KMPC860TVR80D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 413 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 80MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of KMPC860TVR80D4 – IC MPU MPC8XX 80MHZ 357BGA
The KMPC860TVR80D4 is a single‑core MPC8xx microprocessor implementing Power Architecture technology with a 32‑bit CPU core running at 80 MHz. It is a highly integrated communications‑oriented controller combining CPU, communications co‑processor (CPM) functionality and a flexible memory controller within a compact 357‑pin PBGA package.
Designed for communications and embedded controller applications, the device targets systems that require integrated Ethernet connectivity, DRAM support and a rich set of serial interfaces while operating from a 3.3 V I/O environment and a 0 °C to 95 °C consumer temperature range.
Key Features
- Processor Core: MPC8xx 32‑bit CPU core, single core at 80 MHz.
- Power and I/O: 3.3 V I/O supply.
- Memory Subsystem: Integrated memory controller with DRAM support; family documentation notes support for high‑performance memories and new DRAM types.
- Caches and MMU: CPU includes memory management units (MMUs) and instruction/data caches to support efficient code and data handling.
- Communications Co‑processor (CPM): On‑chip CPM for communications processing with HDLC/SDLC interfaces and an enhanced I2C channel (per family documentation).
- Ethernet Connectivity: Multiple Ethernet ports – four 10 Mbps ports and one 10/100 Mbps port as specified.
- Peripheral Integration: On‑chip real‑time clock and PCMCIA socket controller support (family features documented for MPC860 series).
- Package and Mounting: 357‑pin PBGA package (25×25 mm), surface mount.
- Environmental & Compliance: RoHS compliant; consumer qualification with operating range 0 °C to 95 °C.
- Graphics: No graphics acceleration.
Typical Applications
- Network Controllers and Gateways: Multi‑port Ethernet support and on‑chip communications resources make the device suitable for routers, switches and gateway controllers.
- Communications Equipment: Integrated CPM and HDLC/SDLC interfaces support protocol handling and serial communications in telecom and data communications modules.
- Embedded Controller Platforms: Single‑chip integration of CPU, memory controller and peripheral controllers supports compact embedded controller designs.
- Expansion and Interface Modules: On‑chip PCMCIA support and DRAM controller capabilities enable modular expansion and memory‑intensive embedded functions.
Unique Advantages
- Integrated Communications Engine: The built‑in CPM and serial interfaces reduce external logic and simplify protocol offload for communications tasks.
- Multi‑port Ethernet Support: Native support for multiple Ethernet ports enables compact multi‑port network devices without extensive external MAC components.
- Flexible Memory Support: DRAM controller and documented support for a range of memory types allow designers to choose memory architectures that meet cost and performance targets.
- On‑chip System Peripherals: Integrated real‑time clock and PCMCIA controller functionality reduce BOM and board complexity for many embedded designs.
- Compact Surface‑Mount Package: 357‑pin PBGA (25×25) offers a high pin count in a compact footprint for space‑constrained systems.
- Standards‑aligned Documentation: Detailed hardware specifications and family documentation provide measurable electrical, timing and thermal guidance for reliable integration.
Why Choose KMPC860TVR80D4?
The KMPC860TVR80D4 positions itself as a compact, communications‑focused microprocessor that combines a Power Architecture 32‑bit core with extensive on‑chip communications and memory control features. Its multi‑Ethernet capability, CPM offload, and DRAM support make it well suited for embedded networking, gateway and controller designs where integration and predictable operation across a consumer temperature range are important.
For design teams seeking a single‑chip solution to reduce board‑level complexity and component count, this MPC860 family device offers documented hardware specifications and integrations that simplify system architecture while supporting a range of memory and peripheral configurations.
Request a quote or submit a purchasing inquiry to receive pricing and availability for KMPC860TVR80D4 and to discuss how it fits your next embedded communications design.

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