| N/A | | 31018-07-3418 | Advanced Micro Devices | IC FPGA | FPGAs | N/A | 4.75 V - 5.25 V | N/A | Number of Logic Elements/Cells: N/A | 1,388 | |
| N/A | | 5962-9957201NNA | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | -55°C – 125°C | Number of Logic Elements/Cells: 6912 | 50 | |
| N/A | | 5962-9957201NUA | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 189 | |
| N/A | | 5962-9957301NUA | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 285 | |
 | | 5962-9957401QXA | Advanced Micro Devices | IC FPGA 404 I/O 28CDIP | FPGAs | 28-CDIP | 2.375 V - 2.625 V | -55°C – 125°C | Number of Logic Elements/Cells: 27648 | 387 | |
 | | 80186/BUC | Advanced Micro Devices | IC MPU 8MHZ 52CLCC | Microprocessors | 52-CLCC (11.43x11.43) | N/A | -55°C ~ 125°C (TC) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Surface Mount Supplier Device Package: 52-CLCC (11.43×11.43) Additional Interfaces: DMA, EBI/EMI | 390 | |
 | | 8086-2/BQA | Advanced Micro Devices | IC MPU 8MHZ 40CDIP | Microprocessors | 40-CDIP | N/A | -55°C ~ 125°C (TC) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Through Hole Package / Case: 40-CDIP (0.600″, 15.24mm) Supplier Device Package: 40-CDIP Additional Interfaces: EBI/EMI | 534 | |
 | | 8088-2/BQA | Advanced Micro Devices | IC MPU 8MHZ 40CDIP | Microprocessors | 40-CDIP | N/A | -55°C ~ 125°C (TC) | Number of Cores/Bus Width: 1 Core, 8-Bit Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Through Hole Package / Case: 40-CDIP (0.600″, 15.24mm) Supplier Device Package: 40-CDIP Additional Interfaces: EBI/EMI | 1,051 | |
 | | 8753H/BQA | Advanced Micro Devices | 8-BIT, UVPROM, 8051 CPU | Microcontrollers | 40-CDIP | 4.5V - 5.5V | -55°C – 125°C | Program Memory Size: 8KB (8K x 8) Mounting Type: Through Hole | 556 | |
| N/A | | A80386DXL-25 | Advanced Micro Devices | IC MPU 25MHZ 132CPGA | Microprocessors | 132-CPGA (37.59x37.59) | N/A | 0°C ~ 100°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Math Engine; 387DX Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Through Hole Supplier Device Package: 132-CPGA (37.59×37.59) | 1,765 | |
| N/A | | A80386DXL-33 | Advanced Micro Devices | IC MPU 33MHZ 132CPGA | Microprocessors | 132-CPGA (37.59x37.59) | N/A | 0°C ~ 100°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Math Engine; 387DX Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Through Hole Supplier Device Package: 132-CPGA (37.59×37.59) | 648 | |
| N/A | | A80386DXL-40 | Advanced Micro Devices | IC MPU 40MHZ 132CPGA | Microprocessors | 132-CPGA (37.59x37.59) | N/A | 0°C ~ 100°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Math Engine; 387DX Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Through Hole Supplier Device Package: 132-CPGA (37.59×37.59) | 1,373 | |
| N/A | | AGXD466AAXD0CD | Advanced Micro Devices | IC MPU 333MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 1,463 | |
| N/A | | AGXD466AAXD0TD | Advanced Micro Devices | IC MPU 333MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 458 | |
| N/A | | AGXD500AAXE0CC | Advanced Micro Devices | IC MPU 366MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 1,466 | |
| N/A | | AGXD500AAXE0CD | Advanced Micro Devices | IC MPU 366MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 320 | |
| N/A | | AGXD500AAXE0TC | Advanced Micro Devices | IC MPU 366MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 243 | |
| N/A | | AGXD500AAXE0TD | Advanced Micro Devices | IC MPU 366MHZ 368EBGA | Microprocessors | 368-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 368-EBGA (35×35) Additional Interfaces: PCI | 1,045 | |
| N/A | | AGXD500EEXE0BC | Advanced Micro Devices | IC MPU 366MHZ 396TEPBGA | Microprocessors | 396-TEPBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 396-TEPBGA (35×35) Additional Interfaces: PCI | 1,588 | |
| N/A | | AGXD533EEXF0BC | Advanced Micro Devices | IC MPU 400MHZ 396TEPBGA | Microprocessors | 396-TEPBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: TFT, VGA Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Supplier Device Package: 396-TEPBGA (35×35) Additional Interfaces: PCI | 507 | |