KMPC860PCZQ66D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 324 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of KMPC860PCZQ66D4 – IC MPU MPC8XX 66MHZ 357BGA
The KMPC860PCZQ66D4 is a microprocessor from the MPC860 PowerQUICC family featuring a 32-bit MPC8xx core running at 66 MHz. It is a highly integrated embedded communications controller designed for communications and networking systems, delivering on-board communications processing and multiple networking interfaces.
Built for industrial environments, this device combines a Power Architecture™ based CPU core with a Communications Processor Module (CPM), DRAM controller support and multiple Ethernet interfaces to streamline system design and reduce component count.
Key Features
- Core and Architecture 32-bit MPC8xx core at 66 MHz leveraging Power Architecture™ technology for embedded control and communications tasks.
- Integrated Communications Processing (CPM) On-chip CPM provides dedicated communications handling and DSP-style functions to offload protocol processing.
- Memory Support Integrated DRAM controller to support external memory implementations required by embedded applications.
- Ethernet Interfaces Multiple Ethernet ports: four 10 Mbps ports and one 10/100 Mbps port, enabling a range of networking topologies and connectivity options.
- Serial and HDLC/SDLC Interfaces Additional interfaces include HDLC/SDLC for synchronous serial communications and protocol framing.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 95 °C for reliable operation in harsh environments.
- Power and I/O 3.3 V I/O voltage for compatibility with common embedded system signaling levels.
- Package & Mounting 357-pin PBGA (25 × 25 mm) surface-mount package for compact, high-density board designs.
Typical Applications
- Networking Equipment Use in routers, gateways and network controllers where integrated Ethernet ports and CPM-based communications processing are required.
- Embedded Communications Controllers Ideal for embedded systems that need a combined CPU and communications peripheral set in a single device.
- Industrial Control Systems Suited to industrial controllers and protocol converters that demand an extended operating temperature range and robust I/O.
- Telecommunications Modules Appropriate for telecom interface modules leveraging HDLC/SDLC and multiple Ethernet links for legacy and packet-based services.
Unique Advantages
- Highly integrated communications solution: Combines a 32-bit MPC8xx core with a CPM and peripheral set to reduce BOM and board complexity.
- Multiple Ethernet ports on-chip: Four 10 Mbps and one 10/100 Mbps Ethernet interfaces simplify network connectivity and port density requirements.
- Industrial-temperature operation: −40 °C to 95 °C rating supports deployment in wide-ranging environmental conditions.
- Standard 3.3 V I/O: Ensures compatibility with common embedded logic levels and simplifies power domain design.
- Compact PBGA package: 357-PBGA (25×25 mm) offers a high-pin-count, surface-mount form factor for space-constrained boards.
- Designed for communications and networking: Family-level architecture and features target protocol handling and networked embedded systems.
Why Choose KMPC860PCZQ66D4?
The KMPC860PCZQ66D4 positions itself as an integrated microprocessor solution for embedded communications and networking designs that require on-chip communications processing, multiple Ethernet interfaces, and industrial-grade operation. Its combination of a 32-bit MPC8xx core, CPM, DRAM controller support and robust thermal range makes it suitable for systems that need deterministic protocol handling and reliable field operation.
Engineers targeting compact, networked embedded products will find value in the device’s high integration, standard 3.3 V I/O and PBGA packaging. The MPC860 family heritage and supporting documentation provide a technical foundation for system development and long-term deployment.
Request a quote or submit a purchase inquiry for KMPC860PCZQ66D4 to obtain pricing, availability and delivery information.

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