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Total Products: 13,051
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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KMPC860TCZQ50D4
KMPC860TCZQ50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
716
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KMPC860TVR80D4
KMPC860TVR80D4NXP SemiconductorsIC MPU MPC8XX 80MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
58
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KMPC862PVR100B
KMPC862PVR100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
82
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KMPC866PVR133A
KMPC866PVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
116
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KMPC866TVR133A
KMPC866TVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
380
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KMPC875CVR133
KMPC875CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
312
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KMPC875VR133
KMPC875VR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
1,060
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KMPC885CVR133
KMPC885CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
336
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KMPC885CZP133
KMPC885CZP133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
1,941
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KMPC885VR133
KMPC885VR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
233
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N/A
KW45B41Z52AFPBRNXP SemiconductorsRF MICROCONTROLLERS - MCU K4W1 4RF Transceiver ICs40-HVQFN (6x6)0.9V ~ 2.4V, 1.175V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.4835GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
GPIO, I2C, PWM, SPI, UART
Voltage – Supply:
0.9V ~ 2.4V, 1.175V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
87
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N/A
KW45B41Z52AFPBTNXP SemiconductorsK4W1 40HVQFNRF Transceiver ICs40-HVQFN (6x6)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
1,590
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KW45B41Z52AFTBR
KW45B41Z52AFTBRNXP SemiconductorsK4W1 HVQFN48RF Transceiver ICs48-HVQFN (7x7)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-HVQFN (7×7)
746
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KW45B41Z52AFTBT
KW45B41Z52AFTBTNXP SemiconductorsK4W1 HVQFN48RF Transceiver ICs48-HVQFN (7x7)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-HVQFN (7×7)
812
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QUOTE
N/A
KW45B41Z53AFPBRNXP SemiconductorsRF MICROCONTROLLERS - MCU K4W1 4RF Transceiver ICs40-HVQFN (6x6)0.9V ~ 2.4V, 1.175V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.4835GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
GPIO, I2C, PWM, SPI, UART
Voltage – Supply:
0.9V ~ 2.4V, 1.175V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
994
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QUOTE
N/A
KW45B41Z53AFPBTNXP SemiconductorsK4W1 40HVQFNRF Transceiver ICs40-HVQFN (6x6)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
855
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KW45B41Z53AFTBR
KW45B41Z53AFTBRNXP SemiconductorsK4W1 HVQFN48RF Transceiver ICs48-HVQFN (7x7)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-HVQFN (7×7)
501
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KW45B41Z53AFTBT
KW45B41Z53AFTBTNXP SemiconductorsK4W1 HVQFN48RF Transceiver ICs48-HVQFN (7x7)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
512kB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-HVQFN (7×7)
1,714
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N/A
KW45B41Z82AFPBRNXP SemiconductorsK4W1 HVQFN40RF Transceiver ICs40-HVQFN (6x6)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
1MB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
842
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QUOTE
N/A
KW45B41Z82AFPBTNXP SemiconductorsK4W1 HVQFN40RF Transceiver ICs40-HVQFN (6x6)1.8V ~ 3.6V-40°C ~ 105°C (TA)
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth, General ISM > 1GHz
Protocol:
Bluetooth v5.3
Modulation:
FSK, GFSK, GMSK, MSK
Frequency:
2.36GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power – Output:
10dBm
Sensitivity:
-106dBm
Memory Size:
1MB Flash, 128kB RAM
Serial Interfaces:
I2C, PWM, SPI, UART
Voltage – Supply:
1.8V ~ 3.6V
Current – Receiving:
4.1mA ~ 10.01mA
Current – Transmitting:
4.6mA ~ 22.4mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
40-VFQFN Exposed Pad
Supplier Device Package:
40-HVQFN (6×6)
605
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