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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | SAM9X70-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 1,015 | ||
 | SAM9X70T-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 148 | ||
| N/A | SAM9X70T-V/4PB | Microchip Technology | ARM926 MPU,BGA,EXT TEMP,T&R | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 371 | ||
 | SAM9X72-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 903 | ||
| N/A | SAM9X72-V/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,EXT T | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 1,088 | ||
 | SAM9X72T-I/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,I TEM | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 884 | ||
| N/A | SAM9X72T-V/4PB | Microchip Technology | ARM926 MPU,LVDS,CAN-FD,BGA,EXT T | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 552 | ||
 | SAM9X75-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 428 | ||
| N/A | SAM9X75-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 13 | ||
 | N/A | SAM9X75D1G-I/4TB | Microchip Technology | ARM926 MPU, 1GBIT DDR3L,MIPI,LVD | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Grade: Industrial | 60 | |
 | N/A | SAM9X75D1GT-I/4TB | Microchip Technology | ARM926 MPU,1GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Grade: Industrial | 431 | |
 | N/A | SAM9X75D2G-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Grade: Industrial | 1,240 | |
 | N/A | SAM9X75D2GT-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 243-LFBGA Supplier Device Package: 243-TFBGA (16×16) Grade: Industrial | 24 | |
 | SAM9X75T-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 168 | ||
| N/A | SAM9X75T-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 850 | ||
| N/A | SAMA7G54-E/4HB | Microchip Technology | CORTEX-A7 MPU, BGA, EXT. TEMP (T | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 343-TFBGA Supplier Device Package: 343-TFBGA (14×14) Grade: Automotive | 1,475 | ||
 | SAMA7G54-V/4HB | Microchip Technology | IC MPU SAMA7G5 1GHZ 343TFBGA | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB 2.0 PHY (3), USB Type-C (2) Voltage – I/O: 3.3V, 5V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 343-TFBGA Supplier Device Package: 343-TFBGA (14×14) Grade: Industrial | 809 | ||
 | SAMA7G54D1G-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Grade: Industrial | 798 | ||
 | SAMA7G54D1GT-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Grade: Industrial | 866 | ||
 | SAMA7G54D2G-I/4UB | Microchip Technology | CORTEX-A7 MPU, 2GBIT DDR3, BGA,I | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.35V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Package / Case: 427-TFBGA Supplier Device Package: 427-TFBGA (21×18) Grade: Industrial | 619 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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