KMPC860TCZQ50D4

The KMPC860TCZQ50D4 is an MPC8xx family single‑core 32‑bit microprocessor implementing Power Architecture technology for embedded communications and control applications. It combines an on‑chip CPU with an enhanced communications processor module (CPM) and a flexible memory controller to address networking, industrial controller and communications subsystem designs.

Designed for systems requiring multiple Ethernet interfaces and industrial temperature operation, this device delivers integrated I/O, legacy communications support and a compact 357‑PBGA (25×25) surface‑mount package with 3.3 V I/O.

Key Features

• Core and Architecture – Single 32‑bit MPC8xx core running at 50 MHz, built on Power Architecture technology with on‑chip CPU features described in the MPC860 family documentation.
• Communications Processor (CPM) – Integrated CPM for communications and DSP‑style functions, supporting HDLC/SDLC and other protocol handling.
• Ethernet Connectivity – Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port to support mixed‑speed network topologies.
• Memory and Storage – On‑chip memory controller supporting DRAM types for flexible system memory configurations.
• Power and I/O – 3.3 V I/O signaling simplifies integration with common embedded peripherals.
• Package and Mounting – 357‑PBGA (25×25) package, surface‑mount for compact board layouts.
• Operating Range – Industrial qualification with an operating temperature range of −40°C to 95°C for harsh environments.
• Compliance – RoHS compliant, meeting modern environmental requirements.

Typical Applications

• Networking Equipment – Embedded routers, switches and network controllers that require multiple Ethernet ports and on‑chip communications handling.
• Industrial Controllers – PLCs and automation controllers that need industrial temperature operation and flexible DRAM support.
• Communications Subsystems – Systems leveraging the CPM for protocol offload, HDLC/SDLC interfaces and legacy communications tasks.
• Embedded Control Platforms – Compact, surface‑mount designs where a single‑chip integrated communications controller reduces board count and simplifies design.

Unique Advantages

• Integrated Communications Subsystem: On‑chip CPM and HDLC/SDLC support reduce external components and offload protocol processing from the host CPU.
• Multi‑Ethernet Capability: Four 10 Mbps ports plus one 10/100 Mbps port provide flexibility for mixed‑speed network designs without extra PHYs.
• Industrial Temperature Rating: −40°C to 95°C operation enables deployment in demanding industrial environments.
• Compact PBGA Package: 357‑ball PBGA (25×25) minimizes PCB footprint while supporting high I/O density for complex embedded boards.
• Single‑Voltage I/O: 3.3 V I/O simplifies compatibility with common peripheral devices and reduces power domain complexity.
• RoHS Compliant: Meets environmental regulatory requirements for modern electronic products.

Why Choose KMPC860TCZQ50D4?

The KMPC860TCZQ50D4 positions itself as a highly integrated communications‑oriented microprocessor for embedded systems that require multi‑port Ethernet, protocol offload and robust operation across industrial temperature ranges. Its combination of a Power Architecture MPC8xx core, CPM communications support and a flexible DRAM controller makes it well suited for networking, industrial control and communications subsystems where board space and integration are priorities.

For engineers designing systems that benefit from on‑chip communications peripherals, multiple Ethernet interfaces and a compact PBGA footprint, this device offers a balanced platform backed by the MPC860 PowerQUICC family documentation and specification set.

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