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,508 | ||
 | SAM9X75-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,203 | ||
| N/A | SAM9X75-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,917 | ||
 | SAM9X75D1G-I/4TB | Microchip Technology | ARM926 MPU, 1GBIT DDR3L,MIPI,LVD | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 802 | ||
 | SAM9X75D1GT-I/4TB | Microchip Technology | ARM926 MPU,1GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 580 | ||
 | SAM9X75D2G-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 727 | ||
 | SAM9X75D2GT-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,733 | ||
 | SAM9X75T-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,918 | ||
| N/A | SAM9X75T-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 401 | ||
| N/A | SAMA7G54-E/4HB | Microchip Technology | CORTEX-A7 MPU, BGA, EXT. TEMP (T | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 343-TFBGA Supplier Device Package: 343-TFBGA (14×14) Additional Interfaces: EBI, I2C, SPI | 166 | ||
 | SAMA7G54-V/4HB | Microchip Technology | IC MPU SAMA7G5 1GHZ 343TFBGA | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB 2.0 PHY (3), USB Type-C (2) Voltage – I/O: 3.3V, 5V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 343-TFBGA Supplier Device Package: 343-TFBGA (14×14) Additional Interfaces: EBI, I2C, SPI | 370 | ||
 | SAMA7G54D1G-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Additional Interfaces: EBI, I2C, SPI | 20 | ||
 | SAMA7G54D1GT-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Additional Interfaces: EBI, I2C, SPI | 1,768 | ||
 | SAMA7G54D2G-I/4UB | Microchip Technology | CORTEX-A7 MPU, 2GBIT DDR3, BGA,I | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Additional Interfaces: EBI, I2C, SPI | 646 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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