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Total Products: 357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
R9A07G074M05GBG#AC0RenesasRZ/T2L MPU BGA196 NON-ETHERCAT SMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, SCI, SPI, USB
368
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QUOTE
N/A
R9A07G074M08GBG#AC0RenesasRZ/T2L MPU BGA196 ETHERCAT SECMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, SCI, SPI, USB
386
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QUOTE
N/A
R9A07G075M01GFA#AA0RenesasIC MPU RZ 600/800MHZ 128LFQFPMicroprocessors128-LFQFP (14x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP Exposed Pad
Supplier Device Package:
128-LFQFP (14×20)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
94
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QUOTE
N/A
R9A07G075M01GFP#AA0RenesasIC MPU RZ 600/800MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,795
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QUOTE
N/A
R9A07G075M05GFA#AA0RenesasIC MPU RZ 600/800MHZ 128LFQFPMicroprocessors128-LFQFP (14x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
128-LQFP Exposed Pad
Supplier Device Package:
128-LFQFP (14×20)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
164
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QUOTE
N/A
R9A07G075M05GFP#AA0RenesasIC MPU RZ 600/800MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-LFQFP (24×24)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
666
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QUOTE
N/A
R9A07G075M22GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
339
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QUOTE
N/A
R9A07G075M22GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
439
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QUOTE
N/A
R9A07G075M24GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
863
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QUOTE
R9A07G075M24GBG#AC0
R9A07G075M24GBG#AC0RenesasIC MPU 600MHZ/800MHZ 320LFBGAMicroprocessors320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (17×17)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
151
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QUOTE
N/A
R9A07G075M26GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,004
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QUOTE
N/A
R9A07G075M26GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,142
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QUOTE
N/A
R9A07G075M27GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
879
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QUOTE
N/A
R9A07G075M28GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,252
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QUOTE
N/A
R9A07G075M28GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
120
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N/A
R9A07G084M04GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
717
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QUOTE
R9A07G084M04GBG#AC0
R9A07G084M04GBG#AC0RenesasIC MPU RZ/N2L 300/400MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,226
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QUOTE
N/A
R9A07G084M08GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
757
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QUOTE
N/A
R9A07G084M08GBG#AC0RenesasIC MPU RZ 300/400MHZ 225LFBGAMicroprocessors225-LFBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-LFBGA (13×13)
Additional Interfaces:
CANbus, I2C, SCI, SPI, WDT
1,673
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QUOTE
R9A08G045S11GBG#AC0
R9A08G045S11GBG#AC0RenesasSOC RZ/G3S 13BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
538
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