KMPC860PCZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 324 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN3A001A3Ethernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of KMPC860PCZQ66D4 – IC MPU MPC8XX 66MHZ 357BGA

The KMPC860PCZQ66D4 is a microprocessor from the MPC860 PowerQUICC family featuring a 32-bit MPC8xx core running at 66 MHz. It is a highly integrated embedded communications controller designed for communications and networking systems, delivering on-board communications processing and multiple networking interfaces.

Built for industrial environments, this device combines a Power Architecture™ based CPU core with a Communications Processor Module (CPM), DRAM controller support and multiple Ethernet interfaces to streamline system design and reduce component count.

Key Features

  • Core and Architecture  32-bit MPC8xx core at 66 MHz leveraging Power Architecture™ technology for embedded control and communications tasks.
  • Integrated Communications Processing (CPM)  On-chip CPM provides dedicated communications handling and DSP-style functions to offload protocol processing.
  • Memory Support  Integrated DRAM controller to support external memory implementations required by embedded applications.
  • Ethernet Interfaces  Multiple Ethernet ports: four 10 Mbps ports and one 10/100 Mbps port, enabling a range of networking topologies and connectivity options.
  • Serial and HDLC/SDLC Interfaces  Additional interfaces include HDLC/SDLC for synchronous serial communications and protocol framing.
  • Industrial Qualification & Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 95 °C for reliable operation in harsh environments.
  • Power and I/O  3.3 V I/O voltage for compatibility with common embedded system signaling levels.
  • Package & Mounting  357-pin PBGA (25 × 25 mm) surface-mount package for compact, high-density board designs.

Typical Applications

  • Networking Equipment  Use in routers, gateways and network controllers where integrated Ethernet ports and CPM-based communications processing are required.
  • Embedded Communications Controllers  Ideal for embedded systems that need a combined CPU and communications peripheral set in a single device.
  • Industrial Control Systems  Suited to industrial controllers and protocol converters that demand an extended operating temperature range and robust I/O.
  • Telecommunications Modules  Appropriate for telecom interface modules leveraging HDLC/SDLC and multiple Ethernet links for legacy and packet-based services.

Unique Advantages

  • Highly integrated communications solution: Combines a 32-bit MPC8xx core with a CPM and peripheral set to reduce BOM and board complexity.
  • Multiple Ethernet ports on-chip: Four 10 Mbps and one 10/100 Mbps Ethernet interfaces simplify network connectivity and port density requirements.
  • Industrial-temperature operation: −40 °C to 95 °C rating supports deployment in wide-ranging environmental conditions.
  • Standard 3.3 V I/O: Ensures compatibility with common embedded logic levels and simplifies power domain design.
  • Compact PBGA package: 357-PBGA (25×25 mm) offers a high-pin-count, surface-mount form factor for space-constrained boards.
  • Designed for communications and networking: Family-level architecture and features target protocol handling and networked embedded systems.

Why Choose KMPC860PCZQ66D4?

The KMPC860PCZQ66D4 positions itself as an integrated microprocessor solution for embedded communications and networking designs that require on-chip communications processing, multiple Ethernet interfaces, and industrial-grade operation. Its combination of a 32-bit MPC8xx core, CPM, DRAM controller support and robust thermal range makes it suitable for systems that need deterministic protocol handling and reliable field operation.

Engineers targeting compact, networked embedded products will find value in the device’s high integration, standard 3.3 V I/O and PBGA packaging. The MPC860 family heritage and supporting documentation provide a technical foundation for system development and long-term deployment.

Request a quote or submit a purchase inquiry for KMPC860PCZQ66D4 to obtain pricing, availability and delivery information.

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