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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | S32G399ASAK1VUCT | NXP Semiconductors | 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,290 | ||
| N/A | S32G399ASBK1VUCT | NXP Semiconductors | 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 1.1GHz, 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,275 | ||
| N/A | S32G399ASCK1VUCR | NXP Semiconductors | 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 19 | ||
| N/A | S32G399ASCK1VUCT | NXP Semiconductors | 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 193 | ||
 | S80C186-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 20MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Grade: Commercial | 356 | ||
 | S80C186EB25 | Intel | IC MPU I186 25MHZ 80QFP | Microprocessors | 80-PQFP (14x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 25MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14×20) Grade: Commercial | 180 | ||
 | S80C188-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 20MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Grade: Commercial | 1,461 | ||
 | S80L186EB16 | Intel | IC MPU I186 16MHZ 80QFP | Microprocessors | 80-PQFP (14x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 16MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14×20) Grade: Commercial | 793 | ||
 | SAM9X60-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial | 1,291 | ||
 | N/A | SAM9X60-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial | 510 | |
 | SAM9X60D1G-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial | 1,716 | ||
 | N/A | SAM9X60D1G-I/LZB | Microchip Technology | IC MPU SAM9X 600MHZ | Microprocessors | - | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Grade: Industrial | 872 | |
 | SAM9X60D1GT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial | 1,602 | ||
 | SAM9X60D5M-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial | 1,444 | ||
 | SAM9X60D5MT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial | 730 | ||
 | SAM9X60D6K-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Grade: Industrial | 664 | ||
 | SAM9X60D6KT-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Grade: Industrial | 1,566 | ||
 | SAM9X60T-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial | 1,257 | ||
 | N/A | SAM9X60T-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial | 590 | |
 | SAM9X70-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,TRAY | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial | 93 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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