10,000+ Happy Customers
20+ Years in Business
75,000+ SKUs in Stock
80+ Authorized Manufacturers
Helping Tech Companies Create What’s Next!
phoneCall +1.949.783.7300
Suntsu Electronics Logo - suntsu.com
GET A
QUOTE

Electronic Parts Search

Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

Featured Brands

Part Search

CLEAR SEARCH
Total Products: 357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
R9A07G074M05GBG#AC0RenesasRZ/T2L MPU BGA196 NON-ETHERCAT SMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
919
GET A
QUOTE
N/A
R9A07G074M08GBG#AC0RenesasRZ/T2L MPU BGA196 ETHERCAT SECMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
893
GET A
QUOTE
N/A
R9A07G075M01GFA#AA0RenesasIC MPU RZ 600/800MHZ 128LFQFPMicroprocessors128-LFQFP (14x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP Exposed Pad
Supplier Device Package:
128-LFQFP (14×20)
1,572
GET A
QUOTE
N/A
R9A07G075M01GFP#AA0RenesasIC MPU RZ 600/800MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-LFQFP (24×24)
1,193
GET A
QUOTE
N/A
R9A07G075M05GFA#AA0RenesasIC MPU RZ 600/800MHZ 128LFQFPMicroprocessors128-LFQFP (14x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
128-LQFP Exposed Pad
Supplier Device Package:
128-LFQFP (14×20)
838
GET A
QUOTE
N/A
R9A07G075M05GFP#AA0RenesasIC MPU RZ 600/800MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-LFQFP (24×24)
567
GET A
QUOTE
N/A
R9A07G075M22GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,597
GET A
QUOTE
N/A
R9A07G075M22GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
699
GET A
QUOTE
N/A
R9A07G075M24GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,465
GET A
QUOTE
R9A07G075M24GBG#AC0
R9A07G075M24GBG#AC0RenesasIC MPU 600MHZ/800MHZ 320LFBGAMicroprocessors320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (17×17)
973
GET A
QUOTE
N/A
R9A07G075M26GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
153
GET A
QUOTE
N/A
R9A07G075M26GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
436
GET A
QUOTE
N/A
R9A07G075M27GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
148
GET A
QUOTE
N/A
R9A07G075M28GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
936
GET A
QUOTE
N/A
R9A07G075M28GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
666
GET A
QUOTE
N/A
R9A07G084M04GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
586
GET A
QUOTE
R9A07G084M04GBG#AC0
R9A07G084M04GBG#AC0RenesasIC MPU RZ/N2L 300/400MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,137
GET A
QUOTE
N/A
R9A07G084M08GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
720
GET A
QUOTE
N/A
R9A07G084M08GBG#AC0RenesasIC MPU RZ 300/400MHZ 225LFBGAMicroprocessors225-LFBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-LFBGA (13×13)
803
GET A
QUOTE
R9A08G045S11GBG#AC0
R9A08G045S11GBG#AC0RenesasSOC RZ/G3S 13BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
984
GET A
QUOTE

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


    Global Sourcing Capabilities

    Tap into our global network of suppliers to find the components you need. We simplify procurement, even for hard-to-find parts, saving you time and ensuring smooth production.

    Second Sourcing  Second Sourcing Solutions

    Don’t let supply chain disruptions delay your project. We’ll help you identify alternative components and secure reliable secondary sources to keep your production on track.

    Obsolescence Management  Obsolescence Management

    Outsmart obsolescence and ensure your designs stay in production. We’ll help you navigate component lifecycles, secure long-term supply, and find smart alternatives when parts are discontinued.

    Shortage Mitigation  Shortage Mitigation

    Forget supply chain worries. Our team specializes in navigating the unpredictable component market, leveraging our global network and deep expertise to help you find the necessary components when you need them.

























      I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


      keyboard_arrow_up