KMPC885CZP133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 368 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC885 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (3), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC885CZP133 – IC MPU MPC8XX 133MHZ 357BGA
The KMPC885CZP133 is a single‑core, 32‑bit microprocessor based on the MPC8xx family and Power Architecture technology, operating at 133 MHz. Designed for embedded and communications applications, it combines an integrated communications processor module (CPM), security accelerator, multiple Ethernet controllers and USB to support networked and industrial controller designs.
Backed by NXP Semiconductors hardware specifications and a detailed datasheet, the device targets industrial environments where protocol handling, cryptography and system integration are required in a compact surface‑mount package.
Key Features
- Core and Architecture Single‑issue, 32‑bit MPC8xx core running at 133 MHz with Power Architecture technology, including MMUs and on‑chip instruction and data caches.
- Memory and Bus Integrated DRAM controller with an external bus that supports up to 80 MHz operation (note: 133 MHz core frequency supports 2:1 mode only).
- Communications Co‑processors Built‑in Communications Processor Module (CPM) and Security (SEC) coprocessor to handle protocol offload and cryptography functions.
- Ethernet and USB Multiple Ethernet controllers (three 10 Mbps and two 10/100 Mbps) plus one USB 2.0 interface for versatile network connectivity.
- Serial Protocol Support Additional interfaces include HDLC/SDLC for common serial link protocols used in communications equipment.
- Industrial Qualification and Temperature Range Qualified for industrial use with an operating temperature range of -40°C to 100°C.
- Power and I/O 3.3 V I/O signaling to match common embedded system voltage domains.
- Package and Mounting 357‑ball PBGA package (25×25 mm), surface‑mount for compact board designs.
- Environmental Compliance RoHS compliant for regulatory and manufacturing consistency.
Typical Applications
- Networked Embedded Controllers Use the integrated Ethernet controllers and CPM to implement protocol handling and network interfacing in embedded routers, switches or gateways.
- Industrial Communications Equipment Industrial control and communication modules benefit from the -40°C to 100°C range and integrated HDLC/SDLC and Ethernet support.
- Secure Network Appliances On‑chip SEC cryptography offload supports devices requiring data encryption and secure communications.
- USB‑Enabled Embedded Devices The USB 2.0 interface enables device connectivity and peripheral integration in embedded systems.
Unique Advantages
- Integrated Communications Peripherals: CPM plus multiple Ethernet controllers and HDLC/SDLC interfaces reduce external component count for protocol‑heavy designs.
- On‑chip Security Acceleration: SEC coprocessor provides cryptography capabilities for secure data handling without excessive CPU overhead.
- Industrial‑Grade Operation: Qualified for industrial use with a wide operating temperature range, suitable for demanding environments.
- Compact PBGA Footprint: 357‑ball PBGA (25×25 mm) surface‑mount package enables dense board layouts and space‑constrained designs.
- Engineering Documentation: Supported by detailed hardware specifications covering power, thermal, DC/AC electrical and timing characteristics for system design and validation.
- RoHS Compliant: Meets environmental compliance requirements for modern manufacturing processes.
Why Choose KMPC885CZP133?
The KMPC885CZP133 positions performance and system integration together for embedded communications and industrial controller applications. With a Power Architecture MPC8xx core, on‑chip MMUs and caches, integrated CPM and SEC coprocessors, multiple Ethernet controllers and USB, it enables compact, protocol‑capable designs that minimize external peripherals.
Engineers and procurement teams seeking a documented, industrial‑qualified microprocessor with networking and security peripherals will find the KMPC885CZP133 suitable for designs demanding reliable protocol handling, secure communications and a compact PBGA package. NXP’s hardware specification set provides the necessary electrical, thermal and timing details for system integration.
Request a quote or submit a procurement inquiry to initiate ordering and receive pricing and lead‑time information for the KMPC885CZP133.

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