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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | RPIXP2800BA | Intel | IC MPU IXP2800 1GHZ 1356FCBGA | Microprocessors | 1356-FCBGA (37.5x37.5) | N/A | -40°C ~ 85°C | Core Processor: Intel® IXP2800 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz RAM Controllers: SRAM Graphics Acceleration: No Display & Interface Controllers: LVDS Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: 3DES, AES, SHA-1 Mounting Type: Surface Mount Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5×37.5) Grade: Industrial | 720 | ||
| N/A | RPIXP2800BB | Intel | IC MPU IXP2800 1.4GHZ 1356FCBGA | Microprocessors | 1356-FCBGA (37.5x37.5) | N/A | -40°C ~ 85°C | Core Processor: Intel® IXP2800 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz RAM Controllers: SRAM Graphics Acceleration: No Display & Interface Controllers: LVDS Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: 3DES, AES, SHA-1 Mounting Type: Surface Mount Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5×37.5) Grade: Industrial | 743 | ||
| N/A | S32G233AABK0CUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 762 | ||
| N/A | S32G233AABK0CUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,024 | ||
| N/A | S32G233AABK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 780 | ||
| N/A | S32G233AABK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 195 | ||
| N/A | S32G233AABK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 267 | ||
| N/A | S32G233AABK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 415 | ||
| N/A | S32G233ASBK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 175 | ||
| N/A | S32G233ASBK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: GbE (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 496 | ||
| N/A | S32G233ASBK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,826 | ||
| N/A | S32G233ASBK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,369 | ||
| N/A | S32G234MABK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: GbE (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 885 | ||
| N/A | S32G234MABK0VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: GbE (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,275 | ||
| N/A | S32G234MABK1VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,276 | ||
| N/A | S32G234MABK1VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 919 | ||
| N/A | S32G234MSBK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: GbE (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 190 | ||
| N/A | S32G234MSBK0VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: GbE (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 1,599 | ||
| N/A | S32G234MSBK1VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 238 | ||
| N/A | S32G234MSBK1VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Qualification: AEC-Q100 Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Grade: Automotive | 787 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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