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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | S32G378AACK1VUCT | NXP Semiconductors | IC MPU S32G3 1.3GZ/400MHZ 525BGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | 344 | ||
| N/A | N/A | S32G378ASAK1VUCR | NXP Semiconductors | MICROPROCESSORS - MPU 4X CORTEX- | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 603 | |
| N/A | N/A | S32G378ASAK1VUCT | NXP Semiconductors | MICROPROCESSORS - MPU 4X CORTEX- | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 419 | |
| N/A | N/A | S32G378ASCK1VUCR | NXP Semiconductors | 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,095 | |
| N/A | N/A | S32G378ASCK1VUCT | NXP Semiconductors | 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 659 | |
| N/A | N/A | S32G379AACK1VUCR | NXP Semiconductors | 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 97 | |
 | S32G379AACK1VUCT | NXP Semiconductors | IC MPU S32G3 1.3GZ/400MHZ 525BGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | 1,029 | ||
| N/A | N/A | S32G379ASCK1VUCR | NXP Semiconductors | 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,799 | |
| N/A | N/A | S32G379ASCK1VUCT | NXP Semiconductors | 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,358 | |
| N/A | N/A | S32G398AAAK1VUCT | NXP Semiconductors | 3XM7 400MHZ, 8XA53 1GHZ, 525BG | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 36 | |
| N/A | N/A | S32G398AABK1VUCT | NXP Semiconductors | 8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 1.1GHz, 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 508 | |
| N/A | N/A | S32G398AACK1VUCR | NXP Semiconductors | 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 154 | |
 | S32G398AACK1VUCT | NXP Semiconductors | IC MPU S32G3 1.3GZ/400MHZ 525BGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | 250 | ||
| N/A | N/A | S32G398ASAK1VUCT | NXP Semiconductors | 8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,365 | |
| N/A | N/A | S32G398ASCK1VUCR | NXP Semiconductors | 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 615 | |
| N/A | N/A | S32G398ASCK1VUCT | NXP Semiconductors | 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 430 | |
| N/A | N/A | S32G399AAAK1VUCT | NXP Semiconductors | 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 516 | |
| N/A | N/A | S32G399AABK1VUCT | NXP Semiconductors | 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 1.1GHz, 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 977 | |
| N/A | N/A | S32G399AACK1VUCR | NXP Semiconductors | 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 491 | |
 | S32G399AACK1VUCT | NXP Semiconductors | IC MPU S32G3 1.3GZ/400MHZ 525BGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART | 216 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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